JPH0132649B2 - - Google Patents

Info

Publication number
JPH0132649B2
JPH0132649B2 JP56053256A JP5325681A JPH0132649B2 JP H0132649 B2 JPH0132649 B2 JP H0132649B2 JP 56053256 A JP56053256 A JP 56053256A JP 5325681 A JP5325681 A JP 5325681A JP H0132649 B2 JPH0132649 B2 JP H0132649B2
Authority
JP
Japan
Prior art keywords
alignment
wafer
mask
source
radiant energy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56053256A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56157033A (en
Inventor
Fuerudoman Maachin
Deiuitsudo Howaito Aran
Roorensu Howaito Donarudo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
AT&T Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&T Technologies Inc filed Critical AT&T Technologies Inc
Publication of JPS56157033A publication Critical patent/JPS56157033A/ja
Publication of JPH0132649B2 publication Critical patent/JPH0132649B2/ja
Granted legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073Alignment marks and their environment
    • G03F9/7076Mark details, e.g. phase grating mark, temporary mark
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/703Gap setting, e.g. in proximity printer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP5325681A 1980-04-11 1981-04-10 Method and device for positioning mask and wafer Granted JPS56157033A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/139,544 US4326805A (en) 1980-04-11 1980-04-11 Method and apparatus for aligning mask and wafer members

Publications (2)

Publication Number Publication Date
JPS56157033A JPS56157033A (en) 1981-12-04
JPH0132649B2 true JPH0132649B2 (en, 2012) 1989-07-10

Family

ID=22487191

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5325681A Granted JPS56157033A (en) 1980-04-11 1981-04-10 Method and device for positioning mask and wafer

Country Status (9)

Country Link
US (1) US4326805A (en, 2012)
JP (1) JPS56157033A (en, 2012)
BE (1) BE888344A (en, 2012)
CA (1) CA1154175A (en, 2012)
DE (1) DE3114682A1 (en, 2012)
FR (1) FR2482285A1 (en, 2012)
GB (1) GB2073950B (en, 2012)
IT (1) IT1137326B (en, 2012)
NL (1) NL189632C (en, 2012)

Families Citing this family (105)

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FR2538923A1 (fr) * 1982-12-30 1984-07-06 Thomson Csf Procede et dispositif d'alignement optique de motifs dans deux plans rapproches dans un appareil d'exposition comprenant une source de rayonnement divergent
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US4614433A (en) * 1984-07-09 1986-09-30 At&T Bell Laboratories Mask-to-wafer alignment utilizing zone plates
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JP2623757B2 (ja) * 1988-09-05 1997-06-25 キヤノン株式会社 位置合わせ装置
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US5319444A (en) * 1988-02-16 1994-06-07 Canon Kabushiki Kaisha Position detecting method and apparatus
US5325176A (en) * 1988-02-16 1994-06-28 Canon Kabushiki Kaisha Position detecting method and apparatus including Fraunhofer diffraction detector
EP0329430B1 (en) * 1988-02-16 1992-07-01 Canon Kabushiki Kaisha Position detecting device
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JP2660077B2 (ja) * 1988-03-16 1997-10-08 ジーイーシー ― マルコニ リミテッド フリップチップ接着された装置用の副尺構造
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JPS6432625A (en) * 1988-05-06 1989-02-02 Hitachi Ltd Exposure method for semiconductor
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JP2626076B2 (ja) * 1988-09-09 1997-07-02 キヤノン株式会社 位置検出装置
US5155370A (en) * 1988-09-09 1992-10-13 Canon Kabushiki Kaisha Device for detecting the relative position of first and second objects
DE68929314T2 (de) * 1988-09-09 2002-05-02 Canon K.K., Tokio/Tokyo Vorrichtung zur Detektion der Positionsrelation zwischen zwei Objekten
JP2546350B2 (ja) * 1988-09-09 1996-10-23 キヤノン株式会社 位置合わせ装置
JP2704002B2 (ja) * 1989-07-18 1998-01-26 キヤノン株式会社 位置検出方法
JP2704001B2 (ja) * 1989-07-18 1998-01-26 キヤノン株式会社 位置検出装置
US5114236A (en) * 1989-08-04 1992-05-19 Canon Kabushiki Kaisha Position detection method and apparatus
US5225892A (en) * 1990-02-05 1993-07-06 Canon Kabushiki Kaisha Positional deviation detecting method
EP0455443B1 (en) * 1990-05-01 1997-11-12 Canon Kabushiki Kaisha Positional deviation detecting method and apparatus
US5200800A (en) * 1990-05-01 1993-04-06 Canon Kabushiki Kaisha Position detecting method and apparatus
JP2890943B2 (ja) * 1990-11-30 1999-05-17 キヤノン株式会社 位置検出方法及びそれを用いた位置検出装置
US5495336A (en) * 1992-02-04 1996-02-27 Canon Kabushiki Kaisha Position detecting method for detecting a positional relationship between a first object and a second object
JP3008654B2 (ja) * 1992-02-21 2000-02-14 キヤノン株式会社 位置検出装置
US5455679A (en) * 1993-02-22 1995-10-03 Canon Kabushiki Kaisha Position detecting system
US5667918A (en) * 1993-09-27 1997-09-16 Micron Technology, Inc. Method of lithography using reticle pattern blinders
JP3428705B2 (ja) * 1993-10-20 2003-07-22 キヤノン株式会社 位置検出装置及びそれを用いた半導体素子の製造方法
JP3368017B2 (ja) * 1993-10-29 2003-01-20 キヤノン株式会社 位置検出装置及びそれを用いた半導体素子の製造方法
JPH07135168A (ja) * 1993-11-11 1995-05-23 Canon Inc アライメント方法及びそれを用いた位置検出装置
DE69637249T2 (de) 1995-07-06 2008-06-12 Dai Nippon Printing Co., Ltd. Holographisches Farbfilter und sein Herstellungsverfahren
JP3352286B2 (ja) * 1995-07-13 2002-12-03 キヤノン株式会社 位置制御方法及び装置並びにそれを使用した半導体製造装置
JP3292022B2 (ja) * 1996-01-17 2002-06-17 キヤノン株式会社 位置検出装置及びそれを用いた半導体素子の製造方法
JPH1022213A (ja) * 1996-06-28 1998-01-23 Canon Inc 位置検出装置及びそれを用いたデバイスの製造方法
US5700732A (en) * 1996-08-02 1997-12-23 Micron Technology, Inc. Semiconductor wafer, wafer alignment patterns and method of forming wafer alignment patterns
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US5851701A (en) * 1997-04-01 1998-12-22 Micron Technology, Inc. Atom lithographic mask having diffraction grating and attenuated phase shifters
JPH11241908A (ja) 1997-12-03 1999-09-07 Canon Inc 位置検出装置及びそれを用いたデバイスの製造方法
US6303272B1 (en) * 1998-11-13 2001-10-16 International Business Machines Corporation Process for self-alignment of sub-critical contacts to wiring
US6873087B1 (en) 1999-10-29 2005-03-29 Board Of Regents, The University Of Texas System High precision orientation alignment and gap control stages for imprint lithography processes
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CN100504598C (zh) * 2000-07-16 2009-06-24 得克萨斯州大学系统董事会 用于平版印刷工艺中的高分辨率重叠对齐方法和系统
CN1262883C (zh) 2000-07-17 2006-07-05 得克萨斯州大学系统董事会 影印用于平版印刷工艺中的自动化液体分配的方法和系统
CN1221858C (zh) * 2000-08-01 2005-10-05 得克萨斯州大学系统董事会 判定模板与衬底之间的间隔的方法
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US6563566B2 (en) * 2001-01-29 2003-05-13 International Business Machines Corporation System and method for printing semiconductor patterns using an optimized illumination and reticle
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US6885429B2 (en) * 2002-06-28 2005-04-26 Asml Holding N.V. System and method for automated focus measuring of a lithography tool
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CN103091993B (zh) * 2011-11-02 2015-02-11 上海微电子装备有限公司 用于光刻机透镜热效应测量的测试标记及其测量方法
CN114217370B (zh) * 2021-12-16 2024-09-20 西安工业大学 宽带消色差聚焦与偏振调控的微结构波带片及设计方法

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Also Published As

Publication number Publication date
JPS56157033A (en) 1981-12-04
IT8121022A0 (it) 1981-04-09
DE3114682C2 (en, 2012) 1987-05-21
BE888344A (fr) 1981-07-31
DE3114682A1 (de) 1981-12-24
NL189632B (nl) 1993-01-04
US4326805A (en) 1982-04-27
IT1137326B (it) 1986-09-10
GB2073950A (en) 1981-10-21
FR2482285A1 (fr) 1981-11-13
CA1154175A (en) 1983-09-20
GB2073950B (en) 1984-04-18
NL8101776A (nl) 1981-11-02
NL189632C (nl) 1993-06-01
FR2482285B1 (en, 2012) 1985-02-01

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