JPWO2024079813A1 - - Google Patents

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Publication number
JPWO2024079813A1
JPWO2024079813A1 JP2024550966A JP2024550966A JPWO2024079813A1 JP WO2024079813 A1 JPWO2024079813 A1 JP WO2024079813A1 JP 2024550966 A JP2024550966 A JP 2024550966A JP 2024550966 A JP2024550966 A JP 2024550966A JP WO2024079813 A1 JPWO2024079813 A1 JP WO2024079813A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024550966A
Other languages
Japanese (ja)
Other versions
JPWO2024079813A5 (https=
JP7738773B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024079813A1 publication Critical patent/JPWO2024079813A1/ja
Publication of JPWO2024079813A5 publication Critical patent/JPWO2024079813A5/ja
Application granted granted Critical
Publication of JP7738773B2 publication Critical patent/JP7738773B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/60—Arrangements for protection of devices protecting against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/401—Resistive arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/601—Capacitive arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D80/00—Assemblies of multiple devices comprising at least one device covered by this subclass
    • H10D80/20—Assemblies of multiple devices comprising at least one device covered by this subclass the at least one device being covered by groups H10D1/00 - H10D48/00, e.g. assemblies comprising capacitors, power FETs or Schottky diodes
    • H10D80/251—FETs covered by H10D30/00, e.g. power FETs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/865—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
JP2024550966A 2022-10-12 2022-10-12 半導体装置 Active JP7738773B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/038032 WO2024079813A1 (ja) 2022-10-12 2022-10-12 半導体装置

Publications (3)

Publication Number Publication Date
JPWO2024079813A1 true JPWO2024079813A1 (https=) 2024-04-18
JPWO2024079813A5 JPWO2024079813A5 (https=) 2025-01-07
JP7738773B2 JP7738773B2 (ja) 2025-09-12

Family

ID=90669206

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024550966A Active JP7738773B2 (ja) 2022-10-12 2022-10-12 半導体装置

Country Status (5)

Country Link
US (1) US20250316657A1 (https=)
JP (1) JP7738773B2 (https=)
CN (1) CN120019492A (https=)
DE (1) DE112022007897T5 (https=)
WO (1) WO2024079813A1 (https=)

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11214304A (ja) * 1998-01-21 1999-08-06 Murata Mfg Co Ltd 半導体装置およびそれを用いた電子装置
JP2001185679A (ja) * 1999-12-27 2001-07-06 Mitsubishi Electric Corp 半導体スイッチ装置
JP2001284395A (ja) * 2000-03-31 2001-10-12 Sanken Electric Co Ltd 半導体装置
JP2006041098A (ja) * 2004-07-26 2006-02-09 Hitachi Ltd パワーモジュール
JP2008211237A (ja) * 2008-04-18 2008-09-11 Fujitsu Ltd 半導体装置に配設される中継部材及び半導体装置
JP2010027691A (ja) * 2008-07-15 2010-02-04 Mitsubishi Electric Corp 半導体装置
WO2019202687A1 (ja) * 2018-04-18 2019-10-24 三菱電機株式会社 半導体モジュール
JP2020047892A (ja) * 2018-09-21 2020-03-26 トヨタ自動車株式会社 半導体装置
JP2021141219A (ja) * 2020-03-06 2021-09-16 富士電機株式会社 半導体モジュール
JP2021158232A (ja) * 2020-03-27 2021-10-07 富士電機株式会社 半導体モジュール
US20220102258A1 (en) * 2020-09-30 2022-03-31 Stmicroelectronics S.R.L. Semiconductor device and corresponding method of manufacturing semiconductor devices

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3491885B2 (ja) * 2000-03-21 2004-01-26 三洋電機株式会社 半導体装置

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11214304A (ja) * 1998-01-21 1999-08-06 Murata Mfg Co Ltd 半導体装置およびそれを用いた電子装置
JP2001185679A (ja) * 1999-12-27 2001-07-06 Mitsubishi Electric Corp 半導体スイッチ装置
JP2001284395A (ja) * 2000-03-31 2001-10-12 Sanken Electric Co Ltd 半導体装置
JP2006041098A (ja) * 2004-07-26 2006-02-09 Hitachi Ltd パワーモジュール
JP2008211237A (ja) * 2008-04-18 2008-09-11 Fujitsu Ltd 半導体装置に配設される中継部材及び半導体装置
JP2010027691A (ja) * 2008-07-15 2010-02-04 Mitsubishi Electric Corp 半導体装置
WO2019202687A1 (ja) * 2018-04-18 2019-10-24 三菱電機株式会社 半導体モジュール
JP2020047892A (ja) * 2018-09-21 2020-03-26 トヨタ自動車株式会社 半導体装置
JP2021141219A (ja) * 2020-03-06 2021-09-16 富士電機株式会社 半導体モジュール
JP2021158232A (ja) * 2020-03-27 2021-10-07 富士電機株式会社 半導体モジュール
US20220102258A1 (en) * 2020-09-30 2022-03-31 Stmicroelectronics S.R.L. Semiconductor device and corresponding method of manufacturing semiconductor devices

Also Published As

Publication number Publication date
US20250316657A1 (en) 2025-10-09
DE112022007897T5 (de) 2025-07-24
CN120019492A (zh) 2025-05-16
WO2024079813A1 (ja) 2024-04-18
JP7738773B2 (ja) 2025-09-12

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