JPS6033446U - Ｉｃパツケ−ジ - Google Patents

Ｉｃパツケ−ジ

Info

Publication number
JPS6033446U
JPS6033446U JP1983123752U JP12375283U JPS6033446U JP S6033446 U JPS6033446 U JP S6033446U JP 1983123752 U JP1983123752 U JP 1983123752U JP 12375283 U JP12375283 U JP 12375283U JP S6033446 U JPS6033446 U JP S6033446U
Authority
JP
Japan
Prior art keywords
pad
lead frame
input
chip
negative logic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983123752U
Other languages
English (en)
Inventor
信田　裕明
Original Assignee
住友電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 住友電気工業株式会社 filed Critical 住友電気工業株式会社
Priority to JP1983123752U priority Critical patent/JPS6033446U/ja
Publication of JPS6033446U publication Critical patent/JPS6033446U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05553—Shape in top view being rectangular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601—Structure
    • H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は本考案によるＩＣパッケージの部分的平面図、
第２図ａ、　ｂは負論理入力及び正論理入力の説明図で
ある。 図面中、１ａは接地用リード板、１ｂは電源用リード板
、１ｃは信号入力用リード板、１ａ′。 ｌｂ’、ｌｃ’はパッド部、２はＩＣチップ、２ａは正
論理人力パッド、２ｂは負論理人力バッド、２ｃは正論
理処理用パッド、２ｄは負論理処理用パッド、３ａ、３
ｂはＩＣ内配線、４ａ、４ｂ、４ｃ、４ｄはボンデング
ワイヤである。

Claims (1)

    【実用新案登録請求の範囲】
  1. リードフレームとその中央に配置されたＩＣチップから
    なるＩＣパッケージにおいて、上記リードフレームは、
    上記ＩＣチップを隔てて配置された先端部に複数本のリ
    ード線をボンデングできる巾広のボンデングパッド部を
    備えた電源用リード板と、接地用リード板とを備えてい
    て、上記ＩＣチップは、上記リードフレームの信号人力
    パッドに対向して正論理人力パッドと、負論理入力パッ
    ドと、該正論理人力パッドから分岐され上記接地用リー
    ド板のボンデングパッドに対向して設けられた正論理処
    理用パッドと、上記負論理人力パッドから分岐され、上
    記電源用リード板のボンデングパッドに対向して設けら
    れた負論理処理用パッドとを備え、外部から入力される
    信号が正論理入力あるいは負論理入力に対応して、正論
    理入力の場合は、上記ＩＣチップの正論理人力パッドと
    上−記リードフレームの信号人力パッド並びに上記負論
    理処理用パッドと上記リードフレームの電源用リード板
    のボンデングパッドとをそれぞれワイヤボンデングし、
    負論理入力の場合は、上記ＩＣチップの負論理入力パッ
    ドと上記リードフレームの信号入力パッド並びに上記正
    論理処理用パッドと上記リードフレームの接地用リード
    板のボンデングパッドとをそれぞれワイヤボンデングす
    ることを特徴とするＩＣパッケージ。
JP1983123752U 1983-08-11 1983-08-11 Ｉｃパツケ−ジ Pending JPS6033446U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983123752U JPS6033446U (ja) 1983-08-11 1983-08-11 Ｉｃパツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983123752U JPS6033446U (ja) 1983-08-11 1983-08-11 Ｉｃパツケ−ジ

Publications (1)

Publication Number Publication Date
JPS6033446U true JPS6033446U (ja) 1985-03-07

Family

ID=30282369

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983123752U Pending JPS6033446U (ja) 1983-08-11 1983-08-11 Ｉｃパツケ−ジ

Country Status (1)

Country Link
JP (1) JPS6033446U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020014321A (ja) * 2018-07-18 2020-01-23 東芝三菱電機産業システム株式会社 電力変換装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020014321A (ja) * 2018-07-18 2020-01-23 東芝三菱電機産業システム株式会社 電力変換装置

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