JPH0245357B2 - - Google Patents

Info

Publication number
JPH0245357B2
JPH0245357B2 JP57108478A JP10847882A JPH0245357B2 JP H0245357 B2 JPH0245357 B2 JP H0245357B2 JP 57108478 A JP57108478 A JP 57108478A JP 10847882 A JP10847882 A JP 10847882A JP H0245357 B2 JPH0245357 B2 JP H0245357B2
Authority
JP
Japan
Prior art keywords
substrate
board
chip
solder
thermal expansion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57108478A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59996A (ja
Inventor
Tasao Soga
Takaya Suzuki
Mamoru Sawahata
Tadao Kushima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP57108478A priority Critical patent/JPS59996A/ja
Publication of JPS59996A publication Critical patent/JPS59996A/ja
Publication of JPH0245357B2 publication Critical patent/JPH0245357B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W90/724—

Landscapes

  • Die Bonding (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)
JP57108478A 1982-06-25 1982-06-25 基板の接続構造 Granted JPS59996A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57108478A JPS59996A (ja) 1982-06-25 1982-06-25 基板の接続構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57108478A JPS59996A (ja) 1982-06-25 1982-06-25 基板の接続構造

Publications (2)

Publication Number Publication Date
JPS59996A JPS59996A (ja) 1984-01-06
JPH0245357B2 true JPH0245357B2 (enExample) 1990-10-09

Family

ID=14485768

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57108478A Granted JPS59996A (ja) 1982-06-25 1982-06-25 基板の接続構造

Country Status (1)

Country Link
JP (1) JPS59996A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011054875A (ja) * 2009-09-04 2011-03-17 Fujitsu Ltd 電子装置及びその製造方法
WO2013030931A1 (ja) 2011-08-29 2013-03-07 日本碍子株式会社 積層焼結セラミック配線基板、及び当該配線基板を含む半導体パッケージ

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60239047A (ja) * 1984-01-30 1985-11-27 アンプ　インコーポレーテッド 組立体
JPS613497A (ja) * 1984-06-15 1986-01-09 富士通株式会社 異種複合プリント板の電気接続構造
JPS61269396A (ja) * 1985-05-24 1986-11-28 株式会社日立製作所 多層配線基板の製造方法
WO1987000686A1 (fr) * 1985-07-16 1987-01-29 Nippon Telegraph And Telephone Corporation Bornes de connection entre des substrats et procede de production
JPS62136865A (ja) * 1985-12-11 1987-06-19 Hitachi Ltd モジユ−ル実装構造
JPS6324696A (ja) * 1986-07-17 1988-02-02 日本電気株式会社 高多層配線基板
US5299730A (en) * 1989-08-28 1994-04-05 Lsi Logic Corporation Method and apparatus for isolation of flux materials in flip-chip manufacturing
US5135606A (en) * 1989-12-08 1992-08-04 Canon Kabushiki Kaisha Process for preparing electrical connecting member
US5145552A (en) * 1989-12-21 1992-09-08 Canon Kabushiki Kaisha Process for preparing electrical connecting member
JP3116273B2 (ja) * 1996-04-26 2000-12-11 日本特殊陶業株式会社 中継基板、その製造方法、基板と中継基板と取付基板とからなる構造体、基板と中継基板の接続体
JP3038644B2 (ja) * 1996-07-17 2000-05-08 日本特殊陶業株式会社 中継基板、その製造方法、中継基板付き基板、基板と中継基板と取付基板とからなる構造体、その製造方法およびその構造体の分解方法
WO2001076332A1 (en) * 2000-03-31 2001-10-11 Fujitsu Limited Circuit board, method of manufacture thereof, integrated circuit and method of manufacture thereof
KR20060111449A (ko) * 2003-09-24 2006-10-27 이비덴 가부시키가이샤 인터포저, 다층프린트배선판
JP2005123548A (ja) * 2003-09-24 2005-05-12 Ibiden Co Ltd インターポーザ、多層プリント配線板
CN101171894B (zh) 2005-06-30 2010-05-19 揖斐电株式会社 印刷线路板
CN101171895B (zh) 2005-06-30 2010-06-23 揖斐电株式会社 印刷线路板

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011054875A (ja) * 2009-09-04 2011-03-17 Fujitsu Ltd 電子装置及びその製造方法
WO2013030931A1 (ja) 2011-08-29 2013-03-07 日本碍子株式会社 積層焼結セラミック配線基板、及び当該配線基板を含む半導体パッケージ
US8421215B2 (en) 2011-08-29 2013-04-16 Ngk Insulators, Ltd. Laminated and sintered ceramic circuit board, and semiconductor package including the circuit board

Also Published As

Publication number Publication date
JPS59996A (ja) 1984-01-06

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