JP7729294B2 - ネガ型感光性樹脂組成物及びドライフィルムレジスト - Google Patents

ネガ型感光性樹脂組成物及びドライフィルムレジスト

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Publication number
JP7729294B2
JP7729294B2 JP2022144622A JP2022144622A JP7729294B2 JP 7729294 B2 JP7729294 B2 JP 7729294B2 JP 2022144622 A JP2022144622 A JP 2022144622A JP 2022144622 A JP2022144622 A JP 2022144622A JP 7729294 B2 JP7729294 B2 JP 7729294B2
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JP
Japan
Prior art keywords
film
resin composition
photosensitive resin
resist
derived
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022144622A
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English (en)
Japanese (ja)
Other versions
JP2024039899A (ja
JP2024039899A5 (https=
Inventor
裕仁 長田
武史 伊部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DIC Corp
Original Assignee
DIC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DIC Corp filed Critical DIC Corp
Priority to JP2022144622A priority Critical patent/JP7729294B2/ja
Priority to KR1020230106736A priority patent/KR20240036456A/ko
Priority to TW112134462A priority patent/TW202419496A/zh
Priority to CN202311167780.4A priority patent/CN117687269A/zh
Publication of JP2024039899A publication Critical patent/JP2024039899A/ja
Publication of JP2024039899A5 publication Critical patent/JP2024039899A5/ja
Application granted granted Critical
Publication of JP7729294B2 publication Critical patent/JP7729294B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
JP2022144622A 2022-09-12 2022-09-12 ネガ型感光性樹脂組成物及びドライフィルムレジスト Active JP7729294B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2022144622A JP7729294B2 (ja) 2022-09-12 2022-09-12 ネガ型感光性樹脂組成物及びドライフィルムレジスト
KR1020230106736A KR20240036456A (ko) 2022-09-12 2023-08-16 네거티브형 감광성 수지 조성물 및 드라이 필름 레지스트
TW112134462A TW202419496A (zh) 2022-09-12 2023-09-11 負型感光性樹脂組成物及乾膜光阻
CN202311167780.4A CN117687269A (zh) 2022-09-12 2023-09-12 负型感光性树脂组合物和干膜抗蚀剂

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022144622A JP7729294B2 (ja) 2022-09-12 2022-09-12 ネガ型感光性樹脂組成物及びドライフィルムレジスト

Publications (3)

Publication Number Publication Date
JP2024039899A JP2024039899A (ja) 2024-03-25
JP2024039899A5 JP2024039899A5 (https=) 2024-04-03
JP7729294B2 true JP7729294B2 (ja) 2025-08-26

Family

ID=90132718

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022144622A Active JP7729294B2 (ja) 2022-09-12 2022-09-12 ネガ型感光性樹脂組成物及びドライフィルムレジスト

Country Status (4)

Country Link
JP (1) JP7729294B2 (https=)
KR (1) KR20240036456A (https=)
CN (1) CN117687269A (https=)
TW (1) TW202419496A (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000281762A (ja) 1999-03-12 2000-10-10 Shipley Co Llc 新規フェノール樹脂および当該樹脂を含むフォトレジスト組成物
JP2008138128A (ja) 2006-12-04 2008-06-19 Ube Ind Ltd フォトレジスト用ノボラック型フェノール樹脂およびその製造方法
JP2014227464A (ja) 2013-05-22 2014-12-08 Dic株式会社 ノボラック型フェノール樹脂の製造方法及びフォトレジスト組成物。
WO2021085321A1 (ja) 2019-10-29 2021-05-06 東レ株式会社 樹脂組成物、樹脂シート、硬化膜、硬化膜の製造方法、半導体装置、有機ｅｌ表示装置および表示装置
WO2022070946A1 (ja) 2020-09-29 2022-04-07 東レ株式会社 感光性樹脂組成物、硬化物、及び表示装置、並びに、硬化物の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3391896B2 (ja) * 1994-06-15 2003-03-31 東京応化工業株式会社 耐熱性感光性樹脂組成物
JP6813398B2 (ja) 2017-03-10 2021-01-13 東京応化工業株式会社 感光性組成物、ドライフィルム、及びパターン化された硬化膜を形成する方法
JP6791176B2 (ja) 2018-01-24 2020-11-25 信越化学工業株式会社 ネガ型レジストフィルム積層体及びパターン形成方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000281762A (ja) 1999-03-12 2000-10-10 Shipley Co Llc 新規フェノール樹脂および当該樹脂を含むフォトレジスト組成物
JP2008138128A (ja) 2006-12-04 2008-06-19 Ube Ind Ltd フォトレジスト用ノボラック型フェノール樹脂およびその製造方法
JP2014227464A (ja) 2013-05-22 2014-12-08 Dic株式会社 ノボラック型フェノール樹脂の製造方法及びフォトレジスト組成物。
WO2021085321A1 (ja) 2019-10-29 2021-05-06 東レ株式会社 樹脂組成物、樹脂シート、硬化膜、硬化膜の製造方法、半導体装置、有機ｅｌ表示装置および表示装置
WO2022070946A1 (ja) 2020-09-29 2022-04-07 東レ株式会社 感光性樹脂組成物、硬化物、及び表示装置、並びに、硬化物の製造方法

Also Published As

Publication number Publication date
CN117687269A (zh) 2024-03-12
JP2024039899A (ja) 2024-03-25
KR20240036456A (ko) 2024-03-20
TW202419496A (zh) 2024-05-16

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