JPH0231782Y2 - - Google Patents
Info
- Publication number
- JPH0231782Y2 JPH0231782Y2 JP15827784U JP15827784U JPH0231782Y2 JP H0231782 Y2 JPH0231782 Y2 JP H0231782Y2 JP 15827784 U JP15827784 U JP 15827784U JP 15827784 U JP15827784 U JP 15827784U JP H0231782 Y2 JPH0231782 Y2 JP H0231782Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- electrolytic capacitor
- resin
- pedestal
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 29
- 229920005989 resin Polymers 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 17
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 229920006015 heat resistant resin Polymers 0.000 claims description 6
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 3
- 229910052731 fluorine Inorganic materials 0.000 claims description 3
- 239000011737 fluorine Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- -1 polybutylene terephthalate Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15827784U JPH0231782Y2 (US07923587-20110412-C00001.png) | 1984-10-18 | 1984-10-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15827784U JPH0231782Y2 (US07923587-20110412-C00001.png) | 1984-10-18 | 1984-10-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6172839U JPS6172839U (US07923587-20110412-C00001.png) | 1986-05-17 |
| JPH0231782Y2 true JPH0231782Y2 (US07923587-20110412-C00001.png) | 1990-08-28 |
Family
ID=30716257
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15827784U Expired JPH0231782Y2 (US07923587-20110412-C00001.png) | 1984-10-18 | 1984-10-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0231782Y2 (US07923587-20110412-C00001.png) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2847718B2 (ja) * | 1988-09-01 | 1999-01-20 | 松下電器産業株式会社 | チップ型電解コンデンサ |
| JPH0614464Y2 (ja) * | 1989-03-08 | 1994-04-13 | 信英通信工業株式会社 | 横置型電解コンデンサ |
| JPH0622976Y2 (ja) * | 1989-04-14 | 1994-06-15 | ニッセイ電機株式会社 | チップ形電子部品連 |
| JP7067210B2 (ja) * | 2018-04-03 | 2022-05-16 | 日本ケミコン株式会社 | コンデンサ、その製造方法およびコンデンサ用の台座 |
-
1984
- 1984-10-18 JP JP15827784U patent/JPH0231782Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6172839U (US07923587-20110412-C00001.png) | 1986-05-17 |
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