JPH0243343B2 - - Google Patents
Info
- Publication number
- JPH0243343B2 JPH0243343B2 JP56211212A JP21121281A JPH0243343B2 JP H0243343 B2 JPH0243343 B2 JP H0243343B2 JP 56211212 A JP56211212 A JP 56211212A JP 21121281 A JP21121281 A JP 21121281A JP H0243343 B2 JPH0243343 B2 JP H0243343B2
- Authority
- JP
- Japan
- Prior art keywords
- input
- output
- diode
- gate
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
Landscapes
- Design And Manufacture Of Integrated Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56211212A JPS58115844A (ja) | 1981-12-28 | 1981-12-28 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56211212A JPS58115844A (ja) | 1981-12-28 | 1981-12-28 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58115844A JPS58115844A (ja) | 1983-07-09 |
| JPH0243343B2 true JPH0243343B2 (enrdf_load_stackoverflow) | 1990-09-28 |
Family
ID=16602167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56211212A Granted JPS58115844A (ja) | 1981-12-28 | 1981-12-28 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58115844A (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59208771A (ja) * | 1983-05-13 | 1984-11-27 | Hitachi Ltd | 半導体集積回路装置 |
| JPS6068721A (ja) * | 1983-09-22 | 1985-04-19 | Fujitsu Ltd | Ecl回路 |
| JPS6146046A (ja) * | 1984-08-10 | 1986-03-06 | Hitachi Ltd | 半導体集積回路装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57181152A (en) * | 1981-04-30 | 1982-11-08 | Toshiba Corp | Semiconductor integrated circuit device |
-
1981
- 1981-12-28 JP JP56211212A patent/JPS58115844A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58115844A (ja) | 1983-07-09 |
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