JPH0234461B2 - - Google Patents

Info

Publication number
JPH0234461B2
JPH0234461B2 JP59026236A JP2623684A JPH0234461B2 JP H0234461 B2 JPH0234461 B2 JP H0234461B2 JP 59026236 A JP59026236 A JP 59026236A JP 2623684 A JP2623684 A JP 2623684A JP H0234461 B2 JPH0234461 B2 JP H0234461B2
Authority
JP
Japan
Prior art keywords
pin
substrate
dielectric
circular
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59026236A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6010648A (ja
Inventor
Edoin Dootei Junia Uiriamu
Yuujin Guria Suchuaato
Uinsuton Saajento Robaato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS6010648A publication Critical patent/JPS6010648A/ja
Publication of JPH0234461B2 publication Critical patent/JPH0234461B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/306—Assembling printed circuits with electric components, e.g. with resistors with lead-in-hole components
    • H05K3/308—Adaptations of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Multi-Conductor Connections (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP59026236A 1983-06-20 1984-02-16 非円形ピン穴あき多層誘電体基板及びその製造方法 Granted JPS6010648A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US50607183A 1983-06-20 1983-06-20
US506071 1983-06-20

Publications (2)

Publication Number Publication Date
JPS6010648A JPS6010648A (ja) 1985-01-19
JPH0234461B2 true JPH0234461B2 (enExample) 1990-08-03

Family

ID=24013048

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59026236A Granted JPS6010648A (ja) 1983-06-20 1984-02-16 非円形ピン穴あき多層誘電体基板及びその製造方法

Country Status (3)

Country Link
EP (1) EP0129137B1 (enExample)
JP (1) JPS6010648A (enExample)
DE (1) DE3476505D1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5038252A (en) * 1989-01-26 1991-08-06 Teradyne, Inc. Printed circuit boards with improved electrical current control
US5410452A (en) * 1994-02-18 1995-04-25 Aries Electronics, Inc. Printed circuit board electrical adaptor pin
GB9705277D0 (en) * 1997-03-14 1997-04-30 Kam Circuits Limited Improvements relating to printed circuit board pin location
US6181219B1 (en) 1998-12-02 2001-01-30 Teradyne, Inc. Printed circuit board and method for fabricating such board
TWI239798B (en) 1999-05-28 2005-09-11 Toppan Printing Co Ltd Photo electric wiring substrate, mounted substrate, and the manufacture method of the photo electric wiring substrate
US7999192B2 (en) 2007-03-14 2011-08-16 Amphenol Corporation Adjacent plated through holes with staggered couplings for crosstalk reduction in high speed printed circuit boards
KR102680258B1 (ko) 2016-04-18 2024-07-02 서울바이오시스 주식회사 공기 청정기

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1021320A (en) * 1964-05-26 1966-03-02 Burndy Corp Microminiature electrical connection
US4193082A (en) * 1978-06-23 1980-03-11 International Business Machines Corporation Multi-layer dielectric structure
US4202007A (en) * 1978-06-23 1980-05-06 International Business Machines Corporation Multi-layer dielectric planar structure having an internal conductor pattern characterized with opposite terminations disposed at a common edge surface of the layers
FR2512315A1 (fr) * 1981-09-02 1983-03-04 Rouge Francois Ebauche de circuit electrique multicouche et procede de fabrication de circuits multicouches en comportant application
DE3150435A1 (de) * 1981-12-19 1983-06-30 Bosch Gmbh Robert Verfahren zum herstellen eines elektrischen bauteils

Also Published As

Publication number Publication date
EP0129137B1 (en) 1989-01-25
EP0129137A3 (en) 1985-11-27
DE3476505D1 (en) 1989-03-02
EP0129137A2 (en) 1984-12-27
JPS6010648A (ja) 1985-01-19

Similar Documents

Publication Publication Date Title
US6630881B1 (en) Method for producing multi-layered chip inductor
US4598470A (en) Method for providing improved electrical and mechanical connection between I/O pin and transverse via substrate
JPH0234461B2 (enExample)
JP2002026528A (ja) 導電性ペーストおよび多層セラミック基板
EP0689247A1 (en) High input/output density MLC flat pack
JP2005268672A (ja) 基板
DE2536624A1 (de) Traegeranordnung fuer integrierte halbleiterschaltungen
JP3064751B2 (ja) 多層型ジャンパーチップの製造方法
JPS60117796A (ja) 多層配線基板及びその製造方法
JP4290237B2 (ja) 積層電子部品の製造方法
JP3476887B2 (ja) コイル部品および電極の形成方法
JPH09283654A (ja) ガラスセラミック基板とその製造方法
US3919767A (en) Arrangement for making metallic connections between circuit points situated in one plane
JP2564297B2 (ja) 回路基板
JPH11298142A (ja) 多層セラミック基板の実装構造と実装方法
JP2001015930A (ja) 多層配線基板およびその製造方法
JP2537893B2 (ja) 電子回路基板の製造方法
JPH0719162Y2 (ja) 集積回路パッケージ
JPS609146A (ja) リ−ドレスチツプキヤリア基板の形成方法
JPH0685468B2 (ja) セラミツク多層基板の製造方法
JPH01289201A (ja) チップ抵抗器とその製造方法
JP2001155901A (ja) 金属皮膜チップ抵抗器およびその製造方法
JPH0697618A (ja) 混成集積回路装置とその製造方法
JPS6020598A (ja) 高周波用多層導体基板
JPH09199329A (ja) 積層シ−トコイルおよびその製造方法