DE112022007183T5 - Halbleiter-Vorrichtung - Google Patents

Halbleiter-Vorrichtung Download PDF

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Publication number
DE112022007183T5
DE112022007183T5 DE112022007183.4T DE112022007183T DE112022007183T5 DE 112022007183 T5 DE112022007183 T5 DE 112022007183T5 DE 112022007183 T DE112022007183 T DE 112022007183T DE 112022007183 T5 DE112022007183 T5 DE 112022007183T5
Authority
DE
Germany
Prior art keywords
recessed portion
power module
semiconductor device
heat spreader
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112022007183.4T
Other languages
German (de)
English (en)
Inventor
Kazuki ARATA
Ryuichi Ishii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE112022007183T5 publication Critical patent/DE112022007183T5/de
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
DE112022007183.4T 2022-05-11 2022-10-20 Halbleiter-Vorrichtung Pending DE112022007183T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-077863 2022-05-11
JP2022077863 2022-05-11
PCT/JP2022/039068 WO2023218680A1 (ja) 2022-05-11 2022-10-20 半導体装置

Publications (1)

Publication Number Publication Date
DE112022007183T5 true DE112022007183T5 (de) 2025-04-30

Family

ID=88729962

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112022007183.4T Pending DE112022007183T5 (de) 2022-05-11 2022-10-20 Halbleiter-Vorrichtung

Country Status (5)

Country Link
US (1) US20250183117A1 (https=)
JP (1) JP7819301B2 (https=)
CN (1) CN119137734A (https=)
DE (1) DE112022007183T5 (https=)
WO (1) WO2023218680A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004356261A (ja) 2003-05-28 2004-12-16 Mitsubishi Electric Corp 電力用半導体装置
JP2005039081A (ja) 2003-07-16 2005-02-10 Mitsubishi Electric Corp 半導体モジュールの放熱板
JP4214880B2 (ja) 2003-10-02 2009-01-28 富士電機デバイステクノロジー株式会社 半導体装置
JP2006351927A (ja) 2005-06-17 2006-12-28 Auto Network Gijutsu Kenkyusho:Kk 半導体装置、回路基板及び電気接続箱
JP4549287B2 (ja) 2005-12-07 2010-09-22 三菱電機株式会社 半導体モジュール
CN103329267B (zh) 2011-01-07 2016-02-24 富士电机株式会社 半导体器件及其制造方法
JP2013123016A (ja) 2011-12-12 2013-06-20 Denso Corp 半導体装置
JP6003109B2 (ja) 2012-03-08 2016-10-05 ダイキン工業株式会社 パワーモジュール

Also Published As

Publication number Publication date
JPWO2023218680A1 (https=) 2023-11-16
US20250183117A1 (en) 2025-06-05
WO2023218680A1 (ja) 2023-11-16
CN119137734A (zh) 2024-12-13
JP7819301B2 (ja) 2026-02-24

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Legal Events

Date Code Title Description
R012 Request for examination validly filed
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0023360000

Ipc: H10W0040200000