JPH01119602A - 銀被覆銅粉の製造法 - Google Patents

銀被覆銅粉の製造法

Info

Publication number
JPH01119602A
JPH01119602A JP62277689A JP27768987A JPH01119602A JP H01119602 A JPH01119602 A JP H01119602A JP 62277689 A JP62277689 A JP 62277689A JP 27768987 A JP27768987 A JP 27768987A JP H01119602 A JPH01119602 A JP H01119602A
Authority
JP
Japan
Prior art keywords
copper powder
silver
weight
coated copper
soln
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62277689A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0246641B2 (enExample
Inventor
Mayumi Tokita
時田　真由美
Tsutomu Omotani
力 重谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Kinzoku Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Priority to JP62277689A priority Critical patent/JPH01119602A/ja
Publication of JPH01119602A publication Critical patent/JPH01119602A/ja
Publication of JPH0246641B2 publication Critical patent/JPH0246641B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/17—Metallic particles coated with metal

Landscapes

  • Powder Metallurgy (AREA)
  • Chemically Coating (AREA)
JP62277689A 1987-11-02 1987-11-02 銀被覆銅粉の製造法 Granted JPH01119602A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62277689A JPH01119602A (ja) 1987-11-02 1987-11-02 銀被覆銅粉の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62277689A JPH01119602A (ja) 1987-11-02 1987-11-02 銀被覆銅粉の製造法

Publications (2)

Publication Number Publication Date
JPH01119602A true JPH01119602A (ja) 1989-05-11
JPH0246641B2 JPH0246641B2 (enExample) 1990-10-16

Family

ID=17586931

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62277689A Granted JPH01119602A (ja) 1987-11-02 1987-11-02 銀被覆銅粉の製造法

Country Status (1)

Country Link
JP (1) JPH01119602A (enExample)

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5178909A (en) * 1990-07-24 1993-01-12 Mitsui Kinzoku Kogyo Kabushiki Kaisha Production of silver-coated copper-based powders
JPH10501025A (ja) * 1993-10-08 1998-01-27 アメリカ合衆国 酸で補助された冷間圧接および金属間形成およびその歯科用途
JP2006161081A (ja) * 2004-12-03 2006-06-22 Dowa Mining Co Ltd 銀被覆銅粉およびその製造方法並びに導電ペースト
US7156928B2 (en) 2001-11-20 2007-01-02 Shin-Etsu Chemical Co., Ltd. Corrosion-resistant rare earth element magnet
KR100791231B1 (ko) * 2000-12-20 2008-01-03 도와 홀딩스 가부시끼가이샤 은 확산 구리 분말, 이의 제조방법, 및 이를 사용하는 전도성 페이스트 및 프린트 전자회로용 도선
CN101887767A (zh) * 2010-06-11 2010-11-17 山东大学 一种以表面覆盖银纳米结构的铜粉为填料的导电浆料的制备方法
CN101653826B (zh) 2009-09-11 2011-01-26 南京金视显科技有限公司 一种银粉表面改性处理方法
JP2011058068A (ja) * 2009-09-11 2011-03-24 Toyobo Co Ltd 銅薄膜製造方法および銅薄膜
JP2011082145A (ja) * 2009-09-11 2011-04-21 Toyobo Co Ltd 銅薄膜および銅薄膜積層体
CN103128308A (zh) * 2013-03-06 2013-06-05 东南大学 一锅法制备致密银包铜粉的方法
JP2013185213A (ja) * 2012-03-08 2013-09-19 Tokyo Institute Of Technology 金属ナノ粒子及びその製造方法並びに導電性インク
US8617688B2 (en) 2005-05-30 2013-12-31 Sumitomo Electric Industries, Ltd. Conductive paste and multilayer printed wiring board using the same
CN103890966A (zh) * 2011-10-18 2014-06-25 迪睿合电子材料有限公司 导电性粘接剂以及使用该导电性粘接剂的太阳能电池模块及其制造方法
JP2014118589A (ja) * 2012-12-14 2014-06-30 Unitika Ltd 被覆繊維状銅微粒子集合体
JP2014118590A (ja) * 2012-12-14 2014-06-30 Unitika Ltd 繊維状銀微粒子集合体
CN105127449A (zh) * 2015-10-20 2015-12-09 陈键 一种制备表面镀银铜粉的方法
CN105598468A (zh) * 2016-03-17 2016-05-25 中国科学院深圳先进技术研究院 一种可用于导电油墨的银包铜纳米颗粒的制备方法
JP2017150086A (ja) * 2012-01-17 2017-08-31 Ｄｏｗａエレクトロニクス株式会社 銀被覆銅合金粉末およびその製造方法
CN110551995A (zh) * 2019-09-16 2019-12-10 上海交通大学 一种化学镀法制备光滑致密银包铜粉的方法
CN119407166A (zh) * 2025-01-07 2025-02-11 安徽壹石通材料科技股份有限公司 一种小粒径镀银铜粉及其制备方法与应用

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0640099A (ja) * 1992-07-23 1994-02-15 Pfu Ltd プリンタ装置
JP6076249B2 (ja) * 2011-06-14 2017-02-08 ユニチカ株式会社 被覆繊維状銅微粒子、並びに該被覆繊維状銅微粒子を含む導電性コーティング剤および導電性フィルム
JP5631910B2 (ja) * 2011-10-21 2014-11-26 三井金属鉱業株式会社 銀被覆銅粉
KR101874500B1 (ko) * 2014-06-16 2018-07-04 미쓰이금속광업주식회사 구리분, 그 제조 방법, 및 그것을 포함하는 도전성 조성물
CN110523973A (zh) * 2019-09-21 2019-12-03 深圳市百柔新材料技术有限公司 表面包覆致密银层的片状银铜粉、制备方法及其应用

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5178909A (en) * 1990-07-24 1993-01-12 Mitsui Kinzoku Kogyo Kabushiki Kaisha Production of silver-coated copper-based powders
JPH10501025A (ja) * 1993-10-08 1998-01-27 アメリカ合衆国 酸で補助された冷間圧接および金属間形成およびその歯科用途
KR100791231B1 (ko) * 2000-12-20 2008-01-03 도와 홀딩스 가부시끼가이샤 은 확산 구리 분말, 이의 제조방법, 및 이를 사용하는 전도성 페이스트 및 프린트 전자회로용 도선
US7156928B2 (en) 2001-11-20 2007-01-02 Shin-Etsu Chemical Co., Ltd. Corrosion-resistant rare earth element magnet
JP2006161081A (ja) * 2004-12-03 2006-06-22 Dowa Mining Co Ltd 銀被覆銅粉およびその製造方法並びに導電ペースト
US8617688B2 (en) 2005-05-30 2013-12-31 Sumitomo Electric Industries, Ltd. Conductive paste and multilayer printed wiring board using the same
CN101653826B (zh) 2009-09-11 2011-01-26 南京金视显科技有限公司 一种银粉表面改性处理方法
JP2011058068A (ja) * 2009-09-11 2011-03-24 Toyobo Co Ltd 銅薄膜製造方法および銅薄膜
JP2011082145A (ja) * 2009-09-11 2011-04-21 Toyobo Co Ltd 銅薄膜および銅薄膜積層体
CN101887767A (zh) * 2010-06-11 2010-11-17 山东大学 一种以表面覆盖银纳米结构的铜粉为填料的导电浆料的制备方法
CN103890966B (zh) * 2011-10-18 2016-10-12 迪睿合电子材料有限公司 导电性粘接剂以及使用该导电性粘接剂的太阳能电池模块及其制造方法
CN103890966A (zh) * 2011-10-18 2014-06-25 迪睿合电子材料有限公司 导电性粘接剂以及使用该导电性粘接剂的太阳能电池模块及其制造方法
JP2017150086A (ja) * 2012-01-17 2017-08-31 Ｄｏｗａエレクトロニクス株式会社 銀被覆銅合金粉末およびその製造方法
JP2013185213A (ja) * 2012-03-08 2013-09-19 Tokyo Institute Of Technology 金属ナノ粒子及びその製造方法並びに導電性インク
JP2014118590A (ja) * 2012-12-14 2014-06-30 Unitika Ltd 繊維状銀微粒子集合体
JP2014118589A (ja) * 2012-12-14 2014-06-30 Unitika Ltd 被覆繊維状銅微粒子集合体
CN103128308A (zh) * 2013-03-06 2013-06-05 东南大学 一锅法制备致密银包铜粉的方法
CN105127449A (zh) * 2015-10-20 2015-12-09 陈键 一种制备表面镀银铜粉的方法
CN105598468A (zh) * 2016-03-17 2016-05-25 中国科学院深圳先进技术研究院 一种可用于导电油墨的银包铜纳米颗粒的制备方法
CN110551995A (zh) * 2019-09-16 2019-12-10 上海交通大学 一种化学镀法制备光滑致密银包铜粉的方法
CN110551995B (zh) * 2019-09-16 2022-01-25 上海交通大学 一种化学镀法制备光滑致密银包铜粉的方法
CN119407166A (zh) * 2025-01-07 2025-02-11 安徽壹石通材料科技股份有限公司 一种小粒径镀银铜粉及其制备方法与应用

Also Published As

Publication number Publication date
JPH0246641B2 (enExample) 1990-10-16

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