JPS5999497U - 電気回路のしやへい装置 - Google Patents
電気回路のしやへい装置Info
- Publication number
- JPS5999497U JPS5999497U JP1982197614U JP19761482U JPS5999497U JP S5999497 U JPS5999497 U JP S5999497U JP 1982197614 U JP1982197614 U JP 1982197614U JP 19761482 U JP19761482 U JP 19761482U JP S5999497 U JPS5999497 U JP S5999497U
- Authority
- JP
- Japan
- Prior art keywords
- protection device
- electric circuit
- circuit protection
- insulating layer
- conductive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第1図は従来のしやへい装置を示す斜視図、第2図は第
1図のA−A’部の断面図、第3図は本考案の一実施例
を示す断面図である。 図中1はプリント基板、2は抵抗、3はトランース、4
は集積回路、10は絶縁層、11は導電層である。なお
、図中、同一符号は同−又は相当部分を示す。
1図のA−A’部の断面図、第3図は本考案の一実施例
を示す断面図である。 図中1はプリント基板、2は抵抗、3はトランース、4
は集積回路、10は絶縁層、11は導電層である。なお
、図中、同一符号は同−又は相当部分を示す。
Claims (1)
- 電気回路を形成する複数の電気部品、この各電気部品の
外面に一様に被着形成された絶縁層、この絶縁層の外面
に一様に被着形成された導電層を備え、上記導電層を接
地電位に維持することを特徴とした電気回路じゃ・\い
装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1982197614U JPS5999497U (ja) | 1982-12-23 | 1982-12-23 | 電気回路のしやへい装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1982197614U JPS5999497U (ja) | 1982-12-23 | 1982-12-23 | 電気回路のしやへい装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5999497U true JPS5999497U (ja) | 1984-07-05 |
JPH021914Y2 JPH021914Y2 (ja) | 1990-01-17 |
Family
ID=30423052
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1982197614U Granted JPS5999497U (ja) | 1982-12-23 | 1982-12-23 | 電気回路のしやへい装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5999497U (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0158998U (ja) * | 1987-10-08 | 1989-04-13 | ||
JPH0758484A (ja) * | 1993-08-17 | 1995-03-03 | Nec Corp | シールド構造 |
JP6414763B1 (ja) * | 2017-08-31 | 2018-10-31 | 日新イオン機器株式会社 | イオンビーム照射装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53127167U (ja) * | 1977-03-17 | 1978-10-09 | ||
JPS5726899U (ja) * | 1980-07-21 | 1982-02-12 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5179083A (ja) * | 1974-12-28 | 1976-07-09 | Hitachi Seiki Kk | Kudokiko |
-
1982
- 1982-12-23 JP JP1982197614U patent/JPS5999497U/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53127167U (ja) * | 1977-03-17 | 1978-10-09 | ||
JPS5726899U (ja) * | 1980-07-21 | 1982-02-12 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0158998U (ja) * | 1987-10-08 | 1989-04-13 | ||
JPH0758484A (ja) * | 1993-08-17 | 1995-03-03 | Nec Corp | シールド構造 |
JP6414763B1 (ja) * | 2017-08-31 | 2018-10-31 | 日新イオン機器株式会社 | イオンビーム照射装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH021914Y2 (ja) | 1990-01-17 |
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