JPS58115844A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS58115844A
JPS58115844A JP56211212A JP21121281A JPS58115844A JP S58115844 A JPS58115844 A JP S58115844A JP 56211212 A JP56211212 A JP 56211212A JP 21121281 A JP21121281 A JP 21121281A JP S58115844 A JPS58115844 A JP S58115844A
Authority
JP
Japan
Prior art keywords
input
output
diode
pad
transistors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56211212A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0243343B2 (enrdf_load_stackoverflow
Inventor
Kazumasa Nawata
名和田　一正
Toshiaki Sakai
酒井　敏昭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP56211212A priority Critical patent/JPS58115844A/ja
Publication of JPS58115844A publication Critical patent/JPS58115844A/ja
Publication of JPH0243343B2 publication Critical patent/JPH0243343B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
JP56211212A 1981-12-28 1981-12-28 半導体装置 Granted JPS58115844A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56211212A JPS58115844A (ja) 1981-12-28 1981-12-28 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56211212A JPS58115844A (ja) 1981-12-28 1981-12-28 半導体装置

Publications (2)

Publication Number Publication Date
JPS58115844A true JPS58115844A (ja) 1983-07-09
JPH0243343B2 JPH0243343B2 (enrdf_load_stackoverflow) 1990-09-28

Family

ID=16602167

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56211212A Granted JPS58115844A (ja) 1981-12-28 1981-12-28 半導体装置

Country Status (1)

Country Link
JP (1) JPS58115844A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59208771A (ja) * 1983-05-13 1984-11-27 Hitachi Ltd 半導体集積回路装置
JPS6146046A (ja) * 1984-08-10 1986-03-06 Hitachi Ltd 半導体集積回路装置
US4918563A (en) * 1983-09-22 1990-04-17 Fujitsu Limited ECL gate array semiconductor device with protective elements

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57181152A (en) * 1981-04-30 1982-11-08 Toshiba Corp Semiconductor integrated circuit device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57181152A (en) * 1981-04-30 1982-11-08 Toshiba Corp Semiconductor integrated circuit device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59208771A (ja) * 1983-05-13 1984-11-27 Hitachi Ltd 半導体集積回路装置
US4918563A (en) * 1983-09-22 1990-04-17 Fujitsu Limited ECL gate array semiconductor device with protective elements
JPS6146046A (ja) * 1984-08-10 1986-03-06 Hitachi Ltd 半導体集積回路装置

Also Published As

Publication number Publication date
JPH0243343B2 (enrdf_load_stackoverflow) 1990-09-28

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