JPWO2024079813A5 - - Google Patents

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Publication number
JPWO2024079813A5
JPWO2024079813A5 JP2024550966A JP2024550966A JPWO2024079813A5 JP WO2024079813 A5 JPWO2024079813 A5 JP WO2024079813A5 JP 2024550966 A JP2024550966 A JP 2024550966A JP 2024550966 A JP2024550966 A JP 2024550966A JP WO2024079813 A5 JPWO2024079813 A5 JP WO2024079813A5
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JP
Japan
Prior art keywords
elements
semiconductor
adjacent
wiring
disposed
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JP2024550966A
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English (en)
Japanese (ja)
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JPWO2024079813A1 (https=
JP7738773B2 (ja
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Priority claimed from PCT/JP2022/038032 external-priority patent/WO2024079813A1/ja
Publication of JPWO2024079813A1 publication Critical patent/JPWO2024079813A1/ja
Publication of JPWO2024079813A5 publication Critical patent/JPWO2024079813A5/ja
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Publication of JP7738773B2 publication Critical patent/JP7738773B2/ja
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JP2024550966A 2022-10-12 2022-10-12 半導体装置 Active JP7738773B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/038032 WO2024079813A1 (ja) 2022-10-12 2022-10-12 半導体装置

Publications (3)

Publication Number Publication Date
JPWO2024079813A1 JPWO2024079813A1 (https=) 2024-04-18
JPWO2024079813A5 true JPWO2024079813A5 (https=) 2025-01-07
JP7738773B2 JP7738773B2 (ja) 2025-09-12

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ID=90669206

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024550966A Active JP7738773B2 (ja) 2022-10-12 2022-10-12 半導体装置

Country Status (5)

Country Link
US (1) US20250316657A1 (https=)
JP (1) JP7738773B2 (https=)
CN (1) CN120019492A (https=)
DE (1) DE112022007897T5 (https=)
WO (1) WO2024079813A1 (https=)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11214304A (ja) * 1998-01-21 1999-08-06 Murata Mfg Co Ltd 半導体装置およびそれを用いた電子装置
JP4138192B2 (ja) * 1999-12-27 2008-08-20 三菱電機株式会社 半導体スイッチ装置
JP3491885B2 (ja) * 2000-03-21 2004-01-26 三洋電機株式会社 半導体装置
JP2001284395A (ja) * 2000-03-31 2001-10-12 Sanken Electric Co Ltd 半導体装置
JP4384948B2 (ja) * 2004-07-26 2009-12-16 株式会社日立製作所 パワーモジュール
JP4774075B2 (ja) * 2008-04-18 2011-09-14 富士通セミコンダクター株式会社 半導体装置に配設される中継部材及び半導体装置
JP5206188B2 (ja) * 2008-07-15 2013-06-12 三菱電機株式会社 半導体装置
JP6897869B2 (ja) * 2018-04-18 2021-07-07 三菱電機株式会社 半導体モジュール
JP7077893B2 (ja) * 2018-09-21 2022-05-31 株式会社デンソー 半導体装置
JP7428017B2 (ja) * 2020-03-06 2024-02-06 富士電機株式会社 半導体モジュール
JP7567191B2 (ja) * 2020-03-27 2024-10-16 富士電機株式会社 半導体モジュール
US12040263B2 (en) * 2020-09-30 2024-07-16 Stmicroelectronics S.R.L. Semiconductor device with die mounted to an insulating substrate and corresponding method of manufacturing semiconductor devices

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