JPH0366814B2 - - Google Patents

Info

Publication number
JPH0366814B2
JPH0366814B2 JP61037859A JP3785986A JPH0366814B2 JP H0366814 B2 JPH0366814 B2 JP H0366814B2 JP 61037859 A JP61037859 A JP 61037859A JP 3785986 A JP3785986 A JP 3785986A JP H0366814 B2 JPH0366814 B2 JP H0366814B2
Authority
JP
Japan
Prior art keywords
inner lead
coining
tip
lead
wire bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61037859A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62195164A (ja
Inventor
Kenji Iinuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP61037859A priority Critical patent/JPS62195164A/ja
Priority to KR1019870000109A priority patent/KR900003873B1/ko
Publication of JPS62195164A publication Critical patent/JPS62195164A/ja
Publication of JPH0366814B2 publication Critical patent/JPH0366814B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/041—
    • H10W72/00—
    • H10W72/50—
    • H10W72/07551—
    • H10W72/5363—
    • H10W90/756—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
JP61037859A 1986-02-21 1986-02-21 リードフレームの製造方法 Granted JPS62195164A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP61037859A JPS62195164A (ja) 1986-02-21 1986-02-21 リードフレームの製造方法
KR1019870000109A KR900003873B1 (ko) 1986-02-21 1987-01-09 리드 프레임

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61037859A JPS62195164A (ja) 1986-02-21 1986-02-21 リードフレームの製造方法

Publications (2)

Publication Number Publication Date
JPS62195164A JPS62195164A (ja) 1987-08-27
JPH0366814B2 true JPH0366814B2 (enExample) 1991-10-18

Family

ID=12509274

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61037859A Granted JPS62195164A (ja) 1986-02-21 1986-02-21 リードフレームの製造方法

Country Status (2)

Country Link
JP (1) JPS62195164A (enExample)
KR (1) KR900003873B1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0729836U (ja) * 1993-11-10 1995-06-02 サンケン電気株式会社 半導体装置
KR950015736A (ko) * 1993-11-20 1995-06-17 김광호 반도체 장치용 리드프레임

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57210651A (en) * 1981-06-19 1982-12-24 Toshiba Corp Lead frame and manufacture thereof

Also Published As

Publication number Publication date
KR900003873B1 (ko) 1990-06-02
KR870008385A (ko) 1987-09-26
JPS62195164A (ja) 1987-08-27

Similar Documents

Publication Publication Date Title
JPH06204371A (ja) 合成樹脂封止型電子部品及びそのリード端子の曲げ加工方法
JPH0645409A (ja) ワイヤーボンディング方法及びその装置
JPH0366814B2 (enExample)
JPH04294552A (ja) ワイヤーボンディング方法
JP3384762B2 (ja) 半導体装置の製造方法
JPH0794556A (ja) ワイヤボンデイング方法
JPH04287939A (ja) ボンディング・ツール
US5294828A (en) Plate for supporting a punched leadframe
JP2532304B2 (ja) 半導体チップと、これが搭載される基板との間のワイヤボンディング構造
JP2001185671A (ja) 半導体装置の製造方法及び該半導体装置の製造に用いられるリードフレームの製造方法
JP2665061B2 (ja) ワイヤーボンディング方法
JP2808809B2 (ja) ワイヤボンディング方法
JPS6379331A (ja) ワイヤボンデイング装置
JP3293757B2 (ja) 半導体装置製造用リードフレーム組立体の製造方法
JP2846095B2 (ja) 半導体装置の製造方法
JPH0695519B2 (ja) バンプ形成方法
JP3202193B2 (ja) ワイヤボンディング方法
JP2524364B2 (ja) ワイヤボンディング装置
KR0127359Y1 (ko) 반도체 제조용 리드 프레임
KR100190923B1 (ko) 내부리드의 안정화를 위한 히트블록
KR200198124Y1 (ko) 와이어본딩 장치
JPH0590320A (ja) ボール式ワイヤーボンデイング方法
KR100721274B1 (ko) 반도체 칩 조립체의 형성 방법
JPH10199913A (ja) ワイヤボンディング方法
JPH09312373A (ja) リードフレームのインナーリード先端構造及びその加工方法

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees