JPH0120537B2 - - Google Patents

Info

Publication number
JPH0120537B2
JPH0120537B2 JP55010281A JP1028180A JPH0120537B2 JP H0120537 B2 JPH0120537 B2 JP H0120537B2 JP 55010281 A JP55010281 A JP 55010281A JP 1028180 A JP1028180 A JP 1028180A JP H0120537 B2 JPH0120537 B2 JP H0120537B2
Authority
JP
Japan
Prior art keywords
wiring
polysilicon
transistor
layer
layer wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55010281A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56108242A (en
Inventor
Soichi Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP1028180A priority Critical patent/JPS56108242A/ja
Publication of JPS56108242A publication Critical patent/JPS56108242A/ja
Publication of JPH0120537B2 publication Critical patent/JPH0120537B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Bipolar Integrated Circuits (AREA)
JP1028180A 1980-01-31 1980-01-31 Master slice semiconductor device Granted JPS56108242A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1028180A JPS56108242A (en) 1980-01-31 1980-01-31 Master slice semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1028180A JPS56108242A (en) 1980-01-31 1980-01-31 Master slice semiconductor device

Publications (2)

Publication Number Publication Date
JPS56108242A JPS56108242A (en) 1981-08-27
JPH0120537B2 true JPH0120537B2 (enrdf_load_stackoverflow) 1989-04-17

Family

ID=11745921

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1028180A Granted JPS56108242A (en) 1980-01-31 1980-01-31 Master slice semiconductor device

Country Status (1)

Country Link
JP (1) JPS56108242A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5874052A (ja) * 1981-10-29 1983-05-04 Nec Corp マスタ−スライス半導体集積回路装置
JPS58139445A (ja) * 1982-02-15 1983-08-18 Nec Corp 半導体集積回路装置
JPH0824177B2 (ja) * 1992-11-13 1996-03-06 セイコーエプソン株式会社 半導体装置
JP2010203898A (ja) 2009-03-03 2010-09-16 Renesas Electronics Corp 半導体装置のテスト回路、半導体装置及びその製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3884632A (en) * 1973-03-14 1975-05-20 Mc Graw Edison Co Continuous durable-press processing of fabric and garments
JPS5120268A (en) * 1974-08-08 1976-02-18 Takashi Ishikawa Taika * tainetsusei goseijushi
JPS5493344A (en) * 1977-12-30 1979-07-24 Fujitsu Ltd Semiconductor integrated circuit

Also Published As

Publication number Publication date
JPS56108242A (en) 1981-08-27

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