JPS6436672A - Epoxy polymer composition for bonding chip part - Google Patents

Epoxy polymer composition for bonding chip part

Info

Publication number
JPS6436672A
JPS6436672A JP19215487A JP19215487A JPS6436672A JP S6436672 A JPS6436672 A JP S6436672A JP 19215487 A JP19215487 A JP 19215487A JP 19215487 A JP19215487 A JP 19215487A JP S6436672 A JPS6436672 A JP S6436672A
Authority
JP
Japan
Prior art keywords
reaction product
component
epoxy polymer
epoxy
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19215487A
Other languages
Japanese (ja)
Inventor
Tsuyoshi Kobayashi
Masashi Nakamura
Mamoru Kaigawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Somar Corp
Original Assignee
Somar Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Somar Corp filed Critical Somar Corp
Priority to JP19215487A priority Critical patent/JPS6436672A/en
Publication of JPS6436672A publication Critical patent/JPS6436672A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE:To obtain the titled composition having excellent storage stability, keeping the curing performance and adhesivity after a long-term storage and suitable for fixing an electronic part to a printed circuit board, by compounding an epoxy polymer with a specific reaction product and an organic acid hydrazide. CONSTITUTION:The objective composition is produced by compounding (A) an epoxy polymer with (B) a reaction product produced by reacting (i) an epoxy compound having >=1 epoxy group in one molecule with (ii) an active hydrogen compound having a tert-amino group in the molecule and/or a reaction product produced by reacting the component (i) with the component (ii) and (iii) a carboxylic acid anhydride and (C) an organic acid hydrazide. The sum of the components B and C is 5-40pts.wt. per 100pts.wt. of the component A. The composition is preferably further compounded with (D) a reactive diluent.
JP19215487A 1987-07-31 1987-07-31 Epoxy polymer composition for bonding chip part Pending JPS6436672A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19215487A JPS6436672A (en) 1987-07-31 1987-07-31 Epoxy polymer composition for bonding chip part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19215487A JPS6436672A (en) 1987-07-31 1987-07-31 Epoxy polymer composition for bonding chip part

Publications (1)

Publication Number Publication Date
JPS6436672A true JPS6436672A (en) 1989-02-07

Family

ID=16286595

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19215487A Pending JPS6436672A (en) 1987-07-31 1987-07-31 Epoxy polymer composition for bonding chip part

Country Status (1)

Country Link
JP (1) JPS6436672A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007083397A1 (en) * 2006-01-17 2007-07-26 Somar Corporation Liquid epoxy resin composition and adhesive using the same
JP2021114449A (en) * 2020-01-21 2021-08-05 積水化学工業株式会社 Conductive paste and connection structure

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5953526A (en) * 1982-09-21 1984-03-28 Ajinomoto Co Inc Latent curing agent for epoxy resin
JPS604524A (en) * 1983-06-22 1985-01-11 Ajinomoto Co Inc Latent curing agent for epoxy resin
JPS6072917A (en) * 1983-09-30 1985-04-25 Ajinomoto Co Inc Latent curing agent for epoxy resin

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5953526A (en) * 1982-09-21 1984-03-28 Ajinomoto Co Inc Latent curing agent for epoxy resin
JPS604524A (en) * 1983-06-22 1985-01-11 Ajinomoto Co Inc Latent curing agent for epoxy resin
JPS6072917A (en) * 1983-09-30 1985-04-25 Ajinomoto Co Inc Latent curing agent for epoxy resin

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007083397A1 (en) * 2006-01-17 2007-07-26 Somar Corporation Liquid epoxy resin composition and adhesive using the same
JP2021114449A (en) * 2020-01-21 2021-08-05 積水化学工業株式会社 Conductive paste and connection structure

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