JPH0370385B2 - - Google Patents
Info
- Publication number
- JPH0370385B2 JPH0370385B2 JP56093763A JP9376381A JPH0370385B2 JP H0370385 B2 JPH0370385 B2 JP H0370385B2 JP 56093763 A JP56093763 A JP 56093763A JP 9376381 A JP9376381 A JP 9376381A JP H0370385 B2 JPH0370385 B2 JP H0370385B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- etching
- region
- oxide film
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/01—Manufacture or treatment
- H10W10/011—Manufacture or treatment of isolation regions comprising dielectric materials
- H10W10/014—Manufacture or treatment of isolation regions comprising dielectric materials using trench refilling with dielectric materials, e.g. shallow trench isolations
- H10W10/0148—Manufacture or treatment of isolation regions comprising dielectric materials using trench refilling with dielectric materials, e.g. shallow trench isolations comprising introducing impurities in side walls or bottom walls of trenches, e.g. for forming channel stoppers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/10—Isolation regions comprising dielectric materials
- H10W10/17—Isolation regions comprising dielectric materials formed using trench refilling with dielectric materials, e.g. shallow trench isolations
Landscapes
- Element Separation (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56093763A JPS57210671A (en) | 1981-06-19 | 1981-06-19 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56093763A JPS57210671A (en) | 1981-06-19 | 1981-06-19 | Manufacture of semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57210671A JPS57210671A (en) | 1982-12-24 |
| JPH0370385B2 true JPH0370385B2 (enExample) | 1991-11-07 |
Family
ID=14091464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56093763A Granted JPS57210671A (en) | 1981-06-19 | 1981-06-19 | Manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57210671A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59178773A (ja) * | 1983-03-30 | 1984-10-11 | Toshiba Corp | 半導体装置の製造方法 |
-
1981
- 1981-06-19 JP JP56093763A patent/JPS57210671A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57210671A (en) | 1982-12-24 |
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