JP2703999B2 - 半導体製造装置 - Google Patents

半導体製造装置

Info

Publication number
JP2703999B2
JP2703999B2 JP1157722A JP15772289A JP2703999B2 JP 2703999 B2 JP2703999 B2 JP 2703999B2 JP 1157722 A JP1157722 A JP 1157722A JP 15772289 A JP15772289 A JP 15772289A JP 2703999 B2 JP2703999 B2 JP 2703999B2
Authority
JP
Japan
Prior art keywords
wire
tool
semiconductor manufacturing
ultrasonic horn
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1157722A
Other languages
English (en)
Other versions
JPH0322450A (ja
Inventor
直人 木村
Original Assignee
九州日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 九州日本電気株式会社 filed Critical 九州日本電気株式会社
Priority to JP1157722A priority Critical patent/JP2703999B2/ja
Publication of JPH0322450A publication Critical patent/JPH0322450A/ja
Application granted granted Critical
Publication of JP2703999B2 publication Critical patent/JP2703999B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H01L2224/78314—Shape
    • H01L2224/78317—Shape of other portions
    • H01L2224/78318—Shape of other portions inside the capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体製造装置に関し、特に超音波振動を利
用して内部接続を行う半導体製造装置に関する。
〔従来の技術〕
従来、この種の半導体製造装置は、第３図（ａ）の正
面図に示す様に、従来ツール９はケース10に固着された
ペレット６に対してほぼ垂直に位置し、ワイヤ４はペレ
ット６の面に対し90度未満に設定してあり、かつ超音波
ホーン７に明けられたホーンのワイヤ通し穴８も90度未
満に設けられていた。11は配線されたワイヤを示す。
〔発明が解決しようとする課題〕
上述した従来の半導体製造装置は、第２図（ａ）に示
した様に従来のツール９がペレット６に対してほぼ垂直
に取付けてあるために、第２図（ｂ）の側面図に示す様
に、隣接するAl細線で配線されたワイヤ11に接触し、ポ
ンディングできないという欠点があった。
〔課題を解決するための手段〕
本発明は、超音波振動を利用してペレットにワイヤを
接続する半導体接続装置において、ツールが超音波ホー
ンの先端部から逆方向に傾いて取り付けられると共に前
記超音波ホーンに開けられるワイヤ通し穴が前記ツール
の先端部のほぼ真上に開けられている半導体製造装置で
ある。
〔実施例〕
次に、本発明について図面を参照して説明する。第１
図は本発明の一実施例の正面図である。ツール１は超音
波ホーン７に取付けられており、Al細線のワイヤ４は超
音波ホーン７に明けられたホーンのワイヤ通し穴８を通
ってツールに明けられたツールのワイヤ通し穴３を通り
かつツール接合部２を経て、パッド５にて接合される。
本実施例におけるツール１は、超音波ホーン７の先端部
から逆方向に傾いた角度で超音波ホーン７に取り付けら
れ、更にワイヤ４もペレット６の面に垂直になるよう
に、ツールのワイヤ通し穴３及びホーンのワイヤ通し穴
８もペレット６の面に対しほぼ垂直に明けられている。
又、ホーンのワイヤ通し穴８はパッド５のほぼ真上にく
るように超音波ホーン７に設けられている。又、ツール
接合部２もペレット６の面に平行になるように形成され
ている。
〔発明の効果〕
以上説明した様に本発明は、ツールをペレット表面か
ら前方に傾け、かつ超音波ホーンにおけるワイヤ通し穴
をパッドのほぼ真上に設けることにより、近接したワイ
ヤ間隔の状態でも、ツールが隣接するワイヤに接触しな
くなるためボンディングが可能になるという効果があ
る。
【図面の簡単な説明】
第１図は本発明の一実施例の正面図、第２図（ａ）は従
来の半導体製造装置の正面図、第２図（ｂ）は従来の配
線状態を示す側面図である。 １……ツール、２……ツール接合部、３……ツールのワ
イヤ通し穴、４……ワイヤ、５……パッド、６……ペレ
ット、７……超音波ホーン、８……ホーンのワイヤ通し
穴、９……従来ツール、10……ケース、11……配線され
たワイヤ。

Claims (1)

    (57)【特許請求の範囲】
  1. 【請求項１】超音波振動を利用してペレットにワイヤを
    接続する半導体接続装置において、ツールが超音波ホー
    ンの先端部から逆方向に傾いて取り付けられると共に前
    記超音波ホーンに開けられるワイヤ通し穴が前記ツール
    の先端部のほぼ真上に開けられていることを特徴とする
    半導体製造装置。
JP1157722A 1989-06-19 1989-06-19 半導体製造装置 Expired - Fee Related JP2703999B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1157722A JP2703999B2 (ja) 1989-06-19 1989-06-19 半導体製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1157722A JP2703999B2 (ja) 1989-06-19 1989-06-19 半導体製造装置

Publications (2)

Publication Number Publication Date
JPH0322450A JPH0322450A (ja) 1991-01-30
JP2703999B2 true JP2703999B2 (ja) 1998-01-26

Family

ID=15655941

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1157722A Expired - Fee Related JP2703999B2 (ja) 1989-06-19 1989-06-19 半導体製造装置

Country Status (1)

Country Link
JP (1) JP2703999B2 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5495976A (en) * 1994-05-27 1996-03-05 Kulicke And Soffa Investments, Inc. Tilted wedge bonding tool
JP2014027234A (ja) * 2012-07-30 2014-02-06 Nagano Keiki Co Ltd ワイヤボンディング装置及びワイヤボンディング方法

Also Published As

Publication number Publication date
JPH0322450A (ja) 1991-01-30

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