JPH0137879B2 - - Google Patents
Info
- Publication number
- JPH0137879B2 JPH0137879B2 JP59068010A JP6801084A JPH0137879B2 JP H0137879 B2 JPH0137879 B2 JP H0137879B2 JP 59068010 A JP59068010 A JP 59068010A JP 6801084 A JP6801084 A JP 6801084A JP H0137879 B2 JPH0137879 B2 JP H0137879B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- thin film
- ground
- ceramic
- multilayer wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6801084A JPS60211897A (ja) | 1984-04-05 | 1984-04-05 | 多層配線基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6801084A JPS60211897A (ja) | 1984-04-05 | 1984-04-05 | 多層配線基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60211897A JPS60211897A (ja) | 1985-10-24 |
JPH0137879B2 true JPH0137879B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-08-09 |
Family
ID=13361448
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6801084A Granted JPS60211897A (ja) | 1984-04-05 | 1984-04-05 | 多層配線基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60211897A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0716100B2 (ja) * | 1990-01-10 | 1995-02-22 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 多層配線モジュール |
JPH085579Y2 (ja) * | 1990-02-08 | 1996-02-14 | 新光電気工業株式会社 | 薄膜配線基板 |
JP2579046B2 (ja) * | 1990-09-19 | 1997-02-05 | 日本電気株式会社 | 多層配線基板 |
JPH04132295A (ja) * | 1990-09-21 | 1992-05-06 | Nec Corp | 多層配線基板 |
JPH04252095A (ja) * | 1991-01-28 | 1992-09-08 | Fujitsu Ltd | セラミックプリント配線板 |
JPH07123150B2 (ja) * | 1992-03-06 | 1995-12-25 | インターナショナル・ビジネス・マシーンズ・コーポレイション | ハイブリッド半導体モジュール |
US6613986B1 (en) * | 1998-09-17 | 2003-09-02 | Ibiden Co., Ltd. | Multilayer build-up wiring board |
US9818682B2 (en) * | 2014-12-03 | 2017-11-14 | International Business Machines Corporation | Laminate substrates having radial cut metallic planes |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56160100A (en) * | 1980-05-13 | 1981-12-09 | Nippon Electric Co | Multilayer thick film circuit board |
JPS5957976A (ja) * | 1982-09-27 | 1984-04-03 | 日本特殊陶業株式会社 | 金属膜積層セラミツクス |
FR2618258B1 (fr) * | 1987-07-17 | 1990-01-05 | Suisse Electronique Microtech | Detecteur de particules ionisantes. |
-
1984
- 1984-04-05 JP JP6801084A patent/JPS60211897A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS60211897A (ja) | 1985-10-24 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |