JPH0220156B2 - - Google Patents
Info
- Publication number
- JPH0220156B2 JPH0220156B2 JP12820484A JP12820484A JPH0220156B2 JP H0220156 B2 JPH0220156 B2 JP H0220156B2 JP 12820484 A JP12820484 A JP 12820484A JP 12820484 A JP12820484 A JP 12820484A JP H0220156 B2 JPH0220156 B2 JP H0220156B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- conductor circuit
- insulating layer
- metal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 27
- 239000002184 metal Substances 0.000 claims description 27
- 239000004020 conductor Substances 0.000 claims description 18
- 239000002131 composite material Substances 0.000 claims description 16
- 239000010410 layer Substances 0.000 claims description 15
- 238000001816 cooling Methods 0.000 claims description 9
- 239000012790 adhesive layer Substances 0.000 claims description 5
- 238000005304 joining Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 description 15
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000009413 insulation Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12820484A JPS617694A (ja) | 1984-06-21 | 1984-06-21 | 複合プリント配線板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12820484A JPS617694A (ja) | 1984-06-21 | 1984-06-21 | 複合プリント配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS617694A JPS617694A (ja) | 1986-01-14 |
| JPH0220156B2 true JPH0220156B2 (enrdf_load_stackoverflow) | 1990-05-08 |
Family
ID=14979045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12820484A Granted JPS617694A (ja) | 1984-06-21 | 1984-06-21 | 複合プリント配線板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS617694A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7099707B2 (en) | 1997-10-10 | 2006-08-29 | Cingular Wirless Ii, Llc | Method and system for providing power to a communications device |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06309923A (ja) * | 1993-04-26 | 1994-11-04 | Tafuto:Kk | 絶縁体を兼ねた放熱体及びその製造方法並びにそれを用いた低圧ヒータ及びその製造方法。 |
| JP4275004B2 (ja) | 2004-05-24 | 2009-06-10 | Ｈｏｙａ株式会社 | 内視鏡用高周波切断具 |
| JP4745673B2 (ja) | 2005-02-02 | 2011-08-10 | Ｈｏｙａ株式会社 | 内視鏡用高周波切開具 |
| JP4682017B2 (ja) | 2005-10-31 | 2011-05-11 | Ｈｏｙａ株式会社 | 内視鏡用高周波切開具 |
-
1984
- 1984-06-21 JP JP12820484A patent/JPS617694A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7099707B2 (en) | 1997-10-10 | 2006-08-29 | Cingular Wirless Ii, Llc | Method and system for providing power to a communications device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS617694A (ja) | 1986-01-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |