JPH0238109B2 - - Google Patents

Info

Publication number
JPH0238109B2
JPH0238109B2 JP58063007A JP6300783A JPH0238109B2 JP H0238109 B2 JPH0238109 B2 JP H0238109B2 JP 58063007 A JP58063007 A JP 58063007A JP 6300783 A JP6300783 A JP 6300783A JP H0238109 B2 JPH0238109 B2 JP H0238109B2
Authority
JP
Japan
Prior art keywords
fibers
carbon
thermoplastic resin
metal
fiber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58063007A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59189142A (ja
Inventor
Ryuichi Deguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ube Corp
Original Assignee
Ube Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ube Industries Ltd filed Critical Ube Industries Ltd
Priority to JP58063007A priority Critical patent/JPS59189142A/ja
Priority to US06/597,605 priority patent/US4569786A/en
Publication of JPS59189142A publication Critical patent/JPS59189142A/ja
Publication of JPH0238109B2 publication Critical patent/JPH0238109B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
JP58063007A 1983-04-12 1983-04-12 導電性熱可塑性樹脂組成物 Granted JPS59189142A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP58063007A JPS59189142A (ja) 1983-04-12 1983-04-12 導電性熱可塑性樹脂組成物
US06/597,605 US4569786A (en) 1983-04-12 1984-04-06 Electrically conductive thermoplastic resin composition containing metal and carbon fibers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58063007A JPS59189142A (ja) 1983-04-12 1983-04-12 導電性熱可塑性樹脂組成物

Publications (2)

Publication Number Publication Date
JPS59189142A JPS59189142A (ja) 1984-10-26
JPH0238109B2 true JPH0238109B2 (en, 2012) 1990-08-29

Family

ID=13216827

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58063007A Granted JPS59189142A (ja) 1983-04-12 1983-04-12 導電性熱可塑性樹脂組成物

Country Status (2)

Country Link
US (1) US4569786A (en, 2012)
JP (1) JPS59189142A (en, 2012)

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US7476108B2 (en) * 2004-12-22 2009-01-13 Fci Americas Technology, Inc. Electrical power connectors with cooling features
US7656047B2 (en) * 2005-01-05 2010-02-02 Advanced Semiconductor Engineering, Inc. Semiconductor device package and manufacturing method
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US8410584B2 (en) * 2008-08-08 2013-04-02 Advanced Semiconductor Engineering, Inc. Semiconductor device packages with electromagnetic interference shielding
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US8569894B2 (en) 2010-01-13 2013-10-29 Advanced Semiconductor Engineering, Inc. Semiconductor package with single sided substrate design and manufacturing methods thereof
TWI411075B (zh) 2010-03-22 2013-10-01 Advanced Semiconductor Eng 半導體封裝件及其製造方法
US9056950B2 (en) 2010-07-23 2015-06-16 Ticona Gmbh Composite polymeric articles formed from extruded sheets containing a liquid crystal polymer
TWI540698B (zh) 2010-08-02 2016-07-01 日月光半導體製造股份有限公司 半導體封裝件與其製造方法
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CN102746658A (zh) * 2012-06-15 2012-10-24 苏州宇度医疗器械有限责任公司 金属纤维填充的尼龙复合材料的制备方法
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Also Published As

Publication number Publication date
US4569786A (en) 1986-02-11
JPS59189142A (ja) 1984-10-26

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