JP2000299564A5 - - Google Patents
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- Publication number
- JP2000299564A5 JP2000299564A5 JP1999107871A JP10787199A JP2000299564A5 JP 2000299564 A5 JP2000299564 A5 JP 2000299564A5 JP 1999107871 A JP1999107871 A JP 1999107871A JP 10787199 A JP10787199 A JP 10787199A JP 2000299564 A5 JP2000299564 A5 JP 2000299564A5
- Authority
- JP
- Japan
- Prior art keywords
- heat
- substrate
- build
- heat transfer
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010410 layer Substances 0.000 description 170
- 239000000758 substrate Substances 0.000 description 96
- 230000017525 heat dissipation Effects 0.000 description 48
- 239000011229 interlayer Substances 0.000 description 25
- 239000007769 metal material Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- 229910000679 solder Inorganic materials 0.000 description 10
- 230000000149 penetrating effect Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 238000009413 insulation Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 239000006071 cream Substances 0.000 description 6
- 239000002344 surface layer Substances 0.000 description 6
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11107871A JP2000299564A (ja) | 1999-04-15 | 1999-04-15 | 多層基板の放熱構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11107871A JP2000299564A (ja) | 1999-04-15 | 1999-04-15 | 多層基板の放熱構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000299564A JP2000299564A (ja) | 2000-10-24 |
| JP2000299564A5 true JP2000299564A5 (enrdf_load_stackoverflow) | 2006-06-01 |
Family
ID=14470212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11107871A Pending JP2000299564A (ja) | 1999-04-15 | 1999-04-15 | 多層基板の放熱構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000299564A (enrdf_load_stackoverflow) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004068923A1 (ja) * | 2003-01-28 | 2004-08-12 | Cmk Corporation | メタルコア多層プリント配線板 |
| KR100660126B1 (ko) * | 2004-06-24 | 2006-12-21 | 주식회사에스엘디 | 방열판 구조를 가진 회로 기판 |
| JP2016032080A (ja) * | 2014-07-30 | 2016-03-07 | 株式会社デンソー | 回路基板及び電子装置 |
| JP6981022B2 (ja) | 2017-03-17 | 2021-12-15 | セイコーエプソン株式会社 | プリント回路板および電子機器 |
| US11772829B2 (en) * | 2018-06-27 | 2023-10-03 | Mitsubishi Electric Corporation | Power supply device |
-
1999
- 1999-04-15 JP JP11107871A patent/JP2000299564A/ja active Pending
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