JP7827837B2 - 基材洗浄装置 - Google Patents

基材洗浄装置

Info

Publication number
JP7827837B2
JP7827837B2 JP2024515140A JP2024515140A JP7827837B2 JP 7827837 B2 JP7827837 B2 JP 7827837B2 JP 2024515140 A JP2024515140 A JP 2024515140A JP 2024515140 A JP2024515140 A JP 2024515140A JP 7827837 B2 JP7827837 B2 JP 7827837B2
Authority
JP
Japan
Prior art keywords
mist
substrate
cleaning
gas
air gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024515140A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025062573A1 (https=
JPWO2025062573A5 (https=
Inventor
洸聖 後藤
孝浩 平松
容征 織田
明大 一瀬
信義 波戸
博 柳本
圭児 黒田
連太郎 森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TMEIC Corp
Original Assignee
TMEIC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TMEIC Corp filed Critical TMEIC Corp
Publication of JPWO2025062573A1 publication Critical patent/JPWO2025062573A1/ja
Publication of JPWO2025062573A5 publication Critical patent/JPWO2025062573A5/ja
Application granted granted Critical
Publication of JP7827837B2 publication Critical patent/JP7827837B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/022—Cleaning travelling work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
    • B08B5/023—Cleaning travelling work
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Cleaning By Liquid Or Steam (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2024515140A 2023-09-21 2023-09-21 基材洗浄装置 Active JP7827837B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/034315 WO2025062573A1 (ja) 2023-09-21 2023-09-21 基材洗浄装置

Publications (3)

Publication Number Publication Date
JPWO2025062573A1 JPWO2025062573A1 (https=) 2025-03-27
JPWO2025062573A5 JPWO2025062573A5 (https=) 2025-08-27
JP7827837B2 true JP7827837B2 (ja) 2026-03-10

Family

ID=95072355

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024515140A Active JP7827837B2 (ja) 2023-09-21 2023-09-21 基材洗浄装置

Country Status (6)

Country Link
JP (1) JP7827837B2 (https=)
KR (1) KR20250070073A (https=)
CN (1) CN120035488A (https=)
DE (1) DE112023003433T5 (https=)
TW (1) TW202514776A (https=)
WO (1) WO2025062573A1 (https=)

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001000336A1 (en) 1999-06-24 2001-01-04 Sumitomo Heavy Industries, Ltd. Method and device for washing by fluid spraying
JP2005012197A (ja) 2003-05-26 2005-01-13 Sumitomo Heavy Ind Ltd エアロゾル洗浄方法及び装置
JP2005166792A (ja) 2003-12-01 2005-06-23 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2006140306A (ja) 2004-11-12 2006-06-01 Dainippon Screen Mfg Co Ltd 基板洗浄装置および基板洗浄方法
JP2006287169A (ja) 2004-07-09 2006-10-19 Sekisui Chem Co Ltd 基材処理装置及び方法
JP2007033730A (ja) 2005-07-26 2007-02-08 Optrex Corp 洗浄装置及び液晶パネルの製造方法
JP2007201374A (ja) 2006-01-30 2007-08-09 Shibaura Mechatronics Corp 基板の洗浄処理装置及び洗浄処理方法
JP2007324359A (ja) 2006-05-31 2007-12-13 Choonpa Jozosho Kk 洗浄方法と洗浄装置
JP2009136742A (ja) 2007-12-05 2009-06-25 Pioneer Electronic Corp 基板洗浄装置
WO2010071005A1 (ja) 2008-12-15 2010-06-24 アクアサイエンス株式会社 対象物洗浄方法及び対象物洗浄システム
JP2016112495A (ja) 2014-12-12 2016-06-23 アクアサイエンス株式会社 液滴噴射流生成装置及び液滴噴射流生成方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6095991U (ja) * 1983-12-02 1985-06-29 株式会社　東京精密 洗浄用ノズル
JP3565690B2 (ja) 1997-09-02 2004-09-15 株式会社プレテック 密閉型洗浄装置およびこの装置を用いて精密基板を洗浄する方法
JP2020018993A (ja) 2018-08-03 2020-02-06 三菱重工業株式会社 洗浄装置、表面処理装置および洗浄方法

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001000336A1 (en) 1999-06-24 2001-01-04 Sumitomo Heavy Industries, Ltd. Method and device for washing by fluid spraying
JP2005012197A (ja) 2003-05-26 2005-01-13 Sumitomo Heavy Ind Ltd エアロゾル洗浄方法及び装置
JP2005166792A (ja) 2003-12-01 2005-06-23 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2006287169A (ja) 2004-07-09 2006-10-19 Sekisui Chem Co Ltd 基材処理装置及び方法
JP2006140306A (ja) 2004-11-12 2006-06-01 Dainippon Screen Mfg Co Ltd 基板洗浄装置および基板洗浄方法
JP2007033730A (ja) 2005-07-26 2007-02-08 Optrex Corp 洗浄装置及び液晶パネルの製造方法
JP2007201374A (ja) 2006-01-30 2007-08-09 Shibaura Mechatronics Corp 基板の洗浄処理装置及び洗浄処理方法
JP2007324359A (ja) 2006-05-31 2007-12-13 Choonpa Jozosho Kk 洗浄方法と洗浄装置
JP2009136742A (ja) 2007-12-05 2009-06-25 Pioneer Electronic Corp 基板洗浄装置
WO2010071005A1 (ja) 2008-12-15 2010-06-24 アクアサイエンス株式会社 対象物洗浄方法及び対象物洗浄システム
JP2016112495A (ja) 2014-12-12 2016-06-23 アクアサイエンス株式会社 液滴噴射流生成装置及び液滴噴射流生成方法

Also Published As

Publication number Publication date
WO2025062573A1 (ja) 2025-03-27
KR20250070073A (ko) 2025-05-20
CN120035488A (zh) 2025-05-23
JPWO2025062573A1 (https=) 2025-03-27
TW202514776A (zh) 2025-04-01
DE112023003433T5 (de) 2025-06-12

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