JPH01150493A - はんだ付け用一時接着剤 - Google Patents
はんだ付け用一時接着剤Info
- Publication number
- JPH01150493A JPH01150493A JP62310522A JP31052287A JPH01150493A JP H01150493 A JPH01150493 A JP H01150493A JP 62310522 A JP62310522 A JP 62310522A JP 31052287 A JP31052287 A JP 31052287A JP H01150493 A JPH01150493 A JP H01150493A
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- adhesive
- rosin
- sorbitol
- thixotropic agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 36
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 36
- 238000005476 soldering Methods 0.000 title claims abstract description 29
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims abstract description 20
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims abstract description 20
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229920005989 resin Polymers 0.000 claims abstract description 10
- 239000011347 resin Substances 0.000 claims abstract description 10
- 239000013008 thixotropic agent Substances 0.000 claims abstract description 10
- FMZUHGYZWYNSOA-VVBFYGJXSA-N (1r)-1-[(4r,4ar,8as)-2,6-diphenyl-4,4a,8,8a-tetrahydro-[1,3]dioxino[5,4-d][1,3]dioxin-4-yl]ethane-1,2-diol Chemical compound C([C@@H]1OC(O[C@@H]([C@@H]1O1)[C@H](O)CO)C=2C=CC=CC=2)OC1C1=CC=CC=C1 FMZUHGYZWYNSOA-VVBFYGJXSA-N 0.000 claims abstract description 6
- 229940087101 dibenzylidene sorbitol Drugs 0.000 claims abstract description 6
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 claims abstract description 4
- 239000000600 sorbitol Substances 0.000 claims abstract description 4
- HZVFRKSYUGFFEJ-YVECIDJPSA-N (2r,3r,4s,5r)-7-phenylhept-6-ene-1,2,3,4,5,6-hexol Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=CC1=CC=CC=C1 HZVFRKSYUGFFEJ-YVECIDJPSA-N 0.000 claims abstract description 3
- 239000003960 organic solvent Substances 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims 1
- 239000002904 solvent Substances 0.000 abstract description 5
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 abstract description 4
- 239000003795 chemical substances by application Substances 0.000 abstract description 4
- 230000004907 flux Effects 0.000 abstract description 4
- 239000005711 Benzoic acid Substances 0.000 abstract description 2
- 235000010233 benzoic acid Nutrition 0.000 abstract description 2
- 235000010356 sorbitol Nutrition 0.000 abstract 3
- 125000000649 benzylidene group Chemical group [H]C(=[*])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 abstract 1
- 239000007859 condensation product Substances 0.000 abstract 1
- 230000002542 deteriorative effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 8
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 7
- 238000004140 cleaning Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- -1 alcohol ester Chemical class 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- DEXFNLNNUZKHNO-UHFFFAOYSA-N 6-[3-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperidin-1-yl]-3-oxopropyl]-3H-1,3-benzoxazol-2-one Chemical group C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1CCN(CC1)C(CCC1=CC2=C(NC(O2)=O)C=C1)=O DEXFNLNNUZKHNO-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- QZAYGJVTTNCVMB-UHFFFAOYSA-N Serotonin Natural products C1=C(O)C=C2C(CCN)=CNC2=C1 QZAYGJVTTNCVMB-UHFFFAOYSA-N 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- WZTPDZAHPLOIOS-UHFFFAOYSA-N ethanol;nitromethane;1,1,2-trichloro-1,2,2-trifluoroethane Chemical compound CCO.C[N+]([O-])=O.FC(F)(Cl)C(F)(Cl)Cl WZTPDZAHPLOIOS-UHFFFAOYSA-N 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000006224 matting agent Substances 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229940076279 serotonin Drugs 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Breeding Of Plants And Reproduction By Means Of Culturing (AREA)
- Micro-Organisms Or Cultivation Processes Thereof (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62310522A JPH01150493A (ja) | 1987-12-08 | 1987-12-08 | はんだ付け用一時接着剤 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62310522A JPH01150493A (ja) | 1987-12-08 | 1987-12-08 | はんだ付け用一時接着剤 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01150493A true JPH01150493A (ja) | 1989-06-13 |
| JPH0457436B2 JPH0457436B2 (OSRAM) | 1992-09-11 |
Family
ID=18006241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62310522A Granted JPH01150493A (ja) | 1987-12-08 | 1987-12-08 | はんだ付け用一時接着剤 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01150493A (OSRAM) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03179072A (ja) * | 1989-09-05 | 1991-08-05 | Senju Metal Ind Co Ltd | 電子部品の仮固定用粘着剤 |
| JP2000144082A (ja) * | 1998-11-16 | 2000-05-26 | Minnesota Mining & Mfg Co <3M> | 熱硬化性接着剤組成物、接着剤、および接着剤の製造方法 |
| JP2000265151A (ja) * | 1999-03-17 | 2000-09-26 | The Inctec Inc | 液状仮着接着剤 |
| JP2005223088A (ja) * | 2004-02-04 | 2005-08-18 | Stanley Electric Co Ltd | 半導体装置の製造方法及び半導体装置 |
| CN100349688C (zh) * | 2005-07-16 | 2007-11-21 | 李昕 | 用于配制焊锡膏的焊剂组合物 |
| JP2019147177A (ja) * | 2018-02-28 | 2019-09-05 | 千住金属工業株式会社 | フラックス及びソルダペースト |
| JPWO2022195937A1 (OSRAM) * | 2021-03-18 | 2022-09-22 | ||
| JPWO2022254819A1 (OSRAM) * | 2021-06-03 | 2022-12-08 | ||
| JPWO2022254818A1 (OSRAM) * | 2021-06-03 | 2022-12-08 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58177306A (ja) * | 1982-04-10 | 1983-10-18 | 信越産業株式会社 | 型枠剥離用組成物 |
-
1987
- 1987-12-08 JP JP62310522A patent/JPH01150493A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58177306A (ja) * | 1982-04-10 | 1983-10-18 | 信越産業株式会社 | 型枠剥離用組成物 |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03179072A (ja) * | 1989-09-05 | 1991-08-05 | Senju Metal Ind Co Ltd | 電子部品の仮固定用粘着剤 |
| JP2000144082A (ja) * | 1998-11-16 | 2000-05-26 | Minnesota Mining & Mfg Co <3M> | 熱硬化性接着剤組成物、接着剤、および接着剤の製造方法 |
| JP2000265151A (ja) * | 1999-03-17 | 2000-09-26 | The Inctec Inc | 液状仮着接着剤 |
| JP2005223088A (ja) * | 2004-02-04 | 2005-08-18 | Stanley Electric Co Ltd | 半導体装置の製造方法及び半導体装置 |
| CN100349688C (zh) * | 2005-07-16 | 2007-11-21 | 李昕 | 用于配制焊锡膏的焊剂组合物 |
| JP2019147177A (ja) * | 2018-02-28 | 2019-09-05 | 千住金属工業株式会社 | フラックス及びソルダペースト |
| WO2019167329A1 (ja) * | 2018-02-28 | 2019-09-06 | 千住金属工業株式会社 | フラックス及びソルダペースト |
| US10987764B2 (en) | 2018-02-28 | 2021-04-27 | Senju Metal Industry Co., Ltd. | Flux and solder paste |
| JPWO2022195937A1 (OSRAM) * | 2021-03-18 | 2022-09-22 | ||
| WO2022195937A1 (ja) * | 2021-03-18 | 2022-09-22 | パナソニックＩｐマネジメント株式会社 | 半田プリコートに電子部品を仮止めするための粘着剤および電子部品実装基板の製造方法 |
| US12484157B2 (en) | 2021-03-18 | 2025-11-25 | Panasonic Intellectual Property Management Co., Ltd. | Adhesive for provisionally fixing electronic component to solder precoat and method for producing electronic component mounted substrate |
| JPWO2022254819A1 (OSRAM) * | 2021-06-03 | 2022-12-08 | ||
| JPWO2022254818A1 (OSRAM) * | 2021-06-03 | 2022-12-08 | ||
| WO2022254819A1 (ja) * | 2021-06-03 | 2022-12-08 | パナソニックＩｐマネジメント株式会社 | 電子部品実装基板の製造方法 |
| WO2022254818A1 (ja) * | 2021-06-03 | 2022-12-08 | パナソニックＩｐマネジメント株式会社 | 電子部品実装基板の製造方法 |
| US12402255B2 (en) | 2021-06-03 | 2025-08-26 | Panasonic Intellectual Property Management Co., Ltd. | Method for producing electronic component mounted substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0457436B2 (OSRAM) | 1992-09-11 |
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