JPWO2025062573A1 - - Google Patents
Info
- Publication number
- JPWO2025062573A1 JPWO2025062573A1 JP2024515140A JP2024515140A JPWO2025062573A1 JP WO2025062573 A1 JPWO2025062573 A1 JP WO2025062573A1 JP 2024515140 A JP2024515140 A JP 2024515140A JP 2024515140 A JP2024515140 A JP 2024515140A JP WO2025062573 A1 JPWO2025062573 A1 JP WO2025062573A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
- B08B5/023—Cleaning travelling work
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/034315 WO2025062573A1 (ja) | 2023-09-21 | 2023-09-21 | 基材洗浄装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2025062573A1 true JPWO2025062573A1 (https=) | 2025-03-27 |
| JPWO2025062573A5 JPWO2025062573A5 (https=) | 2025-08-27 |
| JP7827837B2 JP7827837B2 (ja) | 2026-03-10 |
Family
ID=95072355
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024515140A Active JP7827837B2 (ja) | 2023-09-21 | 2023-09-21 | 基材洗浄装置 |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP7827837B2 (https=) |
| KR (1) | KR20250070073A (https=) |
| CN (1) | CN120035488A (https=) |
| DE (1) | DE112023003433T5 (https=) |
| TW (1) | TW202514776A (https=) |
| WO (1) | WO2025062573A1 (https=) |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6095991U (ja) * | 1983-12-02 | 1985-06-29 | 株式会社 東京精密 | 洗浄用ノズル |
| WO2001000336A1 (en) * | 1999-06-24 | 2001-01-04 | Sumitomo Heavy Industries, Ltd. | Method and device for washing by fluid spraying |
| JP2005012197A (ja) * | 2003-05-26 | 2005-01-13 | Sumitomo Heavy Ind Ltd | エアロゾル洗浄方法及び装置 |
| JP2005166792A (ja) * | 2003-12-01 | 2005-06-23 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
| JP2006140306A (ja) * | 2004-11-12 | 2006-06-01 | Dainippon Screen Mfg Co Ltd | 基板洗浄装置および基板洗浄方法 |
| JP2006287169A (ja) * | 2004-07-09 | 2006-10-19 | Sekisui Chem Co Ltd | 基材処理装置及び方法 |
| JP2007033730A (ja) * | 2005-07-26 | 2007-02-08 | Optrex Corp | 洗浄装置及び液晶パネルの製造方法 |
| JP2007201374A (ja) * | 2006-01-30 | 2007-08-09 | Shibaura Mechatronics Corp | 基板の洗浄処理装置及び洗浄処理方法 |
| JP2007324359A (ja) * | 2006-05-31 | 2007-12-13 | Choonpa Jozosho Kk | 洗浄方法と洗浄装置 |
| JP2009136742A (ja) * | 2007-12-05 | 2009-06-25 | Pioneer Electronic Corp | 基板洗浄装置 |
| WO2010071005A1 (ja) * | 2008-12-15 | 2010-06-24 | アクアサイエンス株式会社 | 対象物洗浄方法及び対象物洗浄システム |
| JP2016112495A (ja) * | 2014-12-12 | 2016-06-23 | アクアサイエンス株式会社 | 液滴噴射流生成装置及び液滴噴射流生成方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3565690B2 (ja) | 1997-09-02 | 2004-09-15 | 株式会社プレテック | 密閉型洗浄装置およびこの装置を用いて精密基板を洗浄する方法 |
| JP2020018993A (ja) | 2018-08-03 | 2020-02-06 | 三菱重工業株式会社 | 洗浄装置、表面処理装置および洗浄方法 |
-
2023
- 2023-09-21 DE DE112023003433.8T patent/DE112023003433T5/de active Pending
- 2023-09-21 JP JP2024515140A patent/JP7827837B2/ja active Active
- 2023-09-21 WO PCT/JP2023/034315 patent/WO2025062573A1/ja active Pending
- 2023-09-21 CN CN202380070197.3A patent/CN120035488A/zh active Pending
- 2023-09-21 KR KR1020257012331A patent/KR20250070073A/ko active Pending
-
2024
- 2024-06-19 TW TW113122706A patent/TW202514776A/zh unknown
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6095991U (ja) * | 1983-12-02 | 1985-06-29 | 株式会社 東京精密 | 洗浄用ノズル |
| WO2001000336A1 (en) * | 1999-06-24 | 2001-01-04 | Sumitomo Heavy Industries, Ltd. | Method and device for washing by fluid spraying |
| JP2005012197A (ja) * | 2003-05-26 | 2005-01-13 | Sumitomo Heavy Ind Ltd | エアロゾル洗浄方法及び装置 |
| JP2005166792A (ja) * | 2003-12-01 | 2005-06-23 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
| JP2006287169A (ja) * | 2004-07-09 | 2006-10-19 | Sekisui Chem Co Ltd | 基材処理装置及び方法 |
| JP2006140306A (ja) * | 2004-11-12 | 2006-06-01 | Dainippon Screen Mfg Co Ltd | 基板洗浄装置および基板洗浄方法 |
| JP2007033730A (ja) * | 2005-07-26 | 2007-02-08 | Optrex Corp | 洗浄装置及び液晶パネルの製造方法 |
| JP2007201374A (ja) * | 2006-01-30 | 2007-08-09 | Shibaura Mechatronics Corp | 基板の洗浄処理装置及び洗浄処理方法 |
| JP2007324359A (ja) * | 2006-05-31 | 2007-12-13 | Choonpa Jozosho Kk | 洗浄方法と洗浄装置 |
| JP2009136742A (ja) * | 2007-12-05 | 2009-06-25 | Pioneer Electronic Corp | 基板洗浄装置 |
| WO2010071005A1 (ja) * | 2008-12-15 | 2010-06-24 | アクアサイエンス株式会社 | 対象物洗浄方法及び対象物洗浄システム |
| JP2016112495A (ja) * | 2014-12-12 | 2016-06-23 | アクアサイエンス株式会社 | 液滴噴射流生成装置及び液滴噴射流生成方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7827837B2 (ja) | 2026-03-10 |
| WO2025062573A1 (ja) | 2025-03-27 |
| KR20250070073A (ko) | 2025-05-20 |
| CN120035488A (zh) | 2025-05-23 |
| TW202514776A (zh) | 2025-04-01 |
| DE112023003433T5 (de) | 2025-06-12 |
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