CN103228696A - 单组分环氧树脂组合物 - Google Patents
单组分环氧树脂组合物 Download PDFInfo
- Publication number
- CN103228696A CN103228696A CN2011800549598A CN201180054959A CN103228696A CN 103228696 A CN103228696 A CN 103228696A CN 2011800549598 A CN2011800549598 A CN 2011800549598A CN 201180054959 A CN201180054959 A CN 201180054959A CN 103228696 A CN103228696 A CN 103228696A
- Authority
- CN
- China
- Prior art keywords
- epoxy resin
- resin composition
- component epoxy
- component
- curing agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
Claims (8)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010259088 | 2010-11-19 | ||
JP2010-259088 | 2010-11-19 | ||
PCT/JP2011/077276 WO2012067270A1 (en) | 2010-11-19 | 2011-11-18 | One component epoxy resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
CN103228696A true CN103228696A (zh) | 2013-07-31 |
Family
ID=45440611
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2011800549598A Pending CN103228696A (zh) | 2010-11-19 | 2011-11-18 | 单组分环氧树脂组合物 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20130165600A1 (zh) |
EP (1) | EP2640765B1 (zh) |
JP (1) | JP2013543012A (zh) |
KR (1) | KR20140000245A (zh) |
CN (1) | CN103228696A (zh) |
TW (1) | TWI586749B (zh) |
WO (1) | WO2012067270A1 (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109749359A (zh) * | 2017-11-02 | 2019-05-14 | 正一龙华特殊材料(深圳)有限公司 | 单组分环氧树脂组合物 |
CN110072907A (zh) * | 2016-12-13 | 2019-07-30 | 3M创新有限公司 | 使用取代的巴比妥酸实现环氧稳定化 |
CN115003726A (zh) * | 2020-03-25 | 2022-09-02 | 株式会社艾迪科 | 固化性树脂组合物及抑制固化性树脂组合物的固化收缩的方法 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106062030B (zh) * | 2014-03-17 | 2018-03-20 | 纳美仕有限公司 | 树脂组合物 |
CN106232739B (zh) | 2014-04-29 | 2019-08-02 | 阿克佐诺贝尔国际涂料股份有限公司 | 用于化学设备的表面的涂覆方法 |
KR102341968B1 (ko) * | 2014-09-02 | 2021-12-23 | 도레이 카부시키가이샤 | 섬유 강화 복합 재료용 에폭시 수지 조성물, 프리프레그 및 섬유 강화 복합 재료 |
JP6547478B2 (ja) * | 2014-09-02 | 2019-07-24 | 東レ株式会社 | エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料 |
KR20170116114A (ko) | 2015-02-13 | 2017-10-18 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 내한성 실란트 및 그의 성분 |
EP3392287A1 (de) | 2017-04-19 | 2018-10-24 | HILTI Aktiengesellschaft | Mehrkomponenten-epoxidharzmasse und verfahren zur steuerung der aushärtezeit einer epoxidharzmasse |
CN106987095B (zh) * | 2017-05-16 | 2018-09-28 | 广东博汇新材料科技股份有限公司 | 高透明性预浸料用环氧树脂组合物及其制备方法 |
WO2019053646A1 (en) | 2017-09-15 | 2019-03-21 | 3M Innovative Properties Company | ADHESIVE FILM COMPRISING A (METH) ACRYLATE MATRIX COMPRISING A CURABLE EPOXY / THIOL RESIN COMPOSITION, RIBBON AND METHOD |
KR102239656B1 (ko) * | 2018-09-28 | 2021-04-12 | (주)엘지하우시스 | 외단열용 접착제 조성물 및 이를 이용한 외단열 시스템 |
US20220162376A1 (en) | 2019-03-25 | 2022-05-26 | 3M Innovative Properties Company | Curable compositions, articles therefrom, and methods of making and using same |
JPWO2022209901A1 (zh) * | 2021-03-31 | 2022-10-06 | ||
EP4400525A1 (en) | 2023-01-12 | 2024-07-17 | Henkel AG & Co. KGaA | One component liquid epoxy resin composition |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004021759A (ja) * | 2002-06-19 | 2004-01-22 | Ufj Bank Ltd | 貿易取引決済システム及び貿易取引決済の方法 |
CN1262598C (zh) * | 1999-02-25 | 2006-07-05 | 日东电工株式会社 | 用于半导体封铸的树脂组合物、由所述材料获得的半导体设备以及制造半导体设备的方法 |
CN101065444A (zh) * | 2004-08-05 | 2007-10-31 | 福莱金属公司 | 用于电子器件的低成洞性非流动助熔底部填充剂 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0496931A (ja) * | 1990-08-10 | 1992-03-30 | Dainippon Ink & Chem Inc | エポキシ樹脂組成物 |
US5464910A (en) * | 1993-12-22 | 1995-11-07 | Shikoku Chemicals Corporation | Epoxy resin adduct combined with a borate ester and phenolic compound |
JP3476994B2 (ja) * | 1996-03-29 | 2003-12-10 | 四国化成工業株式会社 | エポキシ樹脂組成物 |
JP3882374B2 (ja) * | 1999-02-12 | 2007-02-14 | 味の素株式会社 | 導電性樹脂組成物 |
TWI222458B (en) * | 1999-02-25 | 2004-10-21 | Nitto Denko Corp | Resin compositions for semiconductor package and semiconductor articles using said compositions and packaging method of semiconductor device |
JP2001106873A (ja) * | 1999-10-07 | 2001-04-17 | Sumitomo Bakelite Co Ltd | 半導体用樹脂ペースト及びそれを用いた半導体装置 |
JP2001106874A (ja) * | 1999-10-07 | 2001-04-17 | Sumitomo Bakelite Co Ltd | 半導体用樹脂ペースト及びそれを用いた半導体装置 |
JP2001106767A (ja) * | 1999-10-07 | 2001-04-17 | Sumitomo Bakelite Co Ltd | 半導体用樹脂ペースト及びそれを用いた半導体装置 |
JP2002069157A (ja) * | 2000-08-24 | 2002-03-08 | Nitto Denko Corp | 半導体封止用樹脂組成物、およびそれを用いた半導体装置、半導体ウエハ、ならびに半導体装置の実装構造 |
TWI281478B (en) * | 2000-10-11 | 2007-05-21 | Sumitomo Bakelite Co | Die-attaching paste and semiconductor device |
JP2002293880A (ja) * | 2001-03-30 | 2002-10-09 | Sumitomo Bakelite Co Ltd | 液状封止樹脂組成物及びそれを用いた半導体装置 |
JP4204814B2 (ja) * | 2002-06-28 | 2009-01-07 | ヘンケル コーポレイション | 熱硬化性液状樹脂組成物 |
JP4587865B2 (ja) * | 2004-04-22 | 2010-11-24 | 昭和電工株式会社 | 感光性樹脂組成物及びその硬化物並びにそれらを使用するプリント配線基板の製造方法 |
JP5227119B2 (ja) * | 2007-09-03 | 2013-07-03 | ナミックス株式会社 | 光−熱併用型の潜在性硬化型エポキシ樹脂組成物 |
JP2009292737A (ja) * | 2008-06-02 | 2009-12-17 | Sakamoto Yakuhin Kogyo Co Ltd | ポリグリセリン脂肪酸エステルとその製造方法 |
JP2010053353A (ja) | 2008-07-29 | 2010-03-11 | Hitachi Chem Co Ltd | エポキシ樹脂用マイクロカプセル型潜在性硬化剤及びその製造方法、一液性エポキシ樹脂組成物、エポキシ樹脂硬化物、接着剤、接合用フィルム、導電性材料並びに異方導電性材料 |
-
2011
- 2011-11-04 TW TW100140233A patent/TWI586749B/zh not_active IP Right Cessation
- 2011-11-18 EP EP11802984.2A patent/EP2640765B1/en not_active Not-in-force
- 2011-11-18 WO PCT/JP2011/077276 patent/WO2012067270A1/en active Application Filing
- 2011-11-18 JP JP2013523408A patent/JP2013543012A/ja active Pending
- 2011-11-18 KR KR1020137012690A patent/KR20140000245A/ko not_active Application Discontinuation
- 2011-11-18 CN CN2011800549598A patent/CN103228696A/zh active Pending
-
2013
- 2013-02-26 US US13/777,318 patent/US20130165600A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1262598C (zh) * | 1999-02-25 | 2006-07-05 | 日东电工株式会社 | 用于半导体封铸的树脂组合物、由所述材料获得的半导体设备以及制造半导体设备的方法 |
JP2004021759A (ja) * | 2002-06-19 | 2004-01-22 | Ufj Bank Ltd | 貿易取引決済システム及び貿易取引決済の方法 |
CN101065444A (zh) * | 2004-08-05 | 2007-10-31 | 福莱金属公司 | 用于电子器件的低成洞性非流动助熔底部填充剂 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110072907A (zh) * | 2016-12-13 | 2019-07-30 | 3M创新有限公司 | 使用取代的巴比妥酸实现环氧稳定化 |
CN110072907B (zh) * | 2016-12-13 | 2021-12-14 | 3M创新有限公司 | 使用取代的巴比妥酸实现环氧稳定化 |
CN109749359A (zh) * | 2017-11-02 | 2019-05-14 | 正一龙华特殊材料(深圳)有限公司 | 单组分环氧树脂组合物 |
CN115003726A (zh) * | 2020-03-25 | 2022-09-02 | 株式会社艾迪科 | 固化性树脂组合物及抑制固化性树脂组合物的固化收缩的方法 |
CN115003726B (zh) * | 2020-03-25 | 2023-12-05 | 株式会社艾迪科 | 固化性树脂组合物及抑制固化性树脂组合物的固化收缩的方法 |
Also Published As
Publication number | Publication date |
---|---|
EP2640765A1 (en) | 2013-09-25 |
US20130165600A1 (en) | 2013-06-27 |
TWI586749B (zh) | 2017-06-11 |
KR20140000245A (ko) | 2014-01-02 |
TW201224052A (en) | 2012-06-16 |
JP2013543012A (ja) | 2013-11-28 |
EP2640765B1 (en) | 2017-01-04 |
WO2012067270A1 (en) | 2012-05-24 |
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C06 | Publication | ||
PB01 | Publication | ||
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ASS | Succession or assignment of patent right |
Owner name: HENKEL US IP LLC Free format text: FORMER OWNER: HENKEL CORP. Effective date: 20141126 |
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C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20141126 Address after: American Connecticut Applicant after: Henkel U.S. Intellectual Property Limited Liability Company Address before: American Connecticut Applicant before: Henkel Corp. |
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Owner name: HENKEL CORP. Free format text: FORMER OWNER: HENKEL US IP LLC Effective date: 20150420 |
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C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20150420 Address after: Dusseldorf Applicant after: Henkel intellectual property Holdings Co.,Ltd Address before: American Connecticut Applicant before: Henkel U.S. Intellectual Property Limited Liability Company |
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Application publication date: 20130731 |