IT8320382A0 - Saldafili per saldare fili sottili di metallo facilmente ossidabile con vincolo per termocompressori. - Google Patents

Saldafili per saldare fili sottili di metallo facilmente ossidabile con vincolo per termocompressori.

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Publication number
IT8320382A0
IT8320382A0 IT8320382A IT2038283A IT8320382A0 IT 8320382 A0 IT8320382 A0 IT 8320382A0 IT 8320382 A IT8320382 A IT 8320382A IT 2038283 A IT2038283 A IT 2038283A IT 8320382 A0 IT8320382 A0 IT 8320382A0
Authority
IT
Italy
Prior art keywords
wire
compressors
thermo
constraint
welder
Prior art date
Application number
IT8320382A
Other languages
English (en)
Other versions
IT1161808B (it
Inventor
Susumu Okikawa
Original Assignee
Hitachi Ltd
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Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of IT8320382A0 publication Critical patent/IT8320382A0/it
Application granted granted Critical
Publication of IT1161808B publication Critical patent/IT1161808B/it

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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K28/00—Welding or cutting not covered by any of the preceding groups, e.g. electrolytic welding
    • B23K28/02—Combined welding or cutting procedures or apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K9/00—Arc welding or cutting
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Plasma & Fusion (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Arc Welding In General (AREA)
IT2038283A 1982-03-31 1983-03-30 Saldafili per saldare fili sottili di metallo facilmente ossidabile con voncolo per termocompressori IT1161808B (it)

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US4549059A (en) * 1982-11-24 1985-10-22 Nec Corporation Wire bonder with controlled atmosphere
US4732313A (en) * 1984-07-27 1988-03-22 Kabushiki Kaisha Toshiba Apparatus and method for manufacturing semiconductor device
GB2165178A (en) * 1984-10-05 1986-04-09 Hitachi Ltd Method and apparatus for wire bonding
US4705204A (en) * 1985-03-01 1987-11-10 Mitsubishi Denki Kabushiki Kaisha Method of ball forming for wire bonding
FR2586599B1 (fr) * 1985-09-03 1990-01-12 Thomson Csf Dispositif de soudage par thermocompression
US4976393A (en) * 1986-12-26 1990-12-11 Hitachi, Ltd. Semiconductor device and production process thereof, as well as wire bonding device used therefor
US5285949A (en) * 1987-01-26 1994-02-15 Hitachi, Ltd. Wire-bonding method, wire-bonding apparatus, and semiconductor device produced by the wire-bonding method
EP0276928B1 (en) * 1987-01-26 1994-10-26 Hitachi, Ltd. Wire Bonding
US5031821A (en) * 1988-08-19 1991-07-16 Hitachi, Ltd. Semiconductor integrated circuit device, method for producing or assembling same, and producing or assembling apparatus for use in the method
JPH0737889A (ja) * 1993-07-16 1995-02-07 Nec Corp 半導体製造装置
JP3455626B2 (ja) * 1996-03-13 2003-10-14 株式会社東芝 半導体装置の製造方法および製造装置
DE19618320A1 (de) * 1996-04-30 1997-11-13 F&K Delvotec Bondtechnik Gmbh Vorrichtung zum "Ball"-Bonden
JP3407275B2 (ja) 1998-10-28 2003-05-19 インターナショナル・ビジネス・マシーンズ・コーポレーション バンプ及びその形成方法
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FR2524704B1 (fr) 1987-03-06
GB2117299B (en) 1986-05-21
FR2524704A1 (fr) 1983-10-07
JPS58169918A (ja) 1983-10-06
GB8412000D0 (en) 1984-06-13
GB2117299A (en) 1983-10-12
KR840004306A (ko) 1984-10-10
US4564734A (en) 1986-01-14
GB8308622D0 (en) 1983-05-05
KR920005630B1 (ko) 1992-07-10
GB2137914A (en) 1984-10-17
JPH0474859B2 (it) 1992-11-27
IT1161808B (it) 1987-03-18

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