JPH01104022U - - Google Patents

Info

Publication number
JPH01104022U
JPH01104022U JP1987197637U JP19763787U JPH01104022U JP H01104022 U JPH01104022 U JP H01104022U JP 1987197637 U JP1987197637 U JP 1987197637U JP 19763787 U JP19763787 U JP 19763787U JP H01104022 U JPH01104022 U JP H01104022U
Authority
JP
Japan
Prior art keywords
wafer
liquid washing
carrier
holder
washing tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987197637U
Other languages
English (en)
Other versions
JPH073634Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987197637U priority Critical patent/JPH073634Y2/ja
Priority to US07/289,833 priority patent/US4899768A/en
Publication of JPH01104022U publication Critical patent/JPH01104022U/ja
Application granted granted Critical
Publication of JPH073634Y2 publication Critical patent/JPH073634Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Description

【図面の簡単な説明】
第１図はこの考案に係るウエハ液洗乾燥装置を
有する装置を示す概略図、第２図は第１図に示し
たウエハ液洗乾燥装置の一部を示す断面図、第３
図は第２図のＡ矢視図、第４図〜第９図は第１図
に示したウエハ液洗乾燥装置の動作説明図、第１
０図は従来のウエハ液洗乾燥装置を有する装置を
示す概略図、第１１図は第１０図に示したウエハ
液洗乾燥装置で使用するキヤリアを示す正面図、
第１２図は同じく正断面図、第１３図は同じく側
断面図である。 １……洗浄槽、２……液洗槽、３……蒸気乾燥
機、１４……キヤリア、１５……ウエハ、１８…
…押上部材、２１……保持具、２３……保持装置
。

Claims (1)

    【実用新案登録請求の範囲】
  1. キヤリアに収納されたウエハを洗浄すべき洗浄
    槽に隣接して設置され、液洗槽および蒸気乾燥機
    を有するウエハ液洗乾燥装置において、上記ウエ
    ハを保持すべき上記キヤリアよりも熱容量が小さ
    い保持具を有しかつ上記液洗槽から上記蒸気乾燥
    機に上記ウエハを搬送する保持装置と、上記液洗
    槽内において上記ウエハを上記キヤリアから上記
    保持装置の上記保持具に移し換える移換手段とを
    具備することを特徴とするウエハ液洗乾燥装置。
JP1987197637U 1987-12-28 1987-12-28 ウェハ液洗乾燥装置 Expired - Lifetime JPH073634Y2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1987197637U JPH073634Y2 (ja) 1987-12-28 1987-12-28 ウェハ液洗乾燥装置
US07/289,833 US4899768A (en) 1987-12-28 1988-12-27 Wafer washing and drying apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987197637U JPH073634Y2 (ja) 1987-12-28 1987-12-28 ウェハ液洗乾燥装置

Publications (2)

Publication Number Publication Date
JPH01104022U true JPH01104022U (ja) 1989-07-13
JPH073634Y2 JPH073634Y2 (ja) 1995-01-30

Family

ID=16377799

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987197637U Expired - Lifetime JPH073634Y2 (ja) 1987-12-28 1987-12-28 ウェハ液洗乾燥装置

Country Status (2)

Country Link
US (1) US4899768A (ja)
JP (1) JPH073634Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012533173A (ja) * 2009-07-10 2012-12-20 エーペット ウエハ乾燥装置およびこれを用いたウエハ乾燥方法

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0134962B1 (ko) * 1989-07-13 1998-04-22 나까다 구스오 디스크 세척장치
US5054210A (en) * 1990-02-23 1991-10-08 S&K Products International, Inc. Isopropyl alcohol vapor dryer system
CA2040989A1 (en) * 1990-05-01 1991-11-02 Ichiro Yoshida Washing/drying method and apparatus
JP3162704B2 (ja) * 1990-11-28 2001-05-08 東京エレクトロン株式会社 処理装置
US5246528A (en) * 1991-05-31 1993-09-21 Shin-Etsu Handotai Co., Ltd. Automatic wafer etching method and apparatus
US5651724A (en) * 1994-09-08 1997-07-29 Ebara Corporation Method and apparatus for polishing workpiece
US5653045A (en) * 1995-06-07 1997-08-05 Ferrell; Gary W. Method and apparatus for drying parts and microelectronic components using sonic created mist
US6239038B1 (en) 1995-10-13 2001-05-29 Ziying Wen Method for chemical processing semiconductor wafers
TW310452B (ja) * 1995-12-07 1997-07-11 Tokyo Electron Co Ltd
US6125862A (en) * 1996-10-02 2000-10-03 Sankyo Seiki Mfg. Co., Ltd. Cleaning apparatus
US5815942A (en) * 1996-12-13 1998-10-06 Kabushiki Kaisha Toshiba Vapor drying system and method
AU6327398A (en) * 1997-02-18 1998-09-08 Scp Global Technologies Multiple stage wet processing chamber
KR100707107B1 (ko) * 1997-07-17 2007-12-27 동경 엘렉트론 주식회사 세정.건조처리방법및장치
US20080155852A1 (en) * 2006-12-29 2008-07-03 Olgado Donald J K Multiple substrate vapor drying systems and methods
ITMI20110646A1 (it) * 2011-04-15 2012-10-16 St Microelectronics Srl Apparecchiatura per la lavorazione di wafer semiconduttori, in particolare per realizzare una fase di processo di rimozione di polimeri.

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58200540A (ja) * 1982-05-19 1983-11-22 Hitachi Ltd 半導体ウエハの洗浄方法
JPS6059747A (ja) * 1983-09-12 1985-04-06 Mitsubishi Electric Corp 半導体ウエ−ハの処理装置
JPS63208223A (ja) * 1987-02-25 1988-08-29 Hitachi Ltd ウエハ処理装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3106927A (en) * 1962-01-15 1963-10-15 Madwed Albert Vapor chamber-tank unit
US4282825A (en) * 1978-08-02 1981-08-11 Hitachi, Ltd. Surface treatment device
US4715392A (en) * 1983-11-10 1987-12-29 Nippon Kogaku K. K. Automatic photomask or reticle washing and cleaning system
US4736758A (en) * 1985-04-15 1988-04-12 Wacom Co., Ltd. Vapor drying apparatus
US4736759A (en) * 1986-02-21 1988-04-12 Robert A. Coberly Apparatus for cleaning rinsing and drying substrates
US4722752A (en) * 1986-06-16 1988-02-02 Robert F. Orr Apparatus and method for rinsing and drying silicon wafers

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58200540A (ja) * 1982-05-19 1983-11-22 Hitachi Ltd 半導体ウエハの洗浄方法
JPS6059747A (ja) * 1983-09-12 1985-04-06 Mitsubishi Electric Corp 半導体ウエ−ハの処理装置
JPS63208223A (ja) * 1987-02-25 1988-08-29 Hitachi Ltd ウエハ処理装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012533173A (ja) * 2009-07-10 2012-12-20 エーペット ウエハ乾燥装置およびこれを用いたウエハ乾燥方法

Also Published As

Publication number Publication date
JPH073634Y2 (ja) 1995-01-30
US4899768A (en) 1990-02-13

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