CN119137734A - 半导体装置 - Google Patents

半导体装置 Download PDF

Info

Publication number
CN119137734A
CN119137734A CN202280095557.0A CN202280095557A CN119137734A CN 119137734 A CN119137734 A CN 119137734A CN 202280095557 A CN202280095557 A CN 202280095557A CN 119137734 A CN119137734 A CN 119137734A
Authority
CN
China
Prior art keywords
semiconductor device
power module
cooling surface
heat sink
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280095557.0A
Other languages
English (en)
Chinese (zh)
Inventor
新一贵
石井隆一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN119137734A publication Critical patent/CN119137734A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
CN202280095557.0A 2022-05-11 2022-10-20 半导体装置 Pending CN119137734A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-077863 2022-05-11
JP2022077863 2022-05-11
PCT/JP2022/039068 WO2023218680A1 (ja) 2022-05-11 2022-10-20 半導体装置

Publications (1)

Publication Number Publication Date
CN119137734A true CN119137734A (zh) 2024-12-13

Family

ID=88729962

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280095557.0A Pending CN119137734A (zh) 2022-05-11 2022-10-20 半导体装置

Country Status (5)

Country Link
US (1) US20250183117A1 (https=)
JP (1) JP7819301B2 (https=)
CN (1) CN119137734A (https=)
DE (1) DE112022007183T5 (https=)
WO (1) WO2023218680A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004356261A (ja) 2003-05-28 2004-12-16 Mitsubishi Electric Corp 電力用半導体装置
JP2005039081A (ja) 2003-07-16 2005-02-10 Mitsubishi Electric Corp 半導体モジュールの放熱板
JP4214880B2 (ja) 2003-10-02 2009-01-28 富士電機デバイステクノロジー株式会社 半導体装置
JP2006351927A (ja) 2005-06-17 2006-12-28 Auto Network Gijutsu Kenkyusho:Kk 半導体装置、回路基板及び電気接続箱
JP4549287B2 (ja) 2005-12-07 2010-09-22 三菱電機株式会社 半導体モジュール
CN103329267B (zh) 2011-01-07 2016-02-24 富士电机株式会社 半导体器件及其制造方法
JP2013123016A (ja) 2011-12-12 2013-06-20 Denso Corp 半導体装置
JP6003109B2 (ja) 2012-03-08 2016-10-05 ダイキン工業株式会社 パワーモジュール

Also Published As

Publication number Publication date
JPWO2023218680A1 (https=) 2023-11-16
US20250183117A1 (en) 2025-06-05
WO2023218680A1 (ja) 2023-11-16
DE112022007183T5 (de) 2025-04-30
JP7819301B2 (ja) 2026-02-24

Similar Documents

Publication Publication Date Title
US8569890B2 (en) Power semiconductor device module
US11201121B2 (en) Semiconductor device
KR20030032816A (ko) 반도체장치
CN114373723A (zh) 半导体装置
US20130020725A1 (en) Semiconductor device and method of manufacturing semiconductor device
CN106252301A (zh) 具有增大的爬电距离的电子装置
JP6150866B2 (ja) 電力半導体装置
WO2020027183A1 (ja) 電気回路基板及びパワーモジュール
JP2001217363A (ja) 半導体装置とそのヒートシンク
WO2021039816A1 (ja) 電気回路基板及びパワーモジュール
CN111433910B (zh) 半导体装置以及半导体装置的制造方法
CN108735679B (zh) 半导体装置
US20250201754A1 (en) Semiconductor device comprising a carrier, a semiconductor die and a c-shaped clip connected between them
WO2019163941A1 (ja) パワーモジュール用基板およびパワーモジュール
JP2015167171A (ja) 半導体装置
JP7693024B2 (ja) 樹脂封止型半導体装置
CN119137734A (zh) 半导体装置
CN114975335B (zh) 半导体封装件
JP6747304B2 (ja) 電力用半導体装置
KR20140070350A (ko) 반도체장치 및 그 제조방법
JP2023134143A (ja) 半導体モジュール、半導体装置、及び車両
JP7135293B2 (ja) 半導体装置および半導体装置の製造方法
JP2017191807A (ja) パワー半導体装置およびパワー半導体装置の製造方法
JP7136367B2 (ja) 半導体パッケージ
KR102750289B1 (ko) 반도체 패키지 및 이의 제조방법

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination