JPH0330992B2 - - Google Patents
Info
- Publication number
- JPH0330992B2 JPH0330992B2 JP60026291A JP2629185A JPH0330992B2 JP H0330992 B2 JPH0330992 B2 JP H0330992B2 JP 60026291 A JP60026291 A JP 60026291A JP 2629185 A JP2629185 A JP 2629185A JP H0330992 B2 JPH0330992 B2 JP H0330992B2
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- film
- formula
- polyimide
- inorganic insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Local Oxidation Of Silicon (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2629185A JPS61187346A (ja) | 1985-02-15 | 1985-02-15 | 絶縁膜構造および半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2629185A JPS61187346A (ja) | 1985-02-15 | 1985-02-15 | 絶縁膜構造および半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61187346A JPS61187346A (ja) | 1986-08-21 |
| JPH0330992B2 true JPH0330992B2 (enrdf_load_stackoverflow) | 1991-05-01 |
Family
ID=12189200
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2629185A Granted JPS61187346A (ja) | 1985-02-15 | 1985-02-15 | 絶縁膜構造および半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61187346A (enrdf_load_stackoverflow) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4855252A (en) * | 1988-08-22 | 1989-08-08 | International Business Machines Corporation | Process for making self-aligned contacts |
| JP2868167B2 (ja) * | 1991-08-05 | 1999-03-10 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 多重レベル高密度相互接続構造体及び高密度相互接続構造体 |
| JPH08153719A (ja) * | 1994-11-29 | 1996-06-11 | Yazaki Corp | 半導体装置 |
| US6646347B2 (en) * | 2001-11-30 | 2003-11-11 | Motorola, Inc. | Semiconductor power device and method of formation |
| US7098544B2 (en) * | 2004-01-06 | 2006-08-29 | International Business Machines Corporation | Edge seal for integrated circuit chips |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5285474A (en) * | 1976-01-09 | 1977-07-15 | Hitachi Ltd | Semiconductor device |
| JPS55133438A (en) * | 1979-04-02 | 1980-10-17 | Nitto Funka Kogyo Kk | Polyolefin resin composition |
-
1985
- 1985-02-15 JP JP2629185A patent/JPS61187346A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61187346A (ja) | 1986-08-21 |
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