JP7738773B2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JP7738773B2
JP7738773B2 JP2024550966A JP2024550966A JP7738773B2 JP 7738773 B2 JP7738773 B2 JP 7738773B2 JP 2024550966 A JP2024550966 A JP 2024550966A JP 2024550966 A JP2024550966 A JP 2024550966A JP 7738773 B2 JP7738773 B2 JP 7738773B2
Authority
JP
Japan
Prior art keywords
elements
semiconductor
wiring
adjacent
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024550966A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024079813A5 (https=
JPWO2024079813A1 (https=
Inventor
一廣 西村
英夫 河面
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of JPWO2024079813A1 publication Critical patent/JPWO2024079813A1/ja
Publication of JPWO2024079813A5 publication Critical patent/JPWO2024079813A5/ja
Application granted granted Critical
Publication of JP7738773B2 publication Critical patent/JP7738773B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/60—Arrangements for protection of devices protecting against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/401—Resistive arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/601—Capacitive arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D80/00—Assemblies of multiple devices comprising at least one device covered by this subclass
    • H10D80/20—Assemblies of multiple devices comprising at least one device covered by this subclass the at least one device being covered by groups H10D1/00 - H10D48/00, e.g. assemblies comprising capacitors, power FETs or Schottky diodes
    • H10D80/251—FETs covered by H10D30/00, e.g. power FETs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/865—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
JP2024550966A 2022-10-12 2022-10-12 半導体装置 Active JP7738773B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/038032 WO2024079813A1 (ja) 2022-10-12 2022-10-12 半導体装置

Publications (3)

Publication Number Publication Date
JPWO2024079813A1 JPWO2024079813A1 (https=) 2024-04-18
JPWO2024079813A5 JPWO2024079813A5 (https=) 2025-01-07
JP7738773B2 true JP7738773B2 (ja) 2025-09-12

Family

ID=90669206

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024550966A Active JP7738773B2 (ja) 2022-10-12 2022-10-12 半導体装置

Country Status (5)

Country Link
US (1) US20250316657A1 (https=)
JP (1) JP7738773B2 (https=)
CN (1) CN120019492A (https=)
DE (1) DE112022007897T5 (https=)
WO (1) WO2024079813A1 (https=)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001185679A (ja) 1999-12-27 2001-07-06 Mitsubishi Electric Corp 半導体スイッチ装置
JP2001284395A (ja) 2000-03-31 2001-10-12 Sanken Electric Co Ltd 半導体装置
JP2008211237A (ja) 2008-04-18 2008-09-11 Fujitsu Ltd 半導体装置に配設される中継部材及び半導体装置
WO2019202687A1 (ja) 2018-04-18 2019-10-24 三菱電機株式会社 半導体モジュール
JP2021141219A (ja) 2020-03-06 2021-09-16 富士電機株式会社 半導体モジュール
JP2021158232A (ja) 2020-03-27 2021-10-07 富士電機株式会社 半導体モジュール
US20220102258A1 (en) 2020-09-30 2022-03-31 Stmicroelectronics S.R.L. Semiconductor device and corresponding method of manufacturing semiconductor devices

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11214304A (ja) * 1998-01-21 1999-08-06 Murata Mfg Co Ltd 半導体装置およびそれを用いた電子装置
JP3491885B2 (ja) * 2000-03-21 2004-01-26 三洋電機株式会社 半導体装置
JP4384948B2 (ja) * 2004-07-26 2009-12-16 株式会社日立製作所 パワーモジュール
JP5206188B2 (ja) * 2008-07-15 2013-06-12 三菱電機株式会社 半導体装置
JP7077893B2 (ja) * 2018-09-21 2022-05-31 株式会社デンソー 半導体装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001185679A (ja) 1999-12-27 2001-07-06 Mitsubishi Electric Corp 半導体スイッチ装置
JP2001284395A (ja) 2000-03-31 2001-10-12 Sanken Electric Co Ltd 半導体装置
JP2008211237A (ja) 2008-04-18 2008-09-11 Fujitsu Ltd 半導体装置に配設される中継部材及び半導体装置
WO2019202687A1 (ja) 2018-04-18 2019-10-24 三菱電機株式会社 半導体モジュール
JP2021141219A (ja) 2020-03-06 2021-09-16 富士電機株式会社 半導体モジュール
JP2021158232A (ja) 2020-03-27 2021-10-07 富士電機株式会社 半導体モジュール
US20220102258A1 (en) 2020-09-30 2022-03-31 Stmicroelectronics S.R.L. Semiconductor device and corresponding method of manufacturing semiconductor devices

Also Published As

Publication number Publication date
US20250316657A1 (en) 2025-10-09
DE112022007897T5 (de) 2025-07-24
CN120019492A (zh) 2025-05-16
WO2024079813A1 (ja) 2024-04-18
JPWO2024079813A1 (https=) 2024-04-18

Similar Documents

Publication Publication Date Title
US10727213B2 (en) Power semiconductor module and power semiconductor device
TWI591802B (zh) 半導體裝置及其製造方法
US9116532B2 (en) Power semiconductor device module
JP5526849B2 (ja) 半導体装置
WO2015029159A1 (ja) 半導体装置
CN113630113A (zh) 半导体装置
US20050194660A1 (en) IGBT module
CN110176446B (zh) 半导体装置
JP2020096105A (ja) 光結合装置およびその実装部材
KR20120012407A (ko) 전력반도체 모듈 및 서브모듈
JP7090044B2 (ja) 半導体装置
US10615076B2 (en) Semiconductor chip having on-chip noise protection circuit
JP2005129826A (ja) パワー半導体装置
JP7738773B2 (ja) 半導体装置
CN110649093A (zh) 一种igbt芯片及半导体功率模块
JP7632460B2 (ja) 半導体装置
JP2000058820A (ja) パワー半導体素子及びパワーモジュール
JP2012195338A (ja) 半導体装置
JP3612226B2 (ja) 半導体装置及び半導体モジュール
JP4706551B2 (ja) パワー半導体素子及びパワーモジュール
JP2011199039A (ja) 半導体装置
JP2019153651A (ja) 半導体装置
JP2004319861A (ja) 半導体装置
CN112567619B (zh) 功率半导体装置
CN210006735U (zh) 一种具有内部集成温度保护装置的Mosfet半导体器件

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20241010

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20241010

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20250805

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20250902

R150 Certificate of patent or registration of utility model

Ref document number: 7738773

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150