JPS6364053B2 - - Google Patents

Info

Publication number
JPS6364053B2
JPS6364053B2 JP57154402A JP15440282A JPS6364053B2 JP S6364053 B2 JPS6364053 B2 JP S6364053B2 JP 57154402 A JP57154402 A JP 57154402A JP 15440282 A JP15440282 A JP 15440282A JP S6364053 B2 JPS6364053 B2 JP S6364053B2
Authority
JP
Japan
Prior art keywords
conductive
thin metal
wire bonding
wire
metal wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57154402A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5943537A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP57154402A priority Critical patent/JPS5943537A/ja
Publication of JPS5943537A publication Critical patent/JPS5943537A/ja
Publication of JPS6364053B2 publication Critical patent/JPS6364053B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/07502—
    • H10W72/552—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP57154402A 1982-09-02 1982-09-02 ワイヤボンデイング装置 Granted JPS5943537A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57154402A JPS5943537A (ja) 1982-09-02 1982-09-02 ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57154402A JPS5943537A (ja) 1982-09-02 1982-09-02 ワイヤボンデイング装置

Publications (2)

Publication Number Publication Date
JPS5943537A JPS5943537A (ja) 1984-03-10
JPS6364053B2 true JPS6364053B2 (enExample) 1988-12-09

Family

ID=15583357

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57154402A Granted JPS5943537A (ja) 1982-09-02 1982-09-02 ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPS5943537A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62188791A (ja) * 1986-02-15 1987-08-18 Nishimura Watanabe Chiyuushiyutsu Kenkyusho:Kk Ｎｉ，Ｃｏ，Ｚｎ，Ｃｕ，Ｍｎ及びＣｒの電解採取方法
JP2515342Y2 (ja) * 1991-01-28 1996-10-30 ローム株式会社 ボンディングワイヤ用スプール
JP2008078442A (ja) * 2006-09-22 2008-04-03 Kyocera Corp ワイヤボンディング用クランプ部材

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5331713B2 (enExample) * 1974-06-05 1978-09-04
JPS5466770A (en) * 1977-11-08 1979-05-29 Shinkawa Seisakusho Kk Device for bonding wires
JPS567442A (en) * 1979-06-29 1981-01-26 Hitachi Ltd Wire bonding device
JPS5639183A (en) * 1979-09-08 1981-04-14 Nec Corp Wire bonding unit
JPS576236U (enExample) * 1980-06-11 1982-01-13

Also Published As

Publication number Publication date
JPS5943537A (ja) 1984-03-10

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