JPH021914Y2 - - Google Patents
Info
- Publication number
- JPH021914Y2 JPH021914Y2 JP1982197614U JP19761482U JPH021914Y2 JP H021914 Y2 JPH021914 Y2 JP H021914Y2 JP 1982197614 U JP1982197614 U JP 1982197614U JP 19761482 U JP19761482 U JP 19761482U JP H021914 Y2 JPH021914 Y2 JP H021914Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- insulating layer
- conductive layer
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000000149 penetrating effect Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000036039 immunity Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982197614U JPS5999497U (ja) | 1982-12-23 | 1982-12-23 | 電気回路のしやへい装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982197614U JPS5999497U (ja) | 1982-12-23 | 1982-12-23 | 電気回路のしやへい装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5999497U JPS5999497U (ja) | 1984-07-05 |
| JPH021914Y2 true JPH021914Y2 (US07652168-20100126-C00068.png) | 1990-01-17 |
Family
ID=30423052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1982197614U Granted JPS5999497U (ja) | 1982-12-23 | 1982-12-23 | 電気回路のしやへい装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5999497U (US07652168-20100126-C00068.png) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH079439Y2 (ja) * | 1987-10-08 | 1995-03-06 | ティーディーケイ株式会社 | 電子回路用基板のシールド構造 |
| JP2908188B2 (ja) * | 1993-08-17 | 1999-06-21 | 日本電気株式会社 | シールド構造 |
| JP6414763B1 (ja) * | 2017-08-31 | 2018-10-31 | 日新イオン機器株式会社 | イオンビーム照射装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5726899B2 (US07652168-20100126-C00068.png) * | 1974-12-28 | 1982-06-07 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53127167U (US07652168-20100126-C00068.png) * | 1977-03-17 | 1978-10-09 | ||
| JPS5726899U (US07652168-20100126-C00068.png) * | 1980-07-21 | 1982-02-12 |
-
1982
- 1982-12-23 JP JP1982197614U patent/JPS5999497U/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5726899B2 (US07652168-20100126-C00068.png) * | 1974-12-28 | 1982-06-07 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5999497U (ja) | 1984-07-05 |
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