JPH0241905B2 - - Google Patents

Info

Publication number
JPH0241905B2
JPH0241905B2 JP58163916A JP16391683A JPH0241905B2 JP H0241905 B2 JPH0241905 B2 JP H0241905B2 JP 58163916 A JP58163916 A JP 58163916A JP 16391683 A JP16391683 A JP 16391683A JP H0241905 B2 JPH0241905 B2 JP H0241905B2
Authority
JP
Japan
Prior art keywords
film
gold
electrode
electrode pad
aluminum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58163916A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6054462A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP58163916A priority Critical patent/JPS6054462A/ja
Publication of JPS6054462A publication Critical patent/JPS6054462A/ja
Publication of JPH0241905B2 publication Critical patent/JPH0241905B2/ja
Granted legal-status Critical Current

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Classifications

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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
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    • H01L2924/01079—Gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
JP58163916A 1983-09-05 1983-09-05 半導体装置 Granted JPS6054462A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58163916A JPS6054462A (ja) 1983-09-05 1983-09-05 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58163916A JPS6054462A (ja) 1983-09-05 1983-09-05 半導体装置

Publications (2)

Publication Number Publication Date
JPS6054462A JPS6054462A (ja) 1985-03-28
JPH0241905B2 true JPH0241905B2 (cs) 1990-09-19

Family

ID=15783256

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58163916A Granted JPS6054462A (ja) 1983-09-05 1983-09-05 半導体装置

Country Status (1)

Country Link
JP (1) JPS6054462A (cs)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0262930U (cs) * 1988-10-26 1990-05-10
JP5331610B2 (ja) * 2008-12-03 2013-10-30 ルネサスエレクトロニクス株式会社 半導体集積回路装置
JP6420721B2 (ja) * 2014-07-09 2018-11-07 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
JP6326547B1 (ja) * 2016-09-21 2018-05-16 新電元工業株式会社 半導体装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5192179A (en) * 1975-02-10 1976-08-12 Bisaipataanno keiseihoho
JPS5192172A (en) * 1975-02-10 1976-08-12 Denkyokuhyomen oo taishokuseihogomaku no keiseihoho

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