JPH0160948B2 - - Google Patents

Info

Publication number
JPH0160948B2
JPH0160948B2 JP59201469A JP20146984A JPH0160948B2 JP H0160948 B2 JPH0160948 B2 JP H0160948B2 JP 59201469 A JP59201469 A JP 59201469A JP 20146984 A JP20146984 A JP 20146984A JP H0160948 B2 JPH0160948 B2 JP H0160948B2
Authority
JP
Japan
Prior art keywords
surface layer
oxygen
strength
plating
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59201469A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6180844A (ja
Inventor
Shoji Shiga
Tooru Tanigawa
Hiroki Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP59201469A priority Critical patent/JPS6180844A/ja
Publication of JPS6180844A publication Critical patent/JPS6180844A/ja
Publication of JPH0160948B2 publication Critical patent/JPH0160948B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H10W70/457—Materials of metallic layers on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP59201469A 1984-09-28 1984-09-28 半導体リ−ドフレ−ム用条材 Granted JPS6180844A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59201469A JPS6180844A (ja) 1984-09-28 1984-09-28 半導体リ−ドフレ−ム用条材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59201469A JPS6180844A (ja) 1984-09-28 1984-09-28 半導体リ−ドフレ−ム用条材

Publications (2)

Publication Number Publication Date
JPS6180844A JPS6180844A (ja) 1986-04-24
JPH0160948B2 true JPH0160948B2 (2) 1989-12-26

Family

ID=16441598

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59201469A Granted JPS6180844A (ja) 1984-09-28 1984-09-28 半導体リ−ドフレ−ム用条材

Country Status (1)

Country Link
JP (1) JPS6180844A (2)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100322975B1 (ko) * 1997-02-03 2002-02-02 소네하라 다카시 리드 프레임재

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6034265B2 (ja) * 1976-06-09 1985-08-07 株式会社日立製作所 電子部品
JPS53141577A (en) * 1977-05-17 1978-12-09 Mitsubishi Electric Corp Lead frame for integrated circuit
JPS57122554A (en) * 1981-01-22 1982-07-30 Toshiba Corp Lead frame for semiconductor device
JPS5867053A (ja) * 1981-10-19 1983-04-21 Toshiba Corp リ−ドフレ−ム
JPS58169947A (ja) * 1982-02-08 1983-10-06 Nippon Gakki Seizo Kk 半導体用リ−ドフレ−ム及びその製法
JPS58191456A (ja) * 1982-04-30 1983-11-08 Nippon Gakki Seizo Kk 半導体用リ−ドフレ−ム及びその製法
JPS5958833A (ja) * 1982-09-28 1984-04-04 Shinkawa Ltd 半導体装置
JPS60183758A (ja) * 1984-03-02 1985-09-19 Nec Corp リ−ドフレ−ム

Also Published As

Publication number Publication date
JPS6180844A (ja) 1986-04-24

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