JPH0243343B2 - - Google Patents

Info

Publication number
JPH0243343B2
JPH0243343B2 JP56211212A JP21121281A JPH0243343B2 JP H0243343 B2 JPH0243343 B2 JP H0243343B2 JP 56211212 A JP56211212 A JP 56211212A JP 21121281 A JP21121281 A JP 21121281A JP H0243343 B2 JPH0243343 B2 JP H0243343B2
Authority
JP
Japan
Prior art keywords
input
output
diode
gate
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56211212A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58115844A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP56211212A priority Critical patent/JPS58115844A/ja
Publication of JPS58115844A publication Critical patent/JPS58115844A/ja
Publication of JPH0243343B2 publication Critical patent/JPH0243343B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554External layer
    • H01L2224/0555Shape
    • H01L2224/05552Shape in top view
    • H01L2224/05554Shape in top view being square

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
JP56211212A 1981-12-28 1981-12-28 半導体装置 Granted JPS58115844A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56211212A JPS58115844A (ja) 1981-12-28 1981-12-28 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56211212A JPS58115844A (ja) 1981-12-28 1981-12-28 半導体装置

Publications (2)

Publication Number Publication Date
JPS58115844A JPS58115844A (ja) 1983-07-09
JPH0243343B2 true JPH0243343B2 (enrdf_load_stackoverflow) 1990-09-28

Family

ID=16602167

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56211212A Granted JPS58115844A (ja) 1981-12-28 1981-12-28 半導体装置

Country Status (1)

Country Link
JP (1) JPS58115844A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59208771A (ja) * 1983-05-13 1984-11-27 Hitachi Ltd 半導体集積回路装置
JPS6068721A (ja) * 1983-09-22 1985-04-19 Fujitsu Ltd Ecl回路
JPS6146046A (ja) * 1984-08-10 1986-03-06 Hitachi Ltd 半導体集積回路装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57181152A (en) * 1981-04-30 1982-11-08 Toshiba Corp Semiconductor integrated circuit device

Also Published As

Publication number Publication date
JPS58115844A (ja) 1983-07-09

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