JPS51140567A - Method for composing semiconductor devices - Google Patents

Method for composing semiconductor devices

Info

Publication number
JPS51140567A
JPS51140567A JP50064308A JP6430875A JPS51140567A JP S51140567 A JPS51140567 A JP S51140567A JP 50064308 A JP50064308 A JP 50064308A JP 6430875 A JP6430875 A JP 6430875A JP S51140567 A JPS51140567 A JP S51140567A
Authority
JP
Japan
Prior art keywords
semiconductor devices
composing
composing semiconductor
wire
corrosions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50064308A
Other languages
Japanese (ja)
Other versions
JPS5730294B2 (en
Inventor
Kesami Shiokawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50064308A priority Critical patent/JPS51140567A/en
Publication of JPS51140567A publication Critical patent/JPS51140567A/en
Publication of JPS5730294B2 publication Critical patent/JPS5730294B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/05617—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/05624—Aluminium [Al] as principal constituent
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
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    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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    • H01L2224/48599—Principal constituent of the connecting portion of the wire connector being Gold (Au)
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    • H01L2924/01013—Aluminum [Al]
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    • H01L2924/01079—Gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To obtain a highly reliable semiconductor by protecting it from corrosions such as oxidation and the like of Al wiring, when forming the extreme end of a thin metallic wire such as Au wire into a ball.
COPYRIGHT: (C)1976,JPO&Japio
JP50064308A 1975-05-30 1975-05-30 Method for composing semiconductor devices Granted JPS51140567A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50064308A JPS51140567A (en) 1975-05-30 1975-05-30 Method for composing semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50064308A JPS51140567A (en) 1975-05-30 1975-05-30 Method for composing semiconductor devices

Related Child Applications (3)

Application Number Title Priority Date Filing Date
JP56174582A Division JPS57103325A (en) 1981-11-02 1981-11-02 Wire bonding method
JP56174581A Division JPS57103324A (en) 1981-11-02 1981-11-02 Wire bonding device
JP56174583A Division JPS57103323A (en) 1981-11-02 1981-11-02 Assembling method for semiconductor device

Publications (2)

Publication Number Publication Date
JPS51140567A true JPS51140567A (en) 1976-12-03
JPS5730294B2 JPS5730294B2 (en) 1982-06-28

Family

ID=13254470

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50064308A Granted JPS51140567A (en) 1975-05-30 1975-05-30 Method for composing semiconductor devices

Country Status (1)

Country Link
JP (1) JPS51140567A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57103324A (en) * 1981-11-02 1982-06-26 Hitachi Ltd Wire bonding device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57103324A (en) * 1981-11-02 1982-06-26 Hitachi Ltd Wire bonding device

Also Published As

Publication number Publication date
JPS5730294B2 (en) 1982-06-28

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