JPH03122114A - 硬化剤組成物、その製造方法及び熱硬化性エポキシ樹脂組成物 - Google Patents

硬化剤組成物、その製造方法及び熱硬化性エポキシ樹脂組成物

Info

Publication number
JPH03122114A
JPH03122114A JP1261818A JP26181889A JPH03122114A JP H03122114 A JPH03122114 A JP H03122114A JP 1261818 A JP1261818 A JP 1261818A JP 26181889 A JP26181889 A JP 26181889A JP H03122114 A JPH03122114 A JP H03122114A
Authority
JP
Japan
Prior art keywords
curing agent
epoxy resin
powder
curing
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1261818A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0588886B2 (enExample
Inventor
Akira Yasuda
彰 安田
Rihei Nagase
永瀬　利平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Somar Corp
Original Assignee
Somar Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Somar Corp filed Critical Somar Corp
Priority to JP1261818A priority Critical patent/JPH03122114A/ja
Priority to EP19900118983 priority patent/EP0421390A3/en
Priority to US07/592,744 priority patent/US5218015A/en
Priority to CA002026995A priority patent/CA2026995A1/en
Priority to KR1019900015786A priority patent/KR910008003A/ko
Publication of JPH03122114A publication Critical patent/JPH03122114A/ja
Publication of JPH0588886B2 publication Critical patent/JPH0588886B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
JP1261818A 1989-10-06 1989-10-06 硬化剤組成物、その製造方法及び熱硬化性エポキシ樹脂組成物 Granted JPH03122114A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP1261818A JPH03122114A (ja) 1989-10-06 1989-10-06 硬化剤組成物、その製造方法及び熱硬化性エポキシ樹脂組成物
EP19900118983 EP0421390A3 (en) 1989-10-06 1990-10-04 Hardening agent composition, method of preparing the same and thermosetting epoxy resin composition
US07/592,744 US5218015A (en) 1989-10-06 1990-10-04 Hardening agent composition, method of preparing the same and thermosetting epoxy resin composition based on surface treated zeolites
CA002026995A CA2026995A1 (en) 1989-10-06 1990-10-05 Hardening agent composition, method of preparing the same and thermosetting epoxy resin composition
KR1019900015786A KR910008003A (ko) 1989-10-06 1990-10-05 경화제 조성물, 이를 제조하는 방법 및 열경화성 에폭시 수지조성물

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1261818A JPH03122114A (ja) 1989-10-06 1989-10-06 硬化剤組成物、その製造方法及び熱硬化性エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPH03122114A true JPH03122114A (ja) 1991-05-24
JPH0588886B2 JPH0588886B2 (enExample) 1993-12-24

Family

ID=17367152

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1261818A Granted JPH03122114A (ja) 1989-10-06 1989-10-06 硬化剤組成物、その製造方法及び熱硬化性エポキシ樹脂組成物

Country Status (5)

Country Link
US (1) US5218015A (enExample)
EP (1) EP0421390A3 (enExample)
JP (1) JPH03122114A (enExample)
KR (1) KR910008003A (enExample)
CA (1) CA2026995A1 (enExample)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07126494A (ja) * 1993-11-02 1995-05-16 Mitsui Petrochem Ind Ltd エポキシ樹脂組成物、該組成物を接着剤として塗布し た気密封止用接合部材、及び該組成物から成形された 半導体装置用パッケージ、ならびにこれらを用いた半 導体装置
JPH09165498A (ja) * 1995-12-14 1997-06-24 Sumitomo Bakelite Co Ltd 電子部品封止用樹脂組成物
WO2004081077A1 (ja) * 1995-09-27 2004-09-23 Atsushi Saito 加熱硬化性エポキシ樹脂組成物
KR100452953B1 (ko) * 2002-07-03 2004-10-14 동일고무벨트주식회사 차량충격 흡수장치와 병용되는 차량반발 억제장치
WO2006112396A1 (ja) * 2005-04-15 2006-10-26 Hitachi Chemical Co., Ltd. 硬化促進性化合物－シリカ複合体、硬化促進性化合物－シリカ複合体の製造方法、硬化促進剤、硬化性樹脂組成物及び電子部品装置
JP2010001342A (ja) * 2008-06-19 2010-01-07 Shin-Etsu Chemical Co Ltd 有機樹脂粉体塗料組成物
JP2010143872A (ja) * 2008-12-19 2010-07-01 Kyoritsu Kagaku Sangyo Kk ヒドラジド系混晶化合物
WO2012017571A1 (ja) * 2010-08-05 2012-02-09 住友ベークライト株式会社 機能性粒子、機能性粒子群、充填剤、電子部品用樹脂組成物、電子部品および半導体装置
JP2013071988A (ja) * 2011-09-27 2013-04-22 Sekisui Chem Co Ltd 硬化剤及び／又は硬化促進剤内包カプセル、及び、熱硬化性樹脂組成物
JP2013108085A (ja) * 2013-01-11 2013-06-06 Akebono Brake Ind Co Ltd ブレーキパッド／ドラムブレーキのシュー＆ライニングの製造方法
JP2014065712A (ja) * 2013-11-05 2014-04-17 Kyoritsu Kagaku Sangyo Kk ヒドラジド系混晶
JP2015203033A (ja) * 2014-04-10 2015-11-16 株式会社ティ−アンドケイ東華 加熱硬化型エポキシ樹脂用硬化剤及びそれを含む一液性加熱硬化型エポキシ樹脂組成物
JP2018083860A (ja) * 2016-11-21 2018-05-31 日本ゼオン株式会社 複合粒子を含む粉体組成物およびその製造方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1149864A1 (en) * 2000-04-28 2001-10-31 STMicroelectronics S.r.l. Polymeric composition for packaging a semiconductor electronic device and packaging obtained therefrom
KR20020092060A (ko) * 2001-06-01 2002-12-11 김정균 알콕시 작용성 그룹을 포함한 폴리실록산 화합물
JP2004143383A (ja) 2002-10-28 2004-05-20 Nikko Materials Co Ltd 固形シランカップリング剤組成物、その製造方法およびそれを含有する樹脂組成物
ITMI20032125A1 (it) * 2003-11-04 2005-05-05 Lucini Emilio Resina legante, particolarmente per fabbricare manufatti,
CN101821823B (zh) * 2007-10-12 2013-03-06 松下电器产业株式会社 壳体模制型电容器及其制造方法
JP2010037457A (ja) * 2008-08-06 2010-02-18 Nitto Denko Corp 無機微粒子を含有するシリコーン樹脂組成物
JP5232753B2 (ja) * 2009-09-30 2013-07-10 曙ブレーキ工業株式会社 接着剤
CN102712814B (zh) * 2010-01-19 2015-08-26 株式会社钟化 固化性组合物
CA2917588C (en) * 2013-09-04 2018-01-16 Halliburton Energy Services, Inc. Heavy-atom resin formulation for use in subterranean wells

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3036980A (en) * 1956-12-31 1962-05-29 Union Carbide Corp Rubber composition containing zeolitic molecular sieve and process for curing
US3018264A (en) * 1957-11-25 1962-01-23 Union Carbide Corp Polyepoxide compositions
BE621668A (enExample) * 1961-08-24 1900-01-01
US3533987A (en) * 1962-06-11 1970-10-13 Union Carbide Corp Method for curing vicinal epoxides using curing agents absorbed on zeolites
US3395105A (en) * 1964-10-06 1968-07-30 Mc Donnell Douglas Corp Epoxy systems containing encapsulated pressure fracturable curing agents
CH455109A (de) * 1965-08-11 1968-04-30 Merz & Benteli Ag Fabrikation Verfahren zur Herstellung eines Klebstoffes und nach dem Verfahren hergestellter Klebstoff
US3396117A (en) * 1965-09-07 1968-08-06 Amp Inc Encapsulation technique
US4130536A (en) * 1977-10-13 1978-12-19 Gould Inc. High humidity resistant electrical grade polymer concrete
US4374943A (en) * 1979-09-27 1983-02-22 Union Carbide Corporation Polysulfide alkoxy silane coupling agents
JPS604524A (ja) * 1983-06-22 1985-01-11 Ajinomoto Co Inc エポキシ樹脂用潜在性硬化剤
JPS61113614A (ja) * 1984-11-07 1986-05-31 Hitachi Chem Co Ltd エポキシ樹脂組成物
US4741779A (en) * 1985-07-19 1988-05-03 Nippon Chemical Industrial Co. Ltd. Additives for resins and their composition
US4624998A (en) * 1985-12-30 1986-11-25 Dow Corning Corporation Silicone-modified epoxy resins having improved impact resistance
JP3063103B2 (ja) * 1989-11-17 2000-07-12 栗田工業株式会社 生物脱臭方法
JP2993170B2 (ja) * 1991-04-17 1999-12-20 コーテック株式会社 創傷被覆材

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07126494A (ja) * 1993-11-02 1995-05-16 Mitsui Petrochem Ind Ltd エポキシ樹脂組成物、該組成物を接着剤として塗布し た気密封止用接合部材、及び該組成物から成形された 半導体装置用パッケージ、ならびにこれらを用いた半 導体装置
WO2004081077A1 (ja) * 1995-09-27 2004-09-23 Atsushi Saito 加熱硬化性エポキシ樹脂組成物
JPH09165498A (ja) * 1995-12-14 1997-06-24 Sumitomo Bakelite Co Ltd 電子部品封止用樹脂組成物
KR100452953B1 (ko) * 2002-07-03 2004-10-14 동일고무벨트주식회사 차량충격 흡수장치와 병용되는 차량반발 억제장치
JP5157444B2 (ja) * 2005-04-15 2013-03-06 日立化成株式会社 硬化促進性化合物−シリカ複合体、硬化促進性化合物−シリカ複合体の製造方法、硬化促進剤、硬化性樹脂組成物及び電子部品装置
WO2006112396A1 (ja) * 2005-04-15 2006-10-26 Hitachi Chemical Co., Ltd. 硬化促進性化合物－シリカ複合体、硬化促進性化合物－シリカ複合体の製造方法、硬化促進剤、硬化性樹脂組成物及び電子部品装置
JPWO2006112396A1 (ja) * 2005-04-15 2008-12-11 日立化成工業株式会社 硬化促進性化合物−シリカ複合体、硬化促進性化合物−シリカ複合体の製造方法、硬化促進剤、硬化性樹脂組成物及び電子部品装置
US8129467B2 (en) 2005-04-15 2012-03-06 Hitachi Chemical Co., Ltd. Curing accelerating compound-silica composite material, method for producing curing accelerating compound-silica composite material, curing accelerator, curable resin composition, and electronic component device
JP2010001342A (ja) * 2008-06-19 2010-01-07 Shin-Etsu Chemical Co Ltd 有機樹脂粉体塗料組成物
JP2010143872A (ja) * 2008-12-19 2010-07-01 Kyoritsu Kagaku Sangyo Kk ヒドラジド系混晶化合物
WO2012017571A1 (ja) * 2010-08-05 2012-02-09 住友ベークライト株式会社 機能性粒子、機能性粒子群、充填剤、電子部品用樹脂組成物、電子部品および半導体装置
CN103052687A (zh) * 2010-08-05 2013-04-17 住友电木株式会社 功能性颗粒、功能性颗粒群、填充剂、电子部件用树脂组合物、电子部件和半导体装置
JPWO2012017571A1 (ja) * 2010-08-05 2013-09-19 住友ベークライト株式会社 機能性粒子、機能性粒子群、充填剤、電子部品用樹脂組成物、電子部品および半導体装置
JP2013071988A (ja) * 2011-09-27 2013-04-22 Sekisui Chem Co Ltd 硬化剤及び／又は硬化促進剤内包カプセル、及び、熱硬化性樹脂組成物
JP2013108085A (ja) * 2013-01-11 2013-06-06 Akebono Brake Ind Co Ltd ブレーキパッド／ドラムブレーキのシュー＆ライニングの製造方法
JP2014065712A (ja) * 2013-11-05 2014-04-17 Kyoritsu Kagaku Sangyo Kk ヒドラジド系混晶
JP2015203033A (ja) * 2014-04-10 2015-11-16 株式会社ティ−アンドケイ東華 加熱硬化型エポキシ樹脂用硬化剤及びそれを含む一液性加熱硬化型エポキシ樹脂組成物
JP2018083860A (ja) * 2016-11-21 2018-05-31 日本ゼオン株式会社 複合粒子を含む粉体組成物およびその製造方法

Also Published As

Publication number Publication date
EP0421390A2 (en) 1991-04-10
KR910008003A (ko) 1991-05-30
EP0421390A3 (en) 1992-05-27
JPH0588886B2 (enExample) 1993-12-24
CA2026995A1 (en) 1991-04-07
US5218015A (en) 1993-06-08

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