JPH0249549B2 - - Google Patents

Info

Publication number
JPH0249549B2
JPH0249549B2 JP58249488A JP24948883A JPH0249549B2 JP H0249549 B2 JPH0249549 B2 JP H0249549B2 JP 58249488 A JP58249488 A JP 58249488A JP 24948883 A JP24948883 A JP 24948883A JP H0249549 B2 JPH0249549 B2 JP H0249549B2
Authority
JP
Japan
Prior art keywords
layer
wiring
bonding pad
metal layer
intermediate metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58249488A
Other languages
English (en)
Other versions
JPS60140897A (ja
Inventor
Hiroyuki Hamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP58249488A priority Critical patent/JPS60140897A/ja
Priority to US06/678,828 priority patent/US4578304A/en
Priority to FR848420034A priority patent/FR2557755B1/fr
Publication of JPS60140897A publication Critical patent/JPS60140897A/ja
Publication of JPH0249549B2 publication Critical patent/JPH0249549B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5385—Assembly of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48471—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10946—Leads attached onto leadless component after manufacturing the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
    • Y10T428/12826—Group VIB metal-base component
    • Y10T428/12847—Cr-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12875—Platinum group metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12882—Cu-base component alternative to Ag-, Au-, or Ni-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Description

【発明の詳細な説明】 本発明は、ボンデイング時に基板に圧力のかか
る熱圧着ボンデイングに適した樹脂絶縁多層基板
に関する。
従来、多層配線基板においては、層間の絶縁に
無機絶縁材（Al2O3）が主に使用されていたが、
最近、配線の微細高密度化及び信号線間の低容量
化の為に絶縁材として有機樹脂を使用する多層配
線基板が開発されている。しかし、この種の有機
樹脂を絶縁に使用した場合、硬度が無機絶縁材
（Al2O3）の約1500ビツカース硬度に対して70〜
150ビツカース硬度と非常に低く、高温高加重の
かかる熱圧着により金属配線をボンデイングする
に際して樹脂がへこむ等の変形が生じ、正常なボ
ンデイングができないばかりでなく、下層の配線
層にも影響を与え、配線不良の原因になるという
不具合があつた。そこで、ボンデイング用パツド
にNiメツキ層等の硬いメタル層を介在させるこ
とによつて、ボンデイングパツドを硬くする処置
が採られていた。この場合、Niメツキ層は厚く、
かつ硬いほどよいが、厚さはパターン精度の劣化
をもたらし、また、硬度はメツキ浴組成およびメ
ツキ条件により必然的に制約をうけるから、ボン
デイング時の樹脂の変形を完全に無くすることは
できなかつた。
本発明の目的は、上記従来の問題点を解決し、
配線層に影響を与えずに配線用金属をボンデイン
グすることのできる樹脂絶縁多層基板を提供する
ことにある。
本発明によれば、樹脂絶縁層内に配線層が形成
され、層表面に配線用金属がボンデイングパツド
を介して接続される樹脂絶縁多層基板において、
ボンデイングパツドと配線層の間の樹脂絶縁層内
部に、ストレス緩衝用の中間メタル層を設けたこ
とを特徴とする樹脂絶縁多層基板が得られる。
なお上記の中間メタル層は樹脂絶縁層と密着性
を有するメタル層を含む多層の中間メタル層であ
つてもよい。
次に、本発明による樹脂絶縁多層基板について
実施例を挙げ、図面を参照して詳細に説明する。
第１図は本発明による実施例の構造を示す断面
図である。この図において、セラミツク基板６上
に有機樹脂絶縁層５を層間絶縁として配線層７が
形成され、その上に、さらに有機樹脂絶縁層４が
形成されている。そして、有機樹脂絶縁層４の上
には中間メタル層３が形成される。このストレス
緩衝用の中間メタル層３には、有機樹脂絶縁層４
との密着強度を上げる為に、クロム（Cr）層８
が500〜1000Å、パラジウム（Pd）層９が1000〜
2000Å形成され、その上に銅（Cu）層１０が約
20μｍ、ニツケル（Ni）層１１が１〜3μｍ程度形
成されている。さらに、上記中間メタル層３の上
には、有機樹脂絶縁層２が20μｍ形成され、その
上にボンデイング用パツド１が形成されている。
このボンデイング用パツド１は、中間メタル層３
と同様のメタル構成とし、最上層に金（Au）メ
ツキ１６が約3μｍ施されている。
このように構成された基板によれば、金の細線
１７をボンデイング用パツド１に熱圧着しても、
ボンデイング用パツド１内に銅（Cu）層１４、
ニツケル（Ni）層１５が介在する為、有機樹脂
絶縁層２への影響が小さくなつて有機樹脂絶縁層
２生ずる凹みを２〜5μｍ程度に押えることがで
きる。また、ボンデイング用パツド１と配線層７
との間に中間メタル層３が介在する為、有機樹脂
絶縁層２に生ずる凹みが配線層７に影響を与える
ことはない。このように中間メタル層３はボンデ
イングパツドを熱圧着したときに生じるストレス
の有効な緩衝材となる。なお、有機樹脂絶縁層と
中間メタル層との密着度を高める為にクロム
（Cr）を使用したが、チタン（Ti）を使用しても
よいことは言うまでもない。
以上の説明により明らかなように、本発明によ
れば、ボンデイング用パツドと配線層との間に
Ni、Cu等の中間メタル層を設けることにより、
良好なボンデイングを行なうことができ、信頼性
の向上に対して得られる効果は大きい。
【図面の簡単な説明】
第１図は本発明による実施例の構造を示す断面
図である。この図において、１はボンデイング用
パツド、２，４，５は有機樹脂絶縁層、３は中間
メタル層、６はセラミツク基板、７は配線層、
８，１２はクロム層、９，１３はパラジウム層、
１０，１４は銅層、１１，１５はニツケル層、１
６は金メツキ、１７は金の細線である。

Claims (1)

  1. 【特許請求の範囲】 １ 樹脂絶縁層内に配線層が形成され、層表面に
    配線用金属がボンデイング用パツドを介して接続
    される樹脂絶縁多層基板において、前記ボンデイ
    ング用パツドと前記配線層の間の樹脂絶縁層内部
    に、ストレス緩衝用の中間メタル層を設けたこと
    を特徴とする樹脂絶縁多層基板。 ２ 前記中間メタル層が前記樹脂絶縁層と密着性
    を有するメタル層を含む多層の中間メタル層であ
    ることを特徴とする特許請求の範囲第１項記載の
    樹脂絶縁多層基板。
JP58249488A 1983-12-28 1983-12-28 樹脂絶縁多層基板 Granted JPS60140897A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP58249488A JPS60140897A (ja) 1983-12-28 1983-12-28 樹脂絶縁多層基板
US06/678,828 US4578304A (en) 1983-12-28 1984-12-06 Multilayer wiring substrate
FR848420034A FR2557755B1 (fr) 1983-12-28 1984-12-28 Substrat de cablage multi-couche

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58249488A JPS60140897A (ja) 1983-12-28 1983-12-28 樹脂絶縁多層基板

Publications (2)

Publication Number Publication Date
JPS60140897A JPS60140897A (ja) 1985-07-25
JPH0249549B2 true JPH0249549B2 (ja) 1990-10-30

Family

ID=17193713

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58249488A Granted JPS60140897A (ja) 1983-12-28 1983-12-28 樹脂絶縁多層基板

Country Status (3)

Country Link
US (1) US4578304A (ja)
JP (1) JPS60140897A (ja)
FR (1) FR2557755B1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0570552U (ja) * 1991-03-28 1993-09-24 株式会社クラレ 生体医学用電極

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4727044A (en) * 1984-05-18 1988-02-23 Semiconductor Energy Laboratory Co., Ltd. Method of making a thin film transistor with laser recrystallized source and drain
JPS61176142A (ja) * 1985-01-31 1986-08-07 Toshiba Corp 基板構造体
US4731699A (en) * 1985-10-08 1988-03-15 Nec Corporation Mounting structure for a chip
JPS62108593A (ja) * 1985-11-06 1987-05-19 日本電気株式会社 多層配線基板
JPS6318697A (ja) * 1986-07-11 1988-01-26 日本電気株式会社 多層配線基板
US5165166A (en) * 1987-09-29 1992-11-24 Microelectronics And Computer Technology Corporation Method of making a customizable circuitry
AU610249B2 (en) * 1987-09-29 1991-05-16 Microelectronics And Computer Technology Corporation Customizable circuitry
JPH085580Y2 (ja) * 1990-02-09 1996-02-14 沖電気工業株式会社 樹脂多層プリント配線板
DE4309307A1 (de) * 1993-03-23 1994-09-29 Siemens Nixdorf Inf Syst Verfahren zur Montage eines dünnen Halbleiterquaders auf einem folienartigen Substrat
JP3110922B2 (ja) * 1993-08-12 2000-11-20 富士通株式会社 マルチチップ・モジュール
JP4206320B2 (ja) 2003-09-19 2009-01-07 株式会社ルネサステクノロジ 半導体集積回路装置の製造方法
JP4798237B2 (ja) * 2009-03-09 2011-10-19 株式会社デンソー Ｉｃ搭載基板、及び多層プリント配線板

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Publication number Priority date Publication date Assignee Title
US3381256A (en) * 1966-02-04 1968-04-30 Monsanto Co Resistor and contact means on a base
US4016050A (en) * 1975-05-12 1977-04-05 Bell Telephone Laboratories, Incorporated Conduction system for thin film and hybrid integrated circuits
DE2554691C2 (de) * 1974-12-10 1982-11-18 Western Electric Co., Inc., 10038 New York, N.Y. Verfahren zum Herstellen elektrischer Leiter auf einem isolierenden Substrat und danach hergestellte Dünnschichtschaltung
DE2716545A1 (de) * 1977-04-14 1978-10-19 Siemens Ag Gedruckte schaltungsplatte mit mindestens zwei verdrahtungslagen
US4190474A (en) * 1977-12-22 1980-02-26 Gould Inc. Method of making a printed circuit board having mutually etchable copper and nickel layers
US4260449A (en) * 1977-12-22 1981-04-07 Gould Inc. Method of forming a printed circuit
US4311768A (en) * 1977-12-22 1982-01-19 Gould Inc. Printed circuit board having mutually etchable copper and nickel layers
FR2466103A1 (fr) * 1979-09-18 1981-03-27 Lerouzic Jean Procede de realisation d'un reseau d'interconnexion de composants electroniques a conducteurs en aluminium et isolant en alumine et reseau d'interconnexion obtenu par ce procede

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0570552U (ja) * 1991-03-28 1993-09-24 株式会社クラレ 生体医学用電極

Also Published As

Publication number Publication date
FR2557755A1 (fr) 1985-07-05
JPS60140897A (ja) 1985-07-25
US4578304A (en) 1986-03-25
FR2557755B1 (fr) 1994-07-29

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