JPH0312567B2 - - Google Patents

Info

Publication number
JPH0312567B2
JPH0312567B2 JP58182528A JP18252883A JPH0312567B2 JP H0312567 B2 JPH0312567 B2 JP H0312567B2 JP 58182528 A JP58182528 A JP 58182528A JP 18252883 A JP18252883 A JP 18252883A JP H0312567 B2 JPH0312567 B2 JP H0312567B2
Authority
JP
Japan
Prior art keywords
curing agent
latent curing
group
amino group
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58182528A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6072917A (ja
Inventor
Takeshi Hirose
Nobuo Ito
Kyomiki Hirai
Koji Takeuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
Original Assignee
Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Priority to JP58182528A priority Critical patent/JPS6072917A/ja
Priority to US06/654,470 priority patent/US4546155A/en
Priority to EP84306576A priority patent/EP0138465A3/en
Publication of JPS6072917A publication Critical patent/JPS6072917A/ja
Publication of JPH0312567B2 publication Critical patent/JPH0312567B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4284—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with other curing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP58182528A 1983-09-30 1983-09-30 エポキシ樹脂用潜在性硬化剤 Granted JPS6072917A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP58182528A JPS6072917A (ja) 1983-09-30 1983-09-30 エポキシ樹脂用潜在性硬化剤
US06/654,470 US4546155A (en) 1983-09-30 1984-09-26 Latent curing agents for epoxy resins
EP84306576A EP0138465A3 (en) 1983-09-30 1984-09-27 Latent curing agents for epoxy resins

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58182528A JPS6072917A (ja) 1983-09-30 1983-09-30 エポキシ樹脂用潜在性硬化剤

Publications (2)

Publication Number Publication Date
JPS6072917A JPS6072917A (ja) 1985-04-25
JPH0312567B2 true JPH0312567B2 (esLanguage) 1991-02-20

Family

ID=16119879

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58182528A Granted JPS6072917A (ja) 1983-09-30 1983-09-30 エポキシ樹脂用潜在性硬化剤

Country Status (3)

Country Link
US (1) US4546155A (esLanguage)
EP (1) EP0138465A3 (esLanguage)
JP (1) JPS6072917A (esLanguage)

Families Citing this family (68)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR900000190B1 (ko) * 1984-11-16 1990-01-23 미쓰비시전기 주식회사 에폭시수지 조성물
US4689388A (en) * 1985-01-24 1987-08-25 Ajinomoto Co., Inc. One pack type alicyclic epoxy resin compositions
JPS61185528A (ja) * 1985-02-12 1986-08-19 Mitsubishi Electric Corp エポキシ樹脂組成物
JPH0613600B2 (ja) * 1986-05-14 1994-02-23 旭電化工業株式会社 硬化性エポキシ樹脂組成物
JPS63183920A (ja) * 1987-01-27 1988-07-29 Somar Corp 液状エポキシ樹脂組成物およびその製造方法
JPS6436672A (en) * 1987-07-31 1989-02-07 Somar Corp Epoxy polymer composition for bonding chip part
IE891601L (en) * 1989-05-18 1990-11-18 Loctite Ireland Ltd Latent hardeners for epoxy resin compositions
US5201248A (en) * 1989-09-19 1993-04-13 Sumitomo Bakelite Company Limited Materials for balancing rotators and method for balancing rotators
WO1991019674A1 (en) * 1990-06-13 1991-12-26 Ppg Industries, Inc. Polymers of high refractive index and high heat distortion temperature
DE4206733C2 (de) * 1992-03-04 1998-09-03 Bakelite Ag Gießharz und seine Verwendung zur Herstellung von Elektrovergußmassen
US5928839A (en) * 1992-05-15 1999-07-27 Morton International, Inc. Method of forming a multilayer printed circuit board and product thereof
DE69318369T2 (de) * 1992-10-22 1999-01-28 Ajinomoto Co., Inc., Tokio/Tokyo Polythiol-Epoxidharz-Mischung mit längerer Verarbeitungszeit
US6255367B1 (en) 1995-03-07 2001-07-03 Landec Corporation Polymeric modifying agents
US6831116B2 (en) 1995-03-07 2004-12-14 Landec Corporation Polymeric modifying agents
US6653371B1 (en) * 1998-01-16 2003-11-25 Barry E. Burns One-part curable composition of polyepoxide, polythiol, latent hardener and solid organic acid
CA2269378C (en) 1998-04-17 2008-04-01 Ajinomoto Co., Inc. Curable resin composition
ZA991856B (en) 1998-08-27 1999-09-22 Henkel Corp Storage-stable compositions useful for the production of structural foams.
US6103784A (en) * 1998-08-27 2000-08-15 Henkel Corporation Corrosion resistant structural foam
US6376564B1 (en) 1998-08-27 2002-04-23 Henkel Corporation Storage-stable compositions useful for the production of structural foams
US6342545B1 (en) 1998-11-23 2002-01-29 Loctite Corporation Radical-curable adhesive compositions, reaction products of which demonstrate superior resistance to thermal degradation
US6150479A (en) * 1998-11-23 2000-11-21 Loctite Corporation Radical-curable adhesive compositions, reaction products of which demonstrate superior resistance to thermal degradation
US6451948B1 (en) 1999-08-19 2002-09-17 Loctite Corporation Radical-curable adhesive compositions, reaction products of which demonstrate superior resistance to thermal degradation
USH2047H1 (en) 1999-11-10 2002-09-03 Henkel Corporation Reinforcement laminate
US6872762B2 (en) * 2000-07-13 2005-03-29 Loctite (R&D) Limited Epoxy resin composition with solid organic acid
US20030018095A1 (en) * 2001-04-27 2003-01-23 Agarwal Rajat K. Thermosettable compositions useful for producing structural adhesive foams
JP4491236B2 (ja) 2001-12-21 2010-06-30 ヘンケル・テロソン・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツング 熱可塑性ポリマーで変性した膨張性エポキシ樹脂系システム
US20030164555A1 (en) * 2002-03-01 2003-09-04 Tong Quinn K. B-stageable underfill encapsulant and method for its application
EP1506975A1 (en) 2003-08-13 2005-02-16 Vantico GmbH Nanocomposites based on polyurethane or polyurethane-epoxy hybrid resins prepared avoiding isocyanates
CN101500580B (zh) * 2006-05-22 2011-12-07 纽约大学 具有增强的Th-1模式的C-糖脂
US8288447B2 (en) * 2006-06-07 2012-10-16 Henkel Ag & Co. Kgaa Foamable compositions based on epoxy resins and polyesters
DE602007012446D1 (de) * 2006-09-20 2011-03-24 Cemedine Henkel Co Ltd Feste expandierbare zusammensetzungen
CN103189412A (zh) 2010-11-05 2013-07-03 汉高爱尔兰有限公司 具有改善的稳定性的环氧-硫醇组合物
KR20140017509A (ko) * 2010-12-24 2014-02-11 가부시끼가이샤 쓰리본드 혐기 경화성 조성물
US8415470B2 (en) 2011-06-24 2013-04-09 E I Du Pont De Nemours And Company Di-isoimide composition
US8663804B2 (en) 2011-06-24 2014-03-04 E I Du Pont De Nemours And Company Printed wiring board encapsulated by adhesive laminate comprising a di-isoimide, and process for preparing same
US8580386B2 (en) 2011-06-24 2013-11-12 E I Du Pont De Nemours And Company Laminate comprising curable epoxy film layer comprising a di-isoimide and process for preparing same
US8536170B2 (en) 2011-06-24 2013-09-17 E I Du Pont De Nemours And Company Curable composition comprising a di-isoimide, method of curing, and the cured composition so formed
US8586734B2 (en) 2011-06-24 2013-11-19 E I Du Pont De Nemours And Company Process for preparing substituted and unsubstituted diamino triazine aromatic di-isoimides
US9080007B2 (en) * 2013-02-28 2015-07-14 Air Products And Chemicals, Inc. Anhydride accelerators for epoxy resin systems
US11059967B2 (en) 2016-12-13 2021-07-13 3M Innovative Properties Company Epoxy stabilization using acid-coated nitrogen containing catalysts, particles, and methods
EP3555170B1 (en) 2016-12-13 2021-05-05 3M Innovative Properties Company Epoxy stabilization using substituted barbituric acids
EP3583151B1 (en) 2017-02-15 2021-06-09 3M Innovative Properties Company Epoxy stabilization using metal nanoparticles and nitrogen-containing catalysts, and methods
JP7190453B2 (ja) 2017-06-12 2022-12-15 スリーエム イノベイティブ プロパティズ カンパニー 伸縮性導体
JP2020523450A (ja) 2017-06-12 2020-08-06 スリーエム イノベイティブ プロパティズ カンパニー エポキシ／チオール樹脂組成物、方法、及びテープ
WO2019053646A1 (en) 2017-09-15 2019-03-21 3M Innovative Properties Company ADHESIVE FILM COMPRISING A (METH) ACRYLATE MATRIX COMPRISING A CURABLE EPOXY / THIOL RESIN COMPOSITION, RIBBON AND METHOD
EP3781634A1 (en) 2018-04-20 2021-02-24 3M Innovative Properties Company Tapes with elastomeric backing layers
EP3781635A1 (en) 2018-04-20 2021-02-24 3M Innovative Properties Company Method of applying an hvof-resistant tape
CN112739738A (zh) 2018-09-25 2021-04-30 3M创新有限公司 包含含脲二酮的材料和可热活化的胺的聚合物材料、两部分组合物以及方法
US20210324250A1 (en) 2018-09-25 2021-10-21 3M Innovative Properties Company One-part thermally curable composition
KR20210062052A (ko) 2018-09-28 2021-05-28 쓰리엠 이노베이티브 프로퍼티즈 컴파니 접착 조인트를 갖는 관형 요소들, 그의 관형 요소들의 결합 방법
CN109627426B (zh) * 2018-11-22 2020-11-10 烟台德邦科技有限公司 一种环氧潜伏性固化剂的制备方法
JP7198644B2 (ja) 2018-11-27 2023-01-04 住友化学株式会社 エポキシ樹脂組成物及びその硬化物
DE102019212592A1 (de) * 2019-08-22 2021-02-25 Tesa Se Verfahren zum Ummanteln von langgestrecktem Gut, insbesondere Leitungen
DE102019212589A1 (de) * 2019-08-22 2021-02-25 Tesa Se Verfahren zum Ummanteln von langgestrecktem Gut, insbesondere Leitungen
CA3163340A1 (en) 2019-12-10 2021-06-17 Huntsman Advanced Materials Americas Llc Curable resin compositions containing an aliphatic polyketone toughener and composites made therefrom
EP3835383B1 (en) 2019-12-13 2023-04-12 Henkel AG & Co. KGaA One component (1k) curable adhesive composition
CN111138636A (zh) * 2019-12-31 2020-05-12 浙江华正新材料股份有限公司 一种树脂组合物、预浸料及层压板
WO2021241286A1 (ja) 2020-05-27 2021-12-02 住友化学株式会社 エポキシ樹脂組成物及びその硬化物
ES2974455T3 (es) 2020-11-16 2024-06-27 Henkel Ag & Co Kgaa Composición epoxi que comprende un compuesto epoxi de origen biológico
JP2022175617A (ja) 2021-05-14 2022-11-25 住友化学株式会社 エポキシ樹脂組成物及びその硬化物
US20240336725A1 (en) 2021-07-30 2024-10-10 3M Innovative Properties Company Curable, one-part, dual-stage thiol-ene-epoxy liquid adhesives and methods
US20250215286A1 (en) 2022-05-16 2025-07-03 3M Innovative Properties Company Adhesion modifier composition, and curable composition and method of bonding including the same
EP4332144B1 (en) 2022-09-05 2025-06-04 Henkel AG & Co. KGaA One component (1k) curable adhesive composition
EP4474440A1 (en) 2023-06-06 2024-12-11 Henkel AG & Co. KGaA Debondable adhesive tape
EP4481913A1 (en) 2023-06-20 2024-12-25 Henkel AG & Co. KGaA Electronics assembly having electrochemically debondable components
EP4566808A1 (en) 2023-12-06 2025-06-11 Henkel AG & Co. KGaA Bonded structure comprising an electrochemically debondable adhesive
EP4658700A1 (en) 2024-02-19 2025-12-10 Chemence, Inc Adhesive formulation
EP4663713A1 (en) 2024-06-13 2025-12-17 Henkel AG & Co. KGaA Bonded structure comprising an thermally debondable adhesive film

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1124799A (en) * 1965-12-02 1968-08-21 Ciba Ltd Epoxide resin compositions
US4066625A (en) * 1967-05-02 1978-01-03 Amicon Corporation Unitary curable resin compositions
JPS52125600A (en) * 1976-04-14 1977-10-21 Hitachi Ltd Curing catalysts for epoxy resins
DE3067416D1 (en) * 1979-05-08 1984-05-17 Ciba Geigy Ag Curable epoxy resin mixtures and curing accelerators therefore
CA1151182A (en) * 1979-08-10 1983-08-02 Marvin L. Kaufman Chemically modified imidazole curing catalysts for epoxy resins and powder coatings containing them
AT362846B (de) * 1979-12-17 1981-06-25 Vianova Kunstharz Ag Verfahren zur herstellung kathodisch abscheidbarer bindemittel
US4268656A (en) * 1980-01-16 1981-05-19 National Starch And Chemical Corporation Co-curing agents for epoxy resins
US4339369A (en) * 1981-04-23 1982-07-13 Celanese Corporation Cationic epoxide-amine reaction products
JPS58112232A (ja) * 1981-12-26 1983-07-04 Fujitsu Ltd 電子線照射装置
DE3382736T2 (de) * 1982-09-21 1994-05-26 Ajinomoto Kk Latente Härter für Epoxyharze.
DE3300583A1 (de) * 1983-01-10 1984-07-12 Basf Farben + Fasern Ag, 2000 Hamburg Wasserdispergierbare bindemittel fuer kationische elektrotauchlacke und verfahren zu ihrer herstellung

Also Published As

Publication number Publication date
JPS6072917A (ja) 1985-04-25
EP0138465A2 (en) 1985-04-24
US4546155A (en) 1985-10-08
EP0138465A3 (en) 1986-08-20

Similar Documents

Publication Publication Date Title
JPH0312567B2 (esLanguage)
US4542202A (en) Latent curing agents for epoxy resins
EP0659793B1 (en) One component epoxy resin compositions containing modified epoxy-amine adducts as curing agents
JP3391074B2 (ja) エポキシ樹脂組成物
EP0942028A1 (en) Epoxy resin composition
CN103228696A (zh) 单组分环氧树脂组合物
JP2017031434A (ja) 一成分エポキシ樹脂組成物中の硬化剤としてのアミンおよびポリマーフェノールならびにそれらの使用
EP2997067B1 (en) Hardeners for cold-curing epoxy systems
JPH0160164B2 (esLanguage)
JP3147294B2 (ja) エポキシ樹脂の周囲温度および周囲温度以下の温度での硬化用速硬化アミン類
JPH0315654B2 (esLanguage)
JP2756630B2 (ja) エポキシ樹脂組成物
JPH03177418A (ja) 一成分系加熱硬化性エポキシ樹脂組成物
JP4204814B2 (ja) 熱硬化性液状樹脂組成物
JP3476994B2 (ja) エポキシ樹脂組成物
JPH04356523A (ja) 潜在性エポキシ樹脂硬化剤
JPH0446970B2 (esLanguage)
JPS61148228A (ja) 一液性エポキシ樹脂組成物
JPH01254731A (ja) 一成分系加熱硬化性エポキシ樹脂組成物
JP4576732B2 (ja) 一液型エポキシ樹脂組成物
JPH0446968B2 (esLanguage)
JP2827481B2 (ja) 熱硬化性樹脂組成物
JP3876954B2 (ja) 硬化性樹脂組成物
WO2025176980A1 (en) Adhesive formulation
JPH11310689A (ja) エポキシ樹脂組成物