JP7819301B2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JP7819301B2
JP7819301B2 JP2024520245A JP2024520245A JP7819301B2 JP 7819301 B2 JP7819301 B2 JP 7819301B2 JP 2024520245 A JP2024520245 A JP 2024520245A JP 2024520245 A JP2024520245 A JP 2024520245A JP 7819301 B2 JP7819301 B2 JP 7819301B2
Authority
JP
Japan
Prior art keywords
recess
power module
heat spreader
semiconductor device
cooling surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024520245A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023218680A5 (https=
JPWO2023218680A1 (https=
Inventor
一貴 新
隆一 石井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Mobility Corp
Original Assignee
Mitsubishi Electric Mobility Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Mobility Corp filed Critical Mitsubishi Electric Mobility Corp
Publication of JPWO2023218680A1 publication Critical patent/JPWO2023218680A1/ja
Publication of JPWO2023218680A5 publication Critical patent/JPWO2023218680A5/ja
Application granted granted Critical
Publication of JP7819301B2 publication Critical patent/JP7819301B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
JP2024520245A 2022-05-11 2022-10-20 半導体装置 Active JP7819301B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022077863 2022-05-11
JP2022077863 2022-05-11
PCT/JP2022/039068 WO2023218680A1 (ja) 2022-05-11 2022-10-20 半導体装置

Publications (3)

Publication Number Publication Date
JPWO2023218680A1 JPWO2023218680A1 (https=) 2023-11-16
JPWO2023218680A5 JPWO2023218680A5 (https=) 2024-09-24
JP7819301B2 true JP7819301B2 (ja) 2026-02-24

Family

ID=88729962

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024520245A Active JP7819301B2 (ja) 2022-05-11 2022-10-20 半導体装置

Country Status (5)

Country Link
US (1) US20250183117A1 (https=)
JP (1) JP7819301B2 (https=)
CN (1) CN119137734A (https=)
DE (1) DE112022007183T5 (https=)
WO (1) WO2023218680A1 (https=)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004356261A (ja) 2003-05-28 2004-12-16 Mitsubishi Electric Corp 電力用半導体装置
JP2005039081A (ja) 2003-07-16 2005-02-10 Mitsubishi Electric Corp 半導体モジュールの放熱板
JP2005109374A (ja) 2003-10-02 2005-04-21 Fuji Electric Device Technology Co Ltd 半導体装置
JP2006351927A (ja) 2005-06-17 2006-12-28 Auto Network Gijutsu Kenkyusho:Kk 半導体装置、回路基板及び電気接続箱
JP2007158156A (ja) 2005-12-07 2007-06-21 Mitsubishi Electric Corp 半導体モジュール
WO2012093509A1 (ja) 2011-01-07 2012-07-12 富士電機株式会社 半導体装置およびその製造方法
JP2013123016A (ja) 2011-12-12 2013-06-20 Denso Corp 半導体装置
JP2013187396A (ja) 2012-03-08 2013-09-19 Daikin Ind Ltd パワーモジュール

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004356261A (ja) 2003-05-28 2004-12-16 Mitsubishi Electric Corp 電力用半導体装置
JP2005039081A (ja) 2003-07-16 2005-02-10 Mitsubishi Electric Corp 半導体モジュールの放熱板
JP2005109374A (ja) 2003-10-02 2005-04-21 Fuji Electric Device Technology Co Ltd 半導体装置
JP2006351927A (ja) 2005-06-17 2006-12-28 Auto Network Gijutsu Kenkyusho:Kk 半導体装置、回路基板及び電気接続箱
JP2007158156A (ja) 2005-12-07 2007-06-21 Mitsubishi Electric Corp 半導体モジュール
WO2012093509A1 (ja) 2011-01-07 2012-07-12 富士電機株式会社 半導体装置およびその製造方法
JP2013123016A (ja) 2011-12-12 2013-06-20 Denso Corp 半導体装置
JP2013187396A (ja) 2012-03-08 2013-09-19 Daikin Ind Ltd パワーモジュール

Also Published As

Publication number Publication date
JPWO2023218680A1 (https=) 2023-11-16
US20250183117A1 (en) 2025-06-05
WO2023218680A1 (ja) 2023-11-16
DE112022007183T5 (de) 2025-04-30
CN119137734A (zh) 2024-12-13

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