JPH0249444A - 樹脂封止形半導体装置の製造方法 - Google Patents

樹脂封止形半導体装置の製造方法

Info

Publication number
JPH0249444A
JPH0249444A JP1086911A JP8691189A JPH0249444A JP H0249444 A JPH0249444 A JP H0249444A JP 1086911 A JP1086911 A JP 1086911A JP 8691189 A JP8691189 A JP 8691189A JP H0249444 A JPH0249444 A JP H0249444A
Authority
JP
Japan
Prior art keywords
strip
resin
support plate
lead frame
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1086911A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0451976B2 (cg-RX-API-DMAC10.html
Inventor
Takaaki Yokoyama
隆昭 横山
Yoshiharu Tada
多田　吉晴
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP1086911A priority Critical patent/JPH0249444A/ja
Publication of JPH0249444A publication Critical patent/JPH0249444A/ja
Publication of JPH0451976B2 publication Critical patent/JPH0451976B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/01515—
    • H10W72/075—
    • H10W72/5449—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1086911A 1989-04-07 1989-04-07 樹脂封止形半導体装置の製造方法 Granted JPH0249444A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1086911A JPH0249444A (ja) 1989-04-07 1989-04-07 樹脂封止形半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1086911A JPH0249444A (ja) 1989-04-07 1989-04-07 樹脂封止形半導体装置の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP59159047A Division JPS6156420A (ja) 1984-07-31 1984-07-31 樹脂封止形半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPH0249444A true JPH0249444A (ja) 1990-02-19
JPH0451976B2 JPH0451976B2 (cg-RX-API-DMAC10.html) 1992-08-20

Family

ID=13900028

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1086911A Granted JPH0249444A (ja) 1989-04-07 1989-04-07 樹脂封止形半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPH0249444A (cg-RX-API-DMAC10.html)

Also Published As

Publication number Publication date
JPH0451976B2 (cg-RX-API-DMAC10.html) 1992-08-20

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees