JPH0286434A - 金属箔張り積層板の製造法 - Google Patents

金属箔張り積層板の製造法

Info

Publication number
JPH0286434A
JPH0286434A JP23826888A JP23826888A JPH0286434A JP H0286434 A JPH0286434 A JP H0286434A JP 23826888 A JP23826888 A JP 23826888A JP 23826888 A JP23826888 A JP 23826888A JP H0286434 A JPH0286434 A JP H0286434A
Authority
JP
Japan
Prior art keywords
metal foil
weight
epoxy resin
content
hydroxyl group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23826888A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0575581B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Masayuki Noda
雅之 野田
Kenichi Kariya
刈屋　憲一
Takahiro Yamaguchi
貴寛 山口
Katsuharu Takahashi
克治 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Shin Kobe Electric Machinery Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Kobe Electric Machinery Co Ltd filed Critical Shin Kobe Electric Machinery Co Ltd
Priority to JP23826888A priority Critical patent/JPH0286434A/ja
Publication of JPH0286434A publication Critical patent/JPH0286434A/ja
Publication of JPH0575581B2 publication Critical patent/JPH0575581B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Laminated Bodies (AREA)
JP23826888A 1988-09-22 1988-09-22 金属箔張り積層板の製造法 Granted JPH0286434A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23826888A JPH0286434A (ja) 1988-09-22 1988-09-22 金属箔張り積層板の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23826888A JPH0286434A (ja) 1988-09-22 1988-09-22 金属箔張り積層板の製造法

Publications (2)

Publication Number Publication Date
JPH0286434A true JPH0286434A (ja) 1990-03-27
JPH0575581B2 JPH0575581B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-10-20

Family

ID=17027656

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23826888A Granted JPH0286434A (ja) 1988-09-22 1988-09-22 金属箔張り積層板の製造法

Country Status (1)

Country Link
JP (1) JPH0286434A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019203291A1 (ja) * 2018-04-20 2019-10-24 三菱瓦斯化学株式会社 熱硬化性組成物、プリプレグ、積層板、金属箔張積層板、プリント配線板及び多層プリント配線板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019203291A1 (ja) * 2018-04-20 2019-10-24 三菱瓦斯化学株式会社 熱硬化性組成物、プリプレグ、積層板、金属箔張積層板、プリント配線板及び多層プリント配線板
JPWO2019203291A1 (ja) * 2018-04-20 2021-05-20 三菱瓦斯化学株式会社 熱硬化性組成物、プリプレグ、積層板、金属箔張積層板、プリント配線板及び多層プリント配線板

Also Published As

Publication number Publication date
JPH0575581B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-10-20

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