JPWO2023218680A1 - - Google Patents

Info

Publication number
JPWO2023218680A1
JPWO2023218680A1 JP2024520245A JP2024520245A JPWO2023218680A1 JP WO2023218680 A1 JPWO2023218680 A1 JP WO2023218680A1 JP 2024520245 A JP2024520245 A JP 2024520245A JP 2024520245 A JP2024520245 A JP 2024520245A JP WO2023218680 A1 JPWO2023218680 A1 JP WO2023218680A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024520245A
Other languages
Japanese (ja)
Other versions
JPWO2023218680A5 (https=
JP7819301B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023218680A1 publication Critical patent/JPWO2023218680A1/ja
Publication of JPWO2023218680A5 publication Critical patent/JPWO2023218680A5/ja
Application granted granted Critical
Publication of JP7819301B2 publication Critical patent/JP7819301B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
JP2024520245A 2022-05-11 2022-10-20 半導体装置 Active JP7819301B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022077863 2022-05-11
JP2022077863 2022-05-11
PCT/JP2022/039068 WO2023218680A1 (ja) 2022-05-11 2022-10-20 半導体装置

Publications (3)

Publication Number Publication Date
JPWO2023218680A1 true JPWO2023218680A1 (https=) 2023-11-16
JPWO2023218680A5 JPWO2023218680A5 (https=) 2024-09-24
JP7819301B2 JP7819301B2 (ja) 2026-02-24

Family

ID=88729962

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024520245A Active JP7819301B2 (ja) 2022-05-11 2022-10-20 半導体装置

Country Status (5)

Country Link
US (1) US20250183117A1 (https=)
JP (1) JP7819301B2 (https=)
CN (1) CN119137734A (https=)
DE (1) DE112022007183T5 (https=)
WO (1) WO2023218680A1 (https=)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004356261A (ja) * 2003-05-28 2004-12-16 Mitsubishi Electric Corp 電力用半導体装置
JP2005039081A (ja) * 2003-07-16 2005-02-10 Mitsubishi Electric Corp 半導体モジュールの放熱板
JP2005109374A (ja) * 2003-10-02 2005-04-21 Fuji Electric Device Technology Co Ltd 半導体装置
JP2006351927A (ja) * 2005-06-17 2006-12-28 Auto Network Gijutsu Kenkyusho:Kk 半導体装置、回路基板及び電気接続箱
JP2007158156A (ja) * 2005-12-07 2007-06-21 Mitsubishi Electric Corp 半導体モジュール
WO2012093509A1 (ja) * 2011-01-07 2012-07-12 富士電機株式会社 半導体装置およびその製造方法
JP2013123016A (ja) * 2011-12-12 2013-06-20 Denso Corp 半導体装置
JP2013187396A (ja) * 2012-03-08 2013-09-19 Daikin Ind Ltd パワーモジュール

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004356261A (ja) * 2003-05-28 2004-12-16 Mitsubishi Electric Corp 電力用半導体装置
JP2005039081A (ja) * 2003-07-16 2005-02-10 Mitsubishi Electric Corp 半導体モジュールの放熱板
JP2005109374A (ja) * 2003-10-02 2005-04-21 Fuji Electric Device Technology Co Ltd 半導体装置
JP2006351927A (ja) * 2005-06-17 2006-12-28 Auto Network Gijutsu Kenkyusho:Kk 半導体装置、回路基板及び電気接続箱
JP2007158156A (ja) * 2005-12-07 2007-06-21 Mitsubishi Electric Corp 半導体モジュール
WO2012093509A1 (ja) * 2011-01-07 2012-07-12 富士電機株式会社 半導体装置およびその製造方法
JP2013123016A (ja) * 2011-12-12 2013-06-20 Denso Corp 半導体装置
JP2013187396A (ja) * 2012-03-08 2013-09-19 Daikin Ind Ltd パワーモジュール

Also Published As

Publication number Publication date
US20250183117A1 (en) 2025-06-05
WO2023218680A1 (ja) 2023-11-16
DE112022007183T5 (de) 2025-04-30
CN119137734A (zh) 2024-12-13
JP7819301B2 (ja) 2026-02-24

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