JPH0332212B2 - - Google Patents
Info
- Publication number
- JPH0332212B2 JPH0332212B2 JP56159812A JP15981281A JPH0332212B2 JP H0332212 B2 JPH0332212 B2 JP H0332212B2 JP 56159812 A JP56159812 A JP 56159812A JP 15981281 A JP15981281 A JP 15981281A JP H0332212 B2 JPH0332212 B2 JP H0332212B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- disk
- wax
- mirror
- parallel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 claims description 7
- 235000012431 wafers Nutrition 0.000 description 51
- 238000003672 processing method Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15981281A JPS5860541A (ja) | 1981-10-07 | 1981-10-07 | ウエハの加工方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15981281A JPS5860541A (ja) | 1981-10-07 | 1981-10-07 | ウエハの加工方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5860541A JPS5860541A (ja) | 1983-04-11 |
JPH0332212B2 true JPH0332212B2 (fr) | 1991-05-10 |
Family
ID=15701785
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15981281A Granted JPS5860541A (ja) | 1981-10-07 | 1981-10-07 | ウエハの加工方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5860541A (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2534210B2 (ja) * | 1989-04-03 | 1996-09-11 | 三菱電機株式会社 | ウエハ剥し装置 |
JP2011025338A (ja) * | 2009-07-23 | 2011-02-10 | Disco Abrasive Syst Ltd | 板状物固定方法 |
JP2012049448A (ja) * | 2010-08-30 | 2012-03-08 | Mitsubishi Chemicals Corp | 窒化物半導体基板の製造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56164535A (en) * | 1980-05-23 | 1981-12-17 | Toshiba Corp | Manufacture of semicondutor element |
JPS57147241A (en) * | 1981-03-05 | 1982-09-11 | Nec Corp | Bonding method for crystal wafer |
-
1981
- 1981-10-07 JP JP15981281A patent/JPS5860541A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56164535A (en) * | 1980-05-23 | 1981-12-17 | Toshiba Corp | Manufacture of semicondutor element |
JPS57147241A (en) * | 1981-03-05 | 1982-09-11 | Nec Corp | Bonding method for crystal wafer |
Also Published As
Publication number | Publication date |
---|---|
JPS5860541A (ja) | 1983-04-11 |
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