JPH0550138B2 - - Google Patents

Info

Publication number
JPH0550138B2
JPH0550138B2 JP58225718A JP22571883A JPH0550138B2 JP H0550138 B2 JPH0550138 B2 JP H0550138B2 JP 58225718 A JP58225718 A JP 58225718A JP 22571883 A JP22571883 A JP 22571883A JP H0550138 B2 JPH0550138 B2 JP H0550138B2
Authority
JP
Japan
Prior art keywords
film
spacer
insulating film
etching
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58225718A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60117753A (ja
Inventor
Yasushi Sakui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP58225718A priority Critical patent/JPS60117753A/ja
Publication of JPS60117753A publication Critical patent/JPS60117753A/ja
Publication of JPH0550138B2 publication Critical patent/JPH0550138B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W10/0143—
    • H10W10/17—

Landscapes

  • Drying Of Semiconductors (AREA)
  • Element Separation (AREA)
JP58225718A 1983-11-30 1983-11-30 半導体装置の製造方法 Granted JPS60117753A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58225718A JPS60117753A (ja) 1983-11-30 1983-11-30 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58225718A JPS60117753A (ja) 1983-11-30 1983-11-30 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS60117753A JPS60117753A (ja) 1985-06-25
JPH0550138B2 true JPH0550138B2 (enExample) 1993-07-28

Family

ID=16833720

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58225718A Granted JPS60117753A (ja) 1983-11-30 1983-11-30 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS60117753A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4876216A (en) * 1988-03-07 1989-10-24 Applied Micro Circuits Corporation Semiconductor integrated circuit manufacturing process providing oxide-filled trench isolation of circuit devices
IT1236728B (it) * 1989-10-24 1993-03-31 Sgs Thomson Microelectronics Procedimento per formare la struttura di isolamento e la struttura di gate di dispositivi integrati
US5077234A (en) * 1990-06-29 1991-12-31 Digital Equipment Corporation Planarization process utilizing three resist layers

Also Published As

Publication number Publication date
JPS60117753A (ja) 1985-06-25

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