JPH0216013B2 - - Google Patents

Info

Publication number
JPH0216013B2
JPH0216013B2 JP58206968A JP20696883A JPH0216013B2 JP H0216013 B2 JPH0216013 B2 JP H0216013B2 JP 58206968 A JP58206968 A JP 58206968A JP 20696883 A JP20696883 A JP 20696883A JP H0216013 B2 JPH0216013 B2 JP H0216013B2
Authority
JP
Japan
Prior art keywords
package
semiconductor chip
bonding
zil
bonding pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58206968A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6098652A (ja
Inventor
Toshuki Ogawa
Yoichi Hida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP20696883A priority Critical patent/JPS6098652A/ja
Publication of JPS6098652A publication Critical patent/JPS6098652A/ja
Publication of JPH0216013B2 publication Critical patent/JPH0216013B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP20696883A 1983-11-02 1983-11-02 半導体装置 Granted JPS6098652A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20696883A JPS6098652A (ja) 1983-11-02 1983-11-02 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20696883A JPS6098652A (ja) 1983-11-02 1983-11-02 半導体装置

Publications (2)

Publication Number Publication Date
JPS6098652A JPS6098652A (ja) 1985-06-01
JPH0216013B2 true JPH0216013B2 (enrdf_load_stackoverflow) 1990-04-13

Family

ID=16531982

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20696883A Granted JPS6098652A (ja) 1983-11-02 1983-11-02 半導体装置

Country Status (1)

Country Link
JP (1) JPS6098652A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0635910U (ja) * 1992-10-16 1994-05-13 株式会社ニコン ビーム射出装置
JPH0657572U (ja) * 1993-01-14 1994-08-09 レーザーテクノ株式会社 墨出し用レーザー装置
WO2023100383A1 (ja) 2021-11-30 2023-06-08 株式会社タムラ製作所 はんだ合金、はんだ接合材、ソルダペースト及び半導体パッケージ

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62114256A (ja) * 1985-11-13 1987-05-26 Mitsubishi Electric Corp 半導体装置
JPS63208235A (ja) * 1987-02-24 1988-08-29 Nec Corp 半導体装置
JP2763004B2 (ja) * 1987-10-20 1998-06-11 株式会社 日立製作所 半導体装置
US4990996A (en) * 1987-12-18 1991-02-05 Zilog, Inc. Bonding pad scheme
JP2560805B2 (ja) * 1988-10-06 1996-12-04 三菱電機株式会社 半導体装置
JPH03238839A (ja) * 1990-02-15 1991-10-24 Nec Corp 半導体集積回路装置
US5905300A (en) * 1994-03-31 1999-05-18 Vlsi Technology, Inc. Reinforced leadframe to substrate attachment
JP2679669B2 (ja) * 1995-02-28 1997-11-19 日本電気株式会社 半導体装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5531822Y2 (enrdf_load_stackoverflow) * 1974-12-05 1980-07-29
JPS5456360A (en) * 1977-10-14 1979-05-07 Hitachi Ltd Production of semiconductor chips
JPS5895044U (ja) * 1981-12-18 1983-06-28 セイコーインスツルメンツ株式会社 Ｉｃチツプの端子構造

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0635910U (ja) * 1992-10-16 1994-05-13 株式会社ニコン ビーム射出装置
JPH0657572U (ja) * 1993-01-14 1994-08-09 レーザーテクノ株式会社 墨出し用レーザー装置
WO2023100383A1 (ja) 2021-11-30 2023-06-08 株式会社タムラ製作所 はんだ合金、はんだ接合材、ソルダペースト及び半導体パッケージ

Also Published As

Publication number Publication date
JPS6098652A (ja) 1985-06-01

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