JPH0247046U - - Google Patents

Info

Publication number
JPH0247046U
JPH0247046U JP1988125643U JP12564388U JPH0247046U JP H0247046 U JPH0247046 U JP H0247046U JP 1988125643 U JP1988125643 U JP 1988125643U JP 12564388 U JP12564388 U JP 12564388U JP H0247046 U JPH0247046 U JP H0247046U
Authority
JP
Japan
Prior art keywords
holding
carrier
wafer
view
stored
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988125643U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988125643U priority Critical patent/JPH0247046U/ja
Priority to US07/287,024 priority patent/US4936328A/en
Publication of JPH0247046U publication Critical patent/JPH0247046U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Description

【図面の簡単な説明】
第１図はこの考案に係るウエハ移換装置を有す
るウエハ液洗乾燥装置を示す概略図、第２図は第
１図に示したウエハ液洗乾燥装置の一部を示す断
面図、第３図は第２図のＡ矢視図、第４図は第１
図に示したウエハ液洗乾燥装置で使用するキヤリ
アを示す正面図、第５図は同じく正断面図、第６
図は同じく側断面図、第７図〜第１２図は第１図
に示したウエハ液洗乾燥装置の動作説明図である
。 １……洗浄槽、２……液洗槽、３……蒸気乾燥
機、１４……キヤリア、１５……ウエハ、１８…
…押上部材、２１……保持具、２３……保持装置
。

Claims (1)

    【実用新案登録請求の範囲】
  1. キヤリアに収納されたウエハを保持装置により
    別のキヤリアに移し換える装置において、上記保
    持装置として少なくとも２個の上記キヤリアに収
    納されたウエハを保持することができるものを用
    いたことを特徴とするウエハ移換装置。
JP1988125643U 1988-09-28 1988-09-28 Pending JPH0247046U (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1988125643U JPH0247046U (ja) 1988-09-28 1988-09-28
US07/287,024 US4936328A (en) 1988-09-28 1988-12-21 Wafer transposing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988125643U JPH0247046U (ja) 1988-09-28 1988-09-28

Publications (1)

Publication Number Publication Date
JPH0247046U true JPH0247046U (ja) 1990-03-30

Family

ID=14915099

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988125643U Pending JPH0247046U (ja) 1988-09-28 1988-09-28

Country Status (2)

Country Link
US (1) US4936328A (ja)
JP (1) JPH0247046U (ja)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE459084B (sv) * 1987-10-07 1989-06-05 Sture Lindvall Doppanordning foer transport av godsbaerare utefter ett flertal i tur och ordning foeljande arbetsstationer
US5061144A (en) * 1988-11-30 1991-10-29 Tokyo Electron Limited Resist process apparatus
US5226437A (en) * 1990-11-28 1993-07-13 Tokyo Electron Limited Washing apparatus
JP2648638B2 (ja) * 1990-11-30 1997-09-03 三菱マテリアル株式会社 ウェーハの接着方法およびその装置
JP2901098B2 (ja) * 1991-04-02 1999-06-02 東京エレクトロン株式会社 洗浄装置および洗浄方法
KR0155390B1 (ko) * 1991-05-08 1998-12-01 이노우에 아키라 세정 장치
KR0165559B1 (ko) * 1991-08-26 1999-02-18 이노우에 아키라 반송장치
DE4323107C1 (de) * 1993-07-05 1994-05-26 Hottinger Adolf Masch Vorrichtung und Verfahren zur Werkzeugreinigung bei der Herstellung gießfertiger Masken bzw. Kernpakete
DE4413077C2 (de) * 1994-04-15 1997-02-06 Steag Micro Tech Gmbh Verfahren und Vorrichtung zur chemischen Behandlung von Substraten
US5578331A (en) * 1994-06-10 1996-11-26 Vision Products, Inc. Automated apparatus for preparing contact lenses for inspection and packaging
US5814134A (en) * 1994-06-10 1998-09-29 Johnson & Johnson Vision Products, Inc. Apparatus and method for degassing deionized water for inspection and packaging
JP3456790B2 (ja) * 1995-04-18 2003-10-14 三菱電機株式会社 半導体装置の製造方法及び選択エッチング用シリコン基板カセット
JPH1022358A (ja) * 1996-06-28 1998-01-23 Dainippon Screen Mfg Co Ltd 基板処理装置
US5778554A (en) * 1996-07-15 1998-07-14 Oliver Design, Inc. Wafer spin dryer and method of drying a wafer
US6138694A (en) * 1998-03-06 2000-10-31 Scp Global Technologies Multiple stage wet processing platform and method of use
JP2003164816A (ja) * 2001-11-29 2003-06-10 Fine Machine Kataoka Kk 洗浄装置と、そのワーク搬送方法
US7338565B2 (en) * 2003-08-21 2008-03-04 Cinetic Automation Corporation Housingless washer
US7353832B2 (en) * 2003-08-21 2008-04-08 Cinetic Automation Corporation Housingless washer
US7549220B2 (en) * 2003-12-17 2009-06-23 World Properties, Inc. Method for making a multilayer circuit
US8936425B2 (en) * 2012-01-23 2015-01-20 Tera Autotech Corporation Ancillary apparatus and method for loading glass substrates into a bracket
CN104813438B (zh) 2012-11-28 2017-07-25 盛美半导体设备（上海）有限公司 半导体硅片的清洗方法和装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3106927A (en) * 1962-01-15 1963-10-15 Madwed Albert Vapor chamber-tank unit
US4282825A (en) * 1978-08-02 1981-08-11 Hitachi, Ltd. Surface treatment device
US4715392A (en) * 1983-11-10 1987-12-29 Nippon Kogaku K. K. Automatic photomask or reticle washing and cleaning system
US4736758A (en) * 1985-04-15 1988-04-12 Wacom Co., Ltd. Vapor drying apparatus
US4736759A (en) * 1986-02-21 1988-04-12 Robert A. Coberly Apparatus for cleaning rinsing and drying substrates
US4722752A (en) * 1986-06-16 1988-02-02 Robert F. Orr Apparatus and method for rinsing and drying silicon wafers

Also Published As

Publication number Publication date
US4936328A (en) 1990-06-26

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