JPS6010648A - 非円形ピン穴あき多層誘電体基板及びその製造方法 - Google Patents

非円形ピン穴あき多層誘電体基板及びその製造方法

Info

Publication number
JPS6010648A
JPS6010648A JP59026236A JP2623684A JPS6010648A JP S6010648 A JPS6010648 A JP S6010648A JP 59026236 A JP59026236 A JP 59026236A JP 2623684 A JP2623684 A JP 2623684A JP S6010648 A JPS6010648 A JP S6010648A
Authority
JP
Japan
Prior art keywords
dielectric
pin
circular
dielectric substrate
multilayer dielectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59026236A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0234461B2 (enExample
Inventor
ウイリアム・エドウイン・ド−テイ・ジユニア
スチユア−ト・ユ−ジン・グリア
ロバ−ト・ウインストン・サ−ジエント
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS6010648A publication Critical patent/JPS6010648A/ja
Publication of JPH0234461B2 publication Critical patent/JPH0234461B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/306—Assembling printed circuits with electric components, e.g. with resistors with lead-in-hole components
    • H05K3/308—Adaptations of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Multi-Conductor Connections (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP59026236A 1983-06-20 1984-02-16 非円形ピン穴あき多層誘電体基板及びその製造方法 Granted JPS6010648A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US50607183A 1983-06-20 1983-06-20
US506071 1983-06-20

Publications (2)

Publication Number Publication Date
JPS6010648A true JPS6010648A (ja) 1985-01-19
JPH0234461B2 JPH0234461B2 (enExample) 1990-08-03

Family

ID=24013048

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59026236A Granted JPS6010648A (ja) 1983-06-20 1984-02-16 非円形ピン穴あき多層誘電体基板及びその製造方法

Country Status (3)

Country Link
EP (1) EP0129137B1 (enExample)
JP (1) JPS6010648A (enExample)
DE (1) DE3476505D1 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02297883A (ja) * 1989-01-26 1990-12-10 Teledyne Inc 電流制御を改善した印刷配線板
US6181219B1 (en) 1998-12-02 2001-01-30 Teradyne, Inc. Printed circuit board and method for fabricating such board
US7999192B2 (en) 2007-03-14 2011-08-16 Amphenol Corporation Adjacent plated through holes with staggered couplings for crosstalk reduction in high speed printed circuit boards
US11116863B2 (en) 2016-04-18 2021-09-14 Seoul Viosys Co., Ltd. Air cleaner

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5410452A (en) * 1994-02-18 1995-04-25 Aries Electronics, Inc. Printed circuit board electrical adaptor pin
GB9705277D0 (en) * 1997-03-14 1997-04-30 Kam Circuits Limited Improvements relating to printed circuit board pin location
TWI239798B (en) 1999-05-28 2005-09-11 Toppan Printing Co Ltd Photo electric wiring substrate, mounted substrate, and the manufacture method of the photo electric wiring substrate

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1021320A (en) * 1964-05-26 1966-03-02 Burndy Corp Microminiature electrical connection
US4193082A (en) * 1978-06-23 1980-03-11 International Business Machines Corporation Multi-layer dielectric structure
US4202007A (en) * 1978-06-23 1980-05-06 International Business Machines Corporation Multi-layer dielectric planar structure having an internal conductor pattern characterized with opposite terminations disposed at a common edge surface of the layers
FR2512315A1 (fr) * 1981-09-02 1983-03-04 Rouge Francois Ebauche de circuit electrique multicouche et procede de fabrication de circuits multicouches en comportant application
DE3150435A1 (de) * 1981-12-19 1983-06-30 Bosch Gmbh Robert Verfahren zum herstellen eines elektrischen bauteils

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02297883A (ja) * 1989-01-26 1990-12-10 Teledyne Inc 電流制御を改善した印刷配線板
US6181219B1 (en) 1998-12-02 2001-01-30 Teradyne, Inc. Printed circuit board and method for fabricating such board
US7999192B2 (en) 2007-03-14 2011-08-16 Amphenol Corporation Adjacent plated through holes with staggered couplings for crosstalk reduction in high speed printed circuit boards
US8481866B2 (en) 2007-03-14 2013-07-09 Amphenol Corporation Adjacent plated through holes with staggered couplings for crosstalk reduction in high speed printed circuit boards
US11116863B2 (en) 2016-04-18 2021-09-14 Seoul Viosys Co., Ltd. Air cleaner

Also Published As

Publication number Publication date
EP0129137B1 (en) 1989-01-25
JPH0234461B2 (enExample) 1990-08-03
EP0129137A3 (en) 1985-11-27
DE3476505D1 (en) 1989-03-02
EP0129137A2 (en) 1984-12-27

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