JPS58118758U - Led表示装置 - Google Patents
Led表示装置Info
- Publication number
- JPS58118758U JPS58118758U JP1982014029U JP1402982U JPS58118758U JP S58118758 U JPS58118758 U JP S58118758U JP 1982014029 U JP1982014029 U JP 1982014029U JP 1402982 U JP1402982 U JP 1402982U JP S58118758 U JPS58118758 U JP S58118758U
- Authority
- JP
- Japan
- Prior art keywords
- display device
- led display
- hole
- printed wiring
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
- H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
- H01L2224/8518—Translational movements
- H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第1図は従来のLED表示装置の°要部斜視図、第2図
はこの考案に係る一実施例の要部斜視図1、 第3図は
第2図の■−■線断面図、第4図は超音波ボンディング
作業の説明図である。 1・・・フレキシブルプリント配線基板、3・・・LE
D取付部、4・・・LEDチップ(表示素子)、5・・
・リードワイヤ(表示素子)、6,1o・・・補強基板
、11・・・孔。
はこの考案に係る一実施例の要部斜視図1、 第3図は
第2図の■−■線断面図、第4図は超音波ボンディング
作業の説明図である。 1・・・フレキシブルプリント配線基板、3・・・LE
D取付部、4・・・LEDチップ(表示素子)、5・・
・リードワイヤ(表示素子)、6,1o・・・補強基板
、11・・・孔。
Claims (1)
- フレキシブルプリント配線基板のLED取付部に補強基
板を接着してなるLED表示装置において、前記補強基
板に孔を設け、この孔内にプリント配線基板上の表示素
子を配置するように構成したことを特徴とするLED表
示装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1982014029U JPS58118758U (ja) | 1982-02-05 | 1982-02-05 | Led表示装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1982014029U JPS58118758U (ja) | 1982-02-05 | 1982-02-05 | Led表示装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58118758U true JPS58118758U (ja) | 1983-08-13 |
JPS6320135Y2 JPS6320135Y2 (ja) | 1988-06-03 |
Family
ID=30026508
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1982014029U Granted JPS58118758U (ja) | 1982-02-05 | 1982-02-05 | Led表示装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58118758U (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004507114A (ja) * | 2000-08-23 | 2004-03-04 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | 光電的構成素子及びその製造方法並びに複数の光電的構成素子を備えたモジュール及びそのようなモジュールを備えた装置 |
JP2006245272A (ja) * | 2005-03-03 | 2006-09-14 | Citizen Electronics Co Ltd | 発光ダイオード装置及び面状光源ユニット並びにメータ |
WO2022158410A1 (ja) * | 2021-01-25 | 2022-07-28 | 古河電気工業株式会社 | 光学装置、光学装置のサブアセンブリ、および光学装置の製造方法 |
-
1982
- 1982-02-05 JP JP1982014029U patent/JPS58118758U/ja active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004507114A (ja) * | 2000-08-23 | 2004-03-04 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | 光電的構成素子及びその製造方法並びに複数の光電的構成素子を備えたモジュール及びそのようなモジュールを備えた装置 |
JP2006245272A (ja) * | 2005-03-03 | 2006-09-14 | Citizen Electronics Co Ltd | 発光ダイオード装置及び面状光源ユニット並びにメータ |
WO2022158410A1 (ja) * | 2021-01-25 | 2022-07-28 | 古河電気工業株式会社 | 光学装置、光学装置のサブアセンブリ、および光学装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS6320135Y2 (ja) | 1988-06-03 |
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