JPH0412899B2 - - Google Patents
Info
- Publication number
- JPH0412899B2 JPH0412899B2 JP62040691A JP4069187A JPH0412899B2 JP H0412899 B2 JPH0412899 B2 JP H0412899B2 JP 62040691 A JP62040691 A JP 62040691A JP 4069187 A JP4069187 A JP 4069187A JP H0412899 B2 JPH0412899 B2 JP H0412899B2
- Authority
- JP
- Japan
- Prior art keywords
- prepreg
- laminate
- glass cloth
- thickness
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011521 glass Substances 0.000 claims description 19
- 239000004744 fabric Substances 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 13
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 2
- 239000002966 varnish Substances 0.000 description 4
- 239000002759 woven fabric Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Reinforced Plastic Materials (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4069187A JPS63207830A (ja) | 1987-02-24 | 1987-02-24 | 積層板の製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4069187A JPS63207830A (ja) | 1987-02-24 | 1987-02-24 | 積層板の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63207830A JPS63207830A (ja) | 1988-08-29 |
| JPH0412899B2 true JPH0412899B2 (US07534539-20090519-C00280.png) | 1992-03-06 |
Family
ID=12587578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4069187A Granted JPS63207830A (ja) | 1987-02-24 | 1987-02-24 | 積層板の製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63207830A (US07534539-20090519-C00280.png) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5521204A (en) * | 1978-08-01 | 1980-02-15 | Sumitomo Bakelite Co | Thermal hardening resin laminated structure and its preparation |
| JPS59109563A (ja) * | 1982-12-15 | 1984-06-25 | Hitachi Chem Co Ltd | エポキシ樹脂プリプレグ製造用含浸ワニス |
| JPS60203641A (ja) * | 1984-03-28 | 1985-10-15 | Shin Kobe Electric Mach Co Ltd | コンポジツト積層板の製造法 |
| JPS6131243A (ja) * | 1984-07-23 | 1986-02-13 | 三菱瓦斯化学株式会社 | エポキシ樹脂積層板の製法 |
| JPS6183234A (ja) * | 1984-09-28 | 1986-04-26 | Hitachi Chem Co Ltd | エポキシ樹脂積層板の製造法 |
| JPS61137736A (ja) * | 1984-12-10 | 1986-06-25 | 松下電工株式会社 | 積層板及びその製造方法 |
-
1987
- 1987-02-24 JP JP4069187A patent/JPS63207830A/ja active Granted
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5521204A (en) * | 1978-08-01 | 1980-02-15 | Sumitomo Bakelite Co | Thermal hardening resin laminated structure and its preparation |
| JPS59109563A (ja) * | 1982-12-15 | 1984-06-25 | Hitachi Chem Co Ltd | エポキシ樹脂プリプレグ製造用含浸ワニス |
| JPS60203641A (ja) * | 1984-03-28 | 1985-10-15 | Shin Kobe Electric Mach Co Ltd | コンポジツト積層板の製造法 |
| JPS6131243A (ja) * | 1984-07-23 | 1986-02-13 | 三菱瓦斯化学株式会社 | エポキシ樹脂積層板の製法 |
| JPS6183234A (ja) * | 1984-09-28 | 1986-04-26 | Hitachi Chem Co Ltd | エポキシ樹脂積層板の製造法 |
| JPS61137736A (ja) * | 1984-12-10 | 1986-06-25 | 松下電工株式会社 | 積層板及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63207830A (ja) | 1988-08-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0412899B2 (US07534539-20090519-C00280.png) | ||
| JPH02133440A (ja) | 電気用積層板の製造方法 | |
| JPS6040215A (ja) | プリプレグの製法 | |
| JPH02133439A (ja) | 電気用積層板の製造方法 | |
| JPH0771839B2 (ja) | 積層板の製造方法 | |
| JPS5941262A (ja) | 電気用積層板の製法 | |
| JPH0257018B2 (US07534539-20090519-C00280.png) | ||
| JPH04223113A (ja) | 積層板の製造方法 | |
| JPS60190345A (ja) | 電気用積層板 | |
| JPS62151335A (ja) | 積層板の製造方法 | |
| JPS62292428A (ja) | 銅張積層板 | |
| JPS59149095A (ja) | 多層板の製造法 | |
| JPH05111916A (ja) | 積層板の製造方法 | |
| JPH02258337A (ja) | 印刷回路用積層板の製造方法 | |
| JPS5939546A (ja) | 銅張積層板 | |
| JPS5985751A (ja) | 銅張積層板 | |
| JPS5989495A (ja) | 多層板の製造法 | |
| JPS59191732A (ja) | 紙基材積層板の製造法 | |
| JPS634935A (ja) | 多層回路板の製造方法 | |
| JPH0360863B2 (US07534539-20090519-C00280.png) | ||
| JPH02120009A (ja) | 積層板の製造方法 | |
| JPH0688282B2 (ja) | 多層プリント配線板の製造方法 | |
| JPH0757494B2 (ja) | 積層板の製造法 | |
| JPH048515A (ja) | 積層板の製造方法 | |
| JPS6135950A (ja) | 積層板用樹脂含浸基材の製造法 |
